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15 Mar 2013


NFC unifies all contactless and wireless standards, thus enabling an unbelievably simple data transfer or for example a WiFi connection establishment. 

Near Field Communication (NFC) technology was developed in order to solve the wireless technologies dilemma, which enable even a substantially higher transfer speed but often for the price of a time consuming setup. It can be said, that NFC solves all cases – transfer of a small and even big amount of data. In the first case – at a transfer of small files or a small data amount, the NFC transfer speed is sufficient (up to 424 kbps) and in the second case – at a transfer of a big amount of data, the NFC enables to for example establish WiFi connection in a moment, without a need for any manual setting.

NFC is based on an existing wireless communication standard – RFID (ISO/IEC 14443 A&B and JIS-X 6319-4). Ability of a duplex communication is ideal for an immediate data transfer or for establishment of connection via other wireless technologies by simplicity of a touch (approximation). For an end user it means a simple connection establishment, fast transactions and a comfortable data sharing. Similarly like RFID, even NFC devices exist as active and passive ones. Active devices are for example smartphones, pay terminals and other devices with their own power supply and a small antenna serving for data transfer, as well as for power supply of passive NFC devices, so called tags. Tags can have a miniature dimensions (similarly like at RFID) and they enable read, write but also an implementation of various applications.

NFC is suitable for example for: – bluetooth connection establishment by a simple touch (approximation) of two Bluetooth devices – connection to a WiFi by a touch of a telephone to a router or to other NFC device (tag) containing access settings – contactless payments – intelligent access systems with a central access rights control – data sharing and transfer (for example printing of a picture on a printer) – wide possibilities in healthcare – loyalty program – transportation – consumer electronics – visit-cards, posters, where various information can be written in an NFC tag

NFC technology is open for a free usage without fees. As the first module supporting NFC in our offer, can be found the  mini Mifare/NFC modul. An extensive documentation and much useful information about NFC can be found at the NFC forum website – http://www.nfc-forum.org/home/. In case of interest in any NFC products, please contact us at info@soselectronic.com.

Will the NFC unify all wireless technologies? - [Link]

8 Feb 2013

How Does Silicon Photonics Work? Marcos Hung writes:

Imagine a world where it takes just one second to download a terabyte of data. Well, thanks to Intel, this possibility might seem nearer than you think.

Years of research in silicon photonics have produced the 50G Silicon Photonics Link. The technology uses a combination of lasers and chips to convert data into light signals, send them up a fiber optic cable, then convert the light signals back into its original data form.

The accuracy is also superb: Intel claims that over 27 hours, one petabyte of data was transferred with zero error.Silicon photonics is the study and application of photonic systems which use silicon as an optical medium. Intel’s Silicon Photonics Link prototype is the world’s first silicon-based optical data connection with integrated lasers.

Silicon Photonics: 1 TeraByte of Data in 1 Second - [Link]

15 Dec 2012


Brian Bailey writes:

Moore’s Law may not be running out of steam, but it may be running out of money, as scaling to smaller geometries becomes more cost prohibitive. We also have an insatiable appetite for memory these days, but our tastes are changing from DRAM to nonvolatile memory—a market largely served by flash devices. Whereas DRAM can possibly scale down to 1 nm, we are already encountering floating-gate scaling problems for NAND flash. The answer to the scaling problem appears to be growing devices “up”; the question is how best to do it.

Three-dimensional die stacking uses a silicon interposer and TSVs (through-silicon vias) to connect the stacked dice electrically, allowing the integration of multiple, smaller dice—each processed using an optimal technology—within a package. Many memory manufacturers are already creating 3-D die-stacked chips in production quantities (Figure 1), and the technology’s use for memories paves the way for its use elsewhere.

More-than-Moore memory grows up - [Link]

4 Dec 2012

“Self-healing” NAND flash memory

Taiwan-based Macronix has found a solution for a weakness in flash memory fadeout. A limitation of flash memory is simply that eventually it cannot be used; the more cells in the memory chips are erased, the less useful to store data. The write-erase cycles degrade insulation; eventually the cell fails. “Flash wears out after being programmed and erased about 10,000 times,” said the IEEE Spectrum. Engineers at Macronix have a solution that moves flash memory over to a new life. They propose a “self-healing” NAND flash memory solution that can survive over 100 million cycles.

“Self-healing” NAND flash memory - [Link]

20 Nov 2012

Tessel Renzenbrink writes:

With everybody constantly on their phones, the emergence of the Internet of Things and augmented reality, ubiquitous computing does not seem all that far-fetched anymore. That being so, the question arises how we will interface with our smart cars, our smart homes and our domestic robots? Will we hunch over tablets to control the sound and lighting systems in the house? Make exaggerated gestures to control our motion-sensing robot? Talk to our smart albeit inanimate car? Or will we take out the middle man and interface with our smart environment directly with our brain.

Carbon Microthread Connects Brain to Machine - [Link]

15 Nov 2012

Brian Bailey writes :

Flash memory has very quickly risen from being an obscure memory type to perhaps becoming the dominant memory type for many devices, including music players, cell phones, tablets and now increasingly servers and mainstream PCs. But flash memory does not scale quite as well as the more traditional DRAM that it is replacing. It is thought that DRAM can scale down to 1nm whereas we are already hitting some problems with the scaling of the floating gate in NAND flash. It is not thought that planar NAND can go below 10nm which is only a couple of processes steps away from where we are today.

3D NAND flash is coming - [Link]

17 Oct 2012

Interesting and info-packed video from Osram on how they make LEDs – [via]

How LEDs are Made - [Link]

5 Oct 2012

Biomedical engineers have created electronic devices that wink out of existence at a predetermined point in time. They’re called transient electronics and are the result of a collaboration of Tufts University, University of Illinois and the Defense Advanced Research Projects Agency (DARPA).

The engineers build tiny electronic systems on ultrathin sheets of silicon of a few tens of nanometers thick. When exposed to liquid like water or bio fluids the device dissolves breaking down in traces of silicon and magnesium. Because of the small amount these components can be harmlessly assimilated by bio systems like the human body. [via]

Transient Electronics Dissolve in Liquid - [Link]

28 Sep 2012

Research laboratory Imec has announced that it has integrated an ultra-thin, flexible chip with bendable and stretchable interconnects into a package that adapts dynamically to curving and bending surfaces. The resulting circuitry can be embedded in medical and lifestyle applications where user comfort and unobtrusiveness is key, such as wearable health monitors or smart clothing.

For the demonstration, the researchers thinned a commercially available microcontroller down to 30µm, preserving the electrical performance and functionality. This die was then embedded in a slim polyimide package (40-50µm thick). Next, this ultrathin chip was integrated with stretchable electrical wiring. These were realized by patterning polyimide-supported meandering horseshoe-shaped wires, a technology developed and optimized at the lab. Last, the package is embedded in an elastomeric substrate, e.g. polydimethylsiloxane (PDMS). In this substrate, the conductors behave as two dimensional springs, enabling greater flexibility while preserving conductivity. [via]

Electronics that Flex and Stretch like Skin - [Link]

21 Sep 2012

In an effort to bring the advantages of relay logic to the modern world of miniaturized devices, research groups in various parts of the world are exploring ways to develop nanoscale mechanical relays that can be used to build process controllers. Although typically slower than semiconductor logic devices, relays have the advantage of very low quiescent power and bidirectional current flow. Nanoscale relays can additionally achieve significantly higher switching rates than their normal-scale cousins. [via]

Relay Logic Goes Nano - [Link]





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