SystemView PRO – Analyze your Firmware Behavior Like a PRO

Segger Microcontroller is known for J-Links device about debugging and programming lots of architectures: ARM, Microchip PIC32 and Renesas RX. Segger provides a lot of other software and hardware tools for debugging and programming purposes; SystemView is one of these tools.

SystemView gives a complete insight of what is going inside the MCU graphically and in real time. All recorded data is fetched using J-link adapter with no extra hardware or extra pins. SystemView app requires small software module (< 2 KB) to be included in the device.

SystemView app GUI

The SystemView module collects the data and passes it to Real Time Transfer (RTT). The RTT module stores the data in the device buffer, which enables continuous recording. SystemView has the ability of analyzing which interrupts, tasks and software timers executed, how many times and when.

Segger announced a new PRO version for SystemView; with unlimited recording and creating custom filters for event, SystemView PRO extends the normal version. However, the free version “SystemView” is limited up to 1 million event recording and analyzing. Last but not least, buying the PRO version costs about 1,200 USD. Another option, is that you can purchase a J-Link and it will be shipped with a SEGGER SystemView PRO license (seems more economical option) .

Source: electropages

SHA2017 Badge — A Hackable Conference Badge with E-paper Display

The hackable electronic conference badges are more and more being adapted in technical conferences and especially those for hackers and makers. These badges can be reprogrammed easily and could be used later as a development board.

It’s not the first time to hear about a hackable badge; for example, Parallax has an open source one with lots of features like: exchanging contact information over infrared, accelerometer, A/V jack and more. The badge can be programmed via USB using Propeller’s Spin (Propeller Tool or Propeller IDE) or C (Simple IDE) languages.

Parallax’s Hackable Electronic Badge — Image Courtesy of Parallax

New designs for badges show up from time to time. The team behind SHA2017 (a non profit outdoor Hacker camp taking place in The Netherlands in 2017 on August 4th to 8th) had developed their own badge.

SHA2017’s Badge — Image Courtesy of SHA2017

The new badge’s features:

  • E-ink9″ display.
  • Espressif ESP32 Wroom WiFi Module.
  • MPR121 Touch Sensor and GPIO expander.
  • TP4056 battery charger.
  • SD Card.
  • USB-UART bridge (converter).
  • ×6 RGB LEDs.

The team’s goal behind SHA2017 consists of two parts: “augment the event”, like reading the lecture subtitles live around your neck; and ”be a development platform” where you can find all the needed parts to write your own application using MicroPython.

EAGLE files and firmware can be found on Github.

Source: CNXSoft

MCUXpresso IDE: Blinky the NXP LPC800-DIP Board

Erich Styger @ mcuoneclipse.com has a series of tutorials using the new NXP MCUXpresso IDE. He writes:

During Embedded World 2017 in Nürnberg I was lucky to get a handful LPC800-DIP boards. To get all students who were lucky to get one, here is a tutorial to make that very exciting ‘blinky’ application on that board:

MCUXpresso IDE: Blinky the NXP LPC800-DIP Board – [Link]

Self-learning neuromorphic chip composes music

Peter Clarke @  eedesignnewseurope.com reporting:

Research institute IMEC has created a neuromorphic chip based on metal-oxide ReRAM technology that has the ability to self-learn. That self-learning has been applied to music making.

Self-learning neuromorphic chip composes music – [Link]

ABC: Basic Connections – The Essential Book for Makers

A collection of neat circuit diagrams that shows you how to properly connect almost anything to your Arduino compatible board. Live on kickstarter.

A DC Motor Controller with Control Leds

Boris Landoni writes about a new open source project a DC motor controller with control LEDs:

The circuit board we are presenting this time is based on the dual-bridge driver L298N, in a traditionally mounted version in a Multiwatt container with 15 staggered pins; it has two terminal blocks for attaching to DC motors or the coils of a bipolar stepper motor and a terminal block for powering logics and motors. Each of the two output channels of the circuit can provide a maximum current of 2 A, which is enough to drive two 2 A direct current motors or a bipolar stepper motor absorbing 2 A per phase.

