ADXL354 – MEMS ICs detect structural defects

ADXL354 – MEMS ICs detect structural defects

Three-axis MEMS accelerometers, Analog Devices’ ADXL354 and ADXL355 perform high-resolution vibration measurement to enable the early detection of structural defects via wireless sensor networks. The low power consumption of the devices lengthens battery life and reduces the time between battery changes. by Susan Nordyk @ edn.com

The analog-output ADXL354 and digital-output ADXL355 offer selectable measurement ranges of ±2 g to ±8 g and low 0-g offset drift. Both accelerometers provide guaranteed temperature stability with null offset coefficients of 0.15 mg/°C maximum. The ADXL354 boasts ultralow noise density (all axes) of 20 µg/√Hz and current consumption of just 150 µA in measurement mode. The ADXL355 has a noise density of 25 µg/√Hz and current consumption of 200 µA in measurement mode. Standby-mode current consumption is just 21 µA for each device.

ADXL354 – MEMS ICs detect structural defects – [Link]

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Mike is the founder and editor of Electronics-Lab.com, an electronics engineering community/news and project sharing platform. He studied Electronics and Physics and enjoys everything that has moving electrons and fun. His interests lying on solar cells, microcontrollers and switchmode power supplies. Feel free to reach him for feedback, random tips or just to say hello :-)

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