Blog
28 Jan 2011
Solder pads in IC packages could soon be made obsolete by a new nanotape material developed by researchers at the Semiconductor Research Corporation (SRC) and Stanford University. Using a sandwich of thermally conductive carbon nanotubes between thin metal foils, the nanotape transfers heat away from chips better than solder, and according to the researchers it is a lightweight, flexible material that is cheaper and more compliant. [via]
Nanotape may oust solder pads – [Link]