A DC Motor Controller with Control Leds – [Link]

Adjustable constant current source

Dilshan Jayakody has published a new build:

The current source introduced in this article is capable to handle current up to 6A with maximum input voltage of 50V. This is an operational amplifier based adjustable current source and it uses LM358 in a general voltage follower configuration. To handle large currents we use four 0.1Ω 20W resistors as “load resistor”, and those load resistors are drive through pair of 55N06 N-channel MOSFET transistors.
The power supply unit of this project is build around 9V x 2 (2A) step-down transformer and it is design to get regulated 12V DC voltage. In our design this 12V power source is used to drive LM358 Op-Amp and 12V cooling fan.

Adjustable constant current source – [Link]

Easy IoT Weather Station With Multiple Sensors

Ingenerare @ instructables.com show us an easy to build IoT weather station able to measure temperature, dew point, humidity, pressure, light index, and rain. He writes:

A weather station is a fun project that teaches you a ton about electronics with the added benefit being an actually useful little device. The project requires a bunch of cheap parts and sensors totaling less than $15, and the whole thing ends up fitting in your hand. The station creates a web site that monitors temperature, dew point, humidity, pressure, light index, and rain (Thingspeak channel). It’s a pretty easy set up, and you’ll just need some basic electronics skills to get it going.

Easy IoT Weather Station With Multiple Sensors – [Link]

LTC7820 – Fixed Ratio High Power Inductorless (Charge Pump) DC/DC Controller

The LTC7820 is a fixed ratio high voltage high power switched capacitor/charge pump controller. The device includes four N-channel MOSFET gate drivers to drive external power MOSFETs in voltage divider, doubler or inverter configurations. The device achieves a 2:1 stepdown ratio from an input voltage as high as 72V, a 1:2 step-up ratio from an input voltage as high as 36V, or a 1:1 inverting ratio from an input voltage up to 36V. Each power MOSFET is switched with 50% duty cycle at a constant pre-programmed switching frequency. System efficiency can be optimized to over 99%. The LTC7820 provides a small and cost effective solution for high power, non-isolated intermediate bus applications with fault protection.

LTC7820 – Fixed Ratio High Power Inductorless (Charge Pump) DC/DC Controller – [Link]

SK Hynix Introduces Industry’s Highest 72-Layer 3D NAND Flash

SK Hynix Incorporated introduced the world’s first 72-Layer 256Gb (Gigabit) 3D (Three-Dimensional) NAND Flash based on its TLC (Triple-Level Cell) arrays and own technologies. This company also launched 6-Layer 128Gb 3D NAND chips in April 2016 and has been mass producing 48-Layer 256Gb 3D NAND chips since November 2016. Within 5 months the researchers in SK Hynix developed the new technology of producing 72-layer 3D NAND flash.

3D NAND flash 72 layers
72 layers 3D NAND flash

The technological achievement of this 72-Layer 3D NAND is compared to the difficulty of building approximately 4 billion 72-storied skyscrapers on a single dime. Well, now the question maybe, “Is the difficulty and complexity of this new technology giving any remarkable outcome?”. The answer is a big YES. The 72-layer NAND is said to stack 1.5 times more cells than the 48-layer, achieving 30% more efficiency in productivity and 20% higher read/write performance than a 48-layer 3D NAND chip, the predecessor of this 72-layer .D 256Gb NAND flash.

With this new chips having 30% more efficiency in productivity and 20% higher performance, SK Hynix has been currently developing NAND Flash solutions such as SSD (Solid State Drive) and storage for mobile devices such as smartphones. Having high reliability and low power consumption this 3D NAND flash should be an ideal solution for storage problems of mobile devices.

SK Hynix plans to expand the usage of the product to SSDs and mobile gadgets to further improve its business structure weighted towards DRAM. The vice president Jong Ho Kim said in the press release,

With the introduction of this industry’s highest productivity 3D NAND, SK Hynix will mass produce the 256Gb 3D NAND in the second half of this year to provide this to worldwide business clients for optimum use in storage solutions

According to a market research, 3D NAND flash demand is rapidly increasing across AI(Artificial Intelligence), big data, and cloud storage. The research by Gartner says that NAND Flash market revenue is expected to total USD 46.5 billion in this year and it will grow up to an amount of USD 56.5 billion in 2021.