Researchers Claim 44x Power Cuts

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by R. Colin Johnson @ eetimes.com:

PORTLAND, Ore.– Researchers sponsored by the Semiconductor Research Corp. (SRC, Research Triangle Park, N.C.) claim they have extended Moore’s Law by finding a way to cut serial link power by as much as 80 percent. The innovation at the University of Illinois (Urbana) is a new on/off transceiver to be used on chips, between chips, between boards and between servers at data centers.

The team estimates the technique can reduce power up to whopping 44 times for communications, extending Moore’s Law by increasing computational capacity without increasing power. “While this technique isn’t designed to push processors to go faster, it does, in the context of a datacenter, allow for power saved in the link budget to be used elsewhere,” David Yeh, SRC director of Integrated Circuits and Systems Sciences told EETimes.

Researchers Claim 44x Power Cuts – [Link]

3D flash technology moves forward with 10 TB SSDs and the first 48-layer memory cells

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by Dario Borghino @ gizmag.com:

Flash storage technology will soon see a three-fold improvement in data density thanks to a joint development at Intel and Micron that will allow the production of 3.5 TB flash sticks and 10 TB standard-sized SSDs. Meanwhile, a new 48-layer cell technology development by Toshiba could pave the way for higher write speeds, more reliability and lower costs in solid state drives.

3D flash technology moves forward with 10 TB SSDs and the first 48-layer memory cells – [Link]

New chip could turn phone cameras into high-res 3D scanners

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by Richard Moss @ gizmag.com:

As if smartphones can’t already do enough, soon they may be able to scan three-dimensional objects and send the resultant high-resolution 3D images to a 3D printer that produces hyper-accurate replicas. This comes thanks to a small and inexpensive device called a nanophotonic coherent imager (NCI), which was developed by scientists at Caltech. The NCI could add 3D imaging to a variety of other devices and applications such as improving motion sensitivity in human machine interfaces and driverless cars.

New chip could turn phone cameras into high-res 3D scanners – [Link]

Build Your Own Smartphone using Raspberry Pi

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by Mach_5 @ instructables.com:

This tutorial brings you from start to finish in constructing your very own smartphone. You will start by 3D printing a case, then soldering printed circuit boards together, assembly, and finally installing a mobile OS onto your phone and using Python to make it yours. You can learn more about this project at hackaday.io/project/5083

Build Your Own Smartphone using Raspberry Pi – [Link]

RELATED POSTS

Complete DIY Raspberry Pi Weather Station with Software

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by kkingsbury @ instructables.com:

Back in late February I saw this post on the Raspberry Pi site.

http://www.raspberrypi.org/school-weather-station-project/

They had created Raspberry Pi Weather Stations for Schools. I totally wanted one! But at that time (and I believe still as of writing this) they are not publicly available (you need to be in a select group of testers). Well, I wanted on and I didn’t feel like shelling out hundreds of dollars for an existing 3rd party system.

So, like a good Instructable user, I decided to make my own!!!

Complete DIY Raspberry Pi Weather Station with Software – [Link]

They act only ones – right then, when it´s really necessary

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With thermal fuses you´ll make a big step towards a higher safety of your device.

It´s surely not necessary to remind that any device can fail. Failure of a component, overload of a component (underestimated sizing), external influence and many other reasons are daily causing failures of devices. If the result of a malfunction is only an intermediate shutdown, it´s let´s say a better case. But if a device malfunction could cause further damage or even fire, it´s surely worth to make everything possible to prevent it.

A typical component used as a complementary – independent protection from overheating is a thermal fuse. It is a cheap but very useful component, which opens (disconnects) a circuit after exceeding certain temperature. It is a “one shot” component, i.e. after its activation it remains open and the fused circuit is disconnected (the fuse must be exchanged). It´s suitable to choose such fusing temperature of the fuse, as we consider to be really faulty, which otherwise can´t occur in an ordinary operation. Production processes enable to produce thermal fuses in a wide range of temperatures and so fuses Microtemp from company Thermodisc, which we keep in stock, are available in a range of 72-257°C (opening temperature). It´s a really wide range enabling to use a fuse for example for fusing of other component (for example a thermal fuse thermally joined with a transistor heatsink) but also for guarding an air temperature inside a device. These fuses operate on a principle of melting a small plastic pellet inside a fuse, what will cause release of a spring and a consequent disconnection of contacts.

