In a paper published in Nature Communications researchers at IBM describe how they have built a silicon-based receiver chip incorporating GFETs or Graphene Field Effect Transistors (the purple structure in the photo) into the circuit. The multi-stage receiver integrated circuit consists of 3 graphene transistors, 4 inductors, 2 capacitors, and 2 resistors.
“This is the first time that someone has shown graphene devices and circuits to perform modern wireless communication functions comparable to silicon technology,”
said Supratik Guha, Director of Physical Sciences at IBM Research. In a test the team successfully used the graphene-based receiver to process a digital transmission on 4.3GHz. The binary sequence received was 01001001 01000010 01001101, which represents ASCII coding of the letters IBM.
IBM Chip uses Graphene FETs - [Link]
This video shows the detail process of making of a chip at Philips Factory.
Chip Manufacturing Process – Philips Factory - [Link]
The LTC4120 from Linear Technology is an all-in-one receiver chip for wirelessly charging battery-powered devices. It measures 3 x 3 mm and requires a pick-up coil at its input and a rechargeable battery at its output. A voltage is induced in the coil when it is in close proximity to the transmitter coil of a separate charging unit.
As well as the convenience of just placing your cell phone on a charging pad, this method is also ideal for hand-held devices that can’t use a conventional plug-in charger for reasons of hygiene or harsh/volatile atmospheres.
The battery charging functions allow for both constant current and constant voltage modes and a programmable float voltage level between 3.5 and 11 V accommodates a wide range of cell chemistries. An external resistor sets the charge current up to a maximum of 400 mA. It senses cell voltage and can initiate a low-voltage preconditioning phase if necessary. [via]
LTC4120 – Novel Contactless Battery Charger Chip - [Link]
A look at some equipment and wafers used in the manufacture of silicon chip wafers. 200mm and 300mm wafers, die, dice sawing, lead-frame manufacture, automated testing machine (ATE) probing, clean room bunnie suits, photo plots, BGA chip thermal test sockets, and the worlds smallest active FET probes at 100 nanometers for direct wafer probing!
EEVblog #532 – Silicon Chip Wafer Fab Mailbag - [Link]
Here’s an amazing new DNA testing chip by Panasonic together with the Belgium-based research institution IMEC. It delivers DNA results within an hour:
This is the chip we’ve actually developed. As you can see, it’s less than half the size of a business card. It contains everything needed for testing DNA. Once a drop of blood is inserted, the chip completes the entire process, up to SNP detection.
New chip delivers DNA results within an hour - [Link]
Imec demonstrated a low-power (20µW), intra-cardiac signal processing chip for the detection of ventricular fibrillation at this week’s International Solid State Circuits Conference (ISSCC 2013) in San Francisco with Olympus. An important step toward next-generation Cardiac Resynchronization Therapy solutions, the new chip delivers innovative signal processing functionalities and consumes only 20µW when all channels are active, enabling the miniaturization of implantable devices. [via]
Robust and accurate heart rate monitoring of the right and left ventricles and the right atrium is essential for implantable devices used in cardiac resynchronization therapy, and accurate motion sensor and thoracic impedance measurements to analyze intrathoracic fluid are critical for improving clinical research and analysis of intracardiac rhythm. Extremely low power consumption is also necessary to reduce the size of cardiac implants and improve the patient’s quality of life.
Carry a Chip in your Heart - [Link]
Researchers at Rice University (USA) have developed a micron-scale spatial light modulator (SLM) similar to those currently used in sensing and imaging devices, but with the potential to run several orders of magnitude faster. Their ‘antenna on a chip’ operates in 3D ‘free space’ instead of the two-dimensional space of conventional semiconductor devices.
A device that looks like a tiny washboard may clean the clocks of current commercial products used to manipulate infrared light.
New research by the Rice University lab of Qianfan Xu has produced a micron-scale spatial light modulator (SLM) like those used in sensing and imaging devices, but with the potential to run orders of magnitude faster. Unlike other devices in two-dimensional semiconducting chips, the Rice chips work in three-dimensional “free space.”
In current optical computing devices, light is confined to two-dimensional circuitry and travels in waveguides from point to point. According to the researchers, 2D systems ignore the massive multiplexing capability of optical systems arising from the fact that multiple light beams can propagate in the same space without affecting each other. [via]
“Antenna on Chip” Manipulates Light at Warp Speed - [Link]
Research laboratory Imec has announced that it has integrated an ultra-thin, flexible chip with bendable and stretchable interconnects into a package that adapts dynamically to curving and bending surfaces. The resulting circuitry can be embedded in medical and lifestyle applications where user comfort and unobtrusiveness is key, such as wearable health monitors or smart clothing.
For the demonstration, the researchers thinned a commercially available microcontroller down to 30µm, preserving the electrical performance and functionality. This die was then embedded in a slim polyimide package (40-50µm thick). Next, this ultrathin chip was integrated with stretchable electrical wiring. These were realized by patterning polyimide-supported meandering horseshoe-shaped wires, a technology developed and optimized at the lab. Last, the package is embedded in an elastomeric substrate, e.g. polydimethylsiloxane (PDMS). In this substrate, the conductors behave as two dimensional springs, enabling greater flexibility while preserving conductivity. [via]
Electronics that Flex and Stretch like Skin - [Link]
FTDI just released a new series of their USB to serial device ICs. The X-series is an upgrade on the R part used in the Bus Pirate and formerly in Arduinos. It features better transfer rates, lower power consumption, needs fewer discrete components, and has high power USB charging capability. [via]
FTDI is delighted to announce the launch of its new X-Chip series. Made up of 13 devices, with an exception feature set, the X-Chip series offers full speed USB 2.0 bridging solutions to UART, SPI/FT1248, I2C and FIFO interfaces complementing the company’s existing R chip, and Hi-Speed solutions. “By specifying the X-Chip into their designs, engineers will reduce their overall bill of materials and optimise PCB real estate,” states Fred Dart, CEO and founder of FTDI. “With its comprehensive feature set, the benefits of lower power, smaller device footprint and NEW enhanced battery charger detection can all be realised, as well as the robust USB functionality that FTDI has always provided in its connectivity solutions”. In addition to the ICs, FTDI has released a wide-selection of development modules, enabling instant access to the different functions for each chip type, and thus allowing for easy device evaluation and prototyping development.
FTDI’s new X-Series of USB device chips - [Link]