ADXL354 – MEMS ICs detect structural defects

ADXL354 – MEMS ICs detect structural defects

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Three-axis MEMS accelerometers, Analog Devices’ ADXL354 and ADXL355 perform high-resolution vibration measurement to enable the early detection of structural defects via wireless sensor networks. The low power consumption of the devices lengthens battery life and reduces the time between battery changes. by Susan Nordyk @ edn.com

The analog-output ADXL354 and digital-output ADXL355 offer selectable measurement ranges of ±2 g to ±8 g and low 0-g offset drift. Both accelerometers provide guaranteed temperature stability with null offset coefficients of 0.15 mg/°C maximum. The ADXL354 boasts ultralow noise density (all axes) of 20 µg/√Hz and current consumption of just 150 µA in measurement mode. The ADXL355 has a noise density of 25 µg/√Hz and current consumption of 200 µA in measurement mode. Standby-mode current consumption is just 21 µA for each device.

ADXL354 – MEMS ICs detect structural defects – [Link]

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accelerometersADXL354ADXL355MEMS
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