A substantial advantage of thermal fuses Thermodisc is a maximum current up to 10-25A/250VAC depending on a type. On stock we keep the G4 series with a max. current of 10A/250VAC. Small dimensions enable to use a component similarly like any ordinary component. It´s only necessary to be careful at assembling (overheating) especially at low-temperature types.
Details regarding a correct assembly as well as an overview and tips for a correct use of thermal fuses can be find in the Thermodisc application guide. Teplotné poistky sú dostupné aj v iných púzdrach, prípadne aj s nožovými kontaktmi (Fast-on). Thermal fuses are also available in other packages, or also with tabs (Fast-in). Finally, we can mention, that to reach the highest protection level in critical application, it´s ideal to incorporate several types with a slightly different fusing temperature in series.


They act only ones – right then, when it´s really necessary – [Link]

DAN64 – an AVR based 8-bit microcomputer

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by Juan J. Martínez:

This is my first serious attempt to learn electronics. DAN64 is my first project and it has been a discovery process during 3 months of my free time. I had to learn a lot of things I didn’t know much about, from basic electronics to the details of the AVRs -and specifically the ATmega328-, and a whole world of things in between such as signalling, protocols, interfaces, modulation and demodulation, SDKs, EDA software, prototyping, PCB fabrication, etc.

I’m certain that in this project I’m doing many stupid things and I’m sure my approach to solving some of the problems is not the best, but in my discharge I can only say: it works! (to some extent at least).

I got lots of gotcha! moments, ups and downs where I though I couldn’t finish the project because perhaps what I was trying to achieve was just impossible.

So this is not about perfection but about good enough for me and about the learning process and having fun.

DAN64 – an AVR based 8-bit microcomputer – [Link]

TEXAS online Classes

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by elektor.com:

Texas Instruments has launched what they claim is the first comprehensive online classroom for analog design engineers. The teaching resource is called TI Precision Labs. The on-demand curriculum combines theory and applied lab exercises to deepen the technical expertise of experienced engineers and accelerate the development of those just starting out in design and development. This free modular curriculum includes over 30 hands-on training and lab videos, covering analog amplifier design considerations along with online course work.

To accompany the course TI is also marketing a $199 op-amp development board called the TI-PLABS-AMP-EVM. It contains eight common op amp circuits that can be configured with jumpers and allows the user to complete each demonstrated learning activity along with the trainer. The curriculum also provides access to free design tools, such as TI Designs reference designs and TI’s TINA-TI SPICE model simulator. The documentation shows configuration examples of the EVM using the National Instruments VirtualBench and TI’s Bode Analyzer Software for VirtualBench. Standard bench-top test and measurement equipment can also be used.

TEXAS online Classes – [Link]

Do you also use industrial Ethernet?

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Industrial Ethernet enables interconnection among standard office network and industrial environment thus becoming a standard for industrial production.

In presence, Ethernet is most widely spread communication technology in the world. It enables a fast data exchange between all devices connected in the local network.
Thanks to its simplicity, Ethernet standards became the most frequently used network standards. A reason of this popularity is, that they offer a simple technology connected with the biggest network – internet. Advantages of Ethernet and all related concepts are obvious:

  • simple possibility of expansion
  • fast initialization thanks to its connection technology
  • dynamic adjustment of bandwidth (up to 10 Gbit/s)
  • identical network topology for various applications (office and industrial)

Classic system of buses 
Industry and production segment is characteristic by using of buses like: AS-Interface, Profibus, Device-NET and CANopen. They allow to connect a line of sensors, actuators, measuring probes and motors, which can be controlled by a controlling unit. Communication runs down to a level of sensors / actuators. Transfer speeds are up to 12 Mbit / with max. 255 devices depending on a given bus system. Linear displacement with al devices connected in series is dominant.

New possibilities thanks to industrial Ethernet
Industrial Ethernet representsattractive alternative of a classic bus syste. Industrial Ethernet Advantages represented by (producer-independent) are still more used in everyday praxis. Industrial Ethernet brings advantages of “usual” Ethernet into often harsh environment (reliable connectivity, availability and easy expansion). Cables of company Lapp Kabel belong to a top in this segment. We bring you a basic overview of the most frequently used components.


Do you also use industrial Ethernet? – [Link]

KCS TraceME expands Internet of Things era by integrating LoRa™

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by elektor.com:

KCS BV, based in Dordrecht (NL) has extended their successful TraceME product line with an advanced module, targeted for worldwide mobility in the Internet of Things era.

The latest development of the TraceME GPS/GPRS Track and Trace module will combine the RF location based positioning solution with the LoRa™ technology. This combination offers ‘smart objects’ being even smarter, since LoRa™ enables long range, battery friendly communication in a wide variety of (M2M) applications.

Supporting GPRS/SMS and optional 3G, Wi-Fi, Bluetooth LE, ANT/ANT+ and iBeacon™ provides easy integration with existing wireless networks and mobile apps. The module will be available in Q2/2015 and other variants in the high/mid-range and budget-line will follow shortly after.

KCS TraceME expands Internet of Things era by integrating LoRa™ – [Link]