Freeing the Lepton from its Iphone prison!
The smallest thermal imager - [Link]
A look inside Flir’s thermal imaging add-on.
Flir One teardown - [Link]
When you think Raspberry Pi and camera you probably already know the score; a small camera board that plugs into the Pi’s CSI connector fitted with a fixed-focus wide-angle lens. This versatile setup has been the basis of all sorts of homebrew applications. The SnapPiCam takes the Pi down a different route and converts it into a 5 MP digital camera with interchangeable lens.
Gregory L Holloway is the brains behind this idea, he developed it as an entry into an Instructables competition (which he won) and the response he got encouraged him to launch it on Kickstarter. The design uses the lower spec RPi A without an Ethernet port and with 256 MB of RAM. The camera includes a LiPo battery and DC-DC converter to make it truly portable and different versions allow you to add a rear touchscreen and various interchangeable, magnetic-mount lens ranging from wide-angle to telephoto zoom.
SnapPiCam, a DIY Digital Camera - [Link]
Colin Jeffrey @ gizmag.com writes:
In a conventional camera lens, the iris consists of a set of overlapping mechanical blades that control the amount of light entering the camera. As efficient as this mechanical system is, it is too bulky and too difficult to miniaturize to be incorporated in smartphones and other compact devices. To address this, a team of researchers has used “smart glass” to create a micro-sized electronic iris that may bring much greater image quality and flexibility to smartphone cameras.
“Smart glass” iris could bring greater quality and flexibility to smartphone cameras - [Link]
Dave tears down Sony’s first digital camera that used removable media, a 3.5″ floppy drive! The 640×480 resolution 0.3Mpixel 1997 vintage Sony Mavica MVC-FD7
EEVblog #625 – Retro Teardown: Sony’s First Digital Camera - [Link]
Nanoelectronics research center imec and XIMEA, a progressive creator of machine vision systems, today announced their partnership in integrating imec’s Hyperspectral Imaging (HSI) sensors together with XIMEA’s xiQ USB3.0 camera product line. Exceptional interoperability between camera and sensor’s technology streamlined the success of this integration.
“Combining imec’s hyperspectral sensor with XIMEA’s impressively compact xiQ cameras is a new milestone for us. The high-speed USB3.0 interface includes power supply over USB that removes the need for expensive and bulky frame-grabbers and separate power supplies. It will enable our partners to design and mass-produce extremely compact hyperspectral imaging camera solutions,” stated Andy Lambrechts, program manager for imaging & vision systems at imec.
Imec bring smallest hyperspectral imaging camera to market - [Link]
The Cheap-Thermocam is a low-cost thermographic image scanner. With it you can analyse your house, electrical devices, etc. and identify for example thermal lacks.
Current FLIR cameras on the market cost a few thousand dollars.
My idea was to reduce costs by using one single non-contact temperature sensor to create a thermographic image.
A cheap thermographic camera for everyone - [Link]
Ioannis Kedros writes:
Another quick project for today! How all started? A few hours ago I took a delivery box with few high resolution LCD’s on it. The box was made of foam material and was covered with dirty (from the delivery across two continents) yellowish tape.
To begin with, in order to open the box I had to remove half of this tape and by “playing” with the box I manage to remove everything without to damage it! Yes, the tape was strong enough to tear apart everything! The result is the one below
Rescuing a foam box - [Link]
Heptagon Micro Optics Pte. Ltd. (Singapore) has announced that their 2 by 2 3D imaging system for use in smartphones, phablet and tablet computers is now ready for mass production. The TrueD H2 array camera is said to be the first in a series of 3D imaging and depth-sensing cameras that Heptagon will be introducing to the market.
Heptagon’s manufacturing processes enable the system aperture; stray light control and infrared cut filter to be integrated onto a single glass wafer. The assembly can withstand reflow temperatures and its no-focus lens eliminates the need to refocus after assembly. As well as grabbing the image the array camera captures short-range depth information that can be used for gesture and user recognition and allows background removal and image enhancement. Although this feature would typically be useful on a smart device’s front-facing camera, Heptagon state that it could also be used to complement the smart device’s primary high resolution image sensor. Applications include supporting 3D and immersive mobile video games as well as augmented reality overlays. [via]
Heptagon announce 3D Array Camera - [Link]