Science category

Long-fibre carbon nanotubes shown to be carcinogenic

by Thomas Scherer @ writes:

Nanotechnology plays an indispensable role in modern materials research and new products. Carbon nanotubes (CNTs) enable production of novel materials with amazing properties. Progress is however not without risk and a recent study on mice has shown that certain types of CNTs have similar carcinogenic properties as asbestos fibers.

Long-fibre carbon nanotubes shown to be carcinogenic – [Link]

Build the World’s Smallest Atomic Clock

Illustration: Emily Cooper

Build the World’s Smallest Atomic Clock, Trap a Nitrogen Atom in a Carbon Cage. By Kyriakos Porfyrakis and Edward A. Laird @

An atomic clock begins with an oscillator [see diagram], which creates a frequency close to the energy level of the atom being used. If the oscillator deviates from the reference frequency, the atom’s absorption pattern changes, the change is detected by a laser, and the laser’s signal is used as feedback to tune the oscillator. For the very best performance, the atoms must be electromagnetically isolated, which requires equipment that can take up entire rooms.

Build the World’s Smallest Atomic Clock – [Link]

sKan – Low cost and non-invasive melanoma detection device

A team of medical and bioengineering undergraduates from McMaster University, Canada have designed a cancer detection device able to detect melanoma. Their design solution, the sKan, is a low cost and non-invasive detection device.

Annually, skin cancer accounts for 1 in every 3 cancer diagnoses1. The estimated 5-year survival rate for patients whose melanoma is detected early is approximately 98 percent2. Current melanoma detection methods either rely on a visual inspection, or need a specialist’s opinion which is time consuming and costly. With high numbers of patients needing a rapid diagnosis to begin treatment, the health services are at maximum capacity. The sKan poses a viable solution.

ICECool – An Intra-Chip Cooling System That Is More Efficient

In the Moore’s Law race to keep improving computer performance, the IT industry has turned upward, stacking chips like nano-sized 3D skyscrapers. But those stacks have their limits, due to overheating. Researchers from IBM have solved this problem by developing an intra-chip cooling system as a contribution to ICECool program research project by the DARPA (Defense Advanced Research Projects Agency).

ICECool - intra-chip cooling system by IBM
ICECool – intra-chip cooling system by IBM

Today, chips are typically cooled by fans which blow air through heatsinks that sit on top of the chips to carry away excess heat. Advanced water-cooling approaches, which are more effective than air-cooling approaches, replace the heatsink with a cold plate that is fixed on the top of the chip.  But this approach requires extra protection and proper insulation of the chip because of the electrical conductivity of water. Neither of these technologies can cool down the chip much efficiently. Here comes the ICECool that cools the chip down from the inside rather than just from the upper surface.

ICECool uses a nonconductive fluid to bring the fluid into the chip. This completely eliminates the need for a barrier between the chip and fluid. It not only delivers a lower device junction temperature, but also reduces system size, weight, and power consumption significantly. The tests performed on the IBM Power 7+ chips demonstrated junction temperature reduction by 25ᵒ C, and chip power usage reduction by 7 percent compared to traditional air cooling. This is clearly a great achievement when the operating cost is much smaller than the conventional cooling technologies.

IBM’s ICECool intra-chip cooling system solves the problem of cooling the 3D “skyscraper” chips by pumping a heat-extracting dielectric fluid right into microscopic gaps, some no thicker than a single strand of hair, between the chips at any level of the stack. Being nonconducting, the dielectric fluid used in ICECool can come into contact with electrical connections without causing any short circuit, so is not limited to one part of a chip or stack. Based on the tests with IBM Power Systems, ICECool technology could reduce the cooling energy for a traditional air-cooled data center by more than 90 percent.

A New Soundproof Air-Transparent Window

Imagine you have a window that isolates noises and passes only nature sounds like sea waves in addition to fresh air. Seems like it will happen in dreams only, right? Actually, researchers from South Korea, bring this window from dreams to the real.

Soundproofing is difficult and expensive, it usually relies on transferring sound into a medium which absorbs and attenuates it. But this also will stop the airflow. Sang-Hoon Kima and Seong-Hyun Lee have successfully build a new window that allows airflow to pass without sound and noises.

The new design is simple and depends on two acoustic conditions, strong diffraction and negative bulk modulus.

Strong Diffraction

At first, this method makes the sound waves diffused into a customized resonator called diffraction resonator. This resonator maximizes the diffraction impact with its air hole in the center of the body. In addition, the diameter of the hole will control the range of frequencies to restrict. Only waves with a wavelength smaller than the diameter can pass through the hole.

Artificial atoms of diffraction resonators. Diameters of the air holes: 20mm for (a1), (a2), and (a3), and 50mm for (b1), (b2), and (b3). There are three structures: one room for (a1) and (b1), two rooms for (a2) and (b2), and four rooms for (a3) and (b3).

Negative Bulk Modulus

A material’s bulk modulus means its resistance to compression. It is also an important factor in determining the speed at which sound moves through it. So, a material with a negative bulk modulus exponentially attenuates any sound passing through it.

While it is hard to find a solid material having a negative bulk modulus, Kima and Lee have designed a new sound resonance chamber. This chamber consists of two parallel transparent acrylic plastic plates. The efficiency of the double-glazed window is measured by getting the sound into the chamber. To maximize the efficiency, they drilled a hole through each plate. This double-glazing window has also used as a building block to make windows in larger sizes.

Designs of the medium-sound separator. 20mm (left) and 50mm (right). It is composed of the three kinds of artificial atoms which are connected in series and parallel.

There are several applications of this windows, changing the size of the holes makes the windows tunable for certain frequencies. To know more about this research review this paper.

Researchers Developed Low Cost Battery From Graphite Waste

Lithium-ion batteries are flammable and the price of the raw material is increasing. Scientists and engineers have been trying to find out a safe yet efficient alternative to the Lithium-ion technology. The researchers of Empa and ETH Zürich have discovered promising approaches as to how we might produce powerful batteries out of waste graphite and scrap metal.

Kostiantyn Kravchyk and Maksym Kovalenko, the two chief researchers of the Empa’s Laboratory for Thin Films and Photovoltaics, led the research group. Their ambitious goal is to make a battery out of the most common elements in the Earth’s crust – such as graphite or aluminum. These metals offer a high degree of safety, even if the anode is made of pure metal. This also enables the assembly of the batteries in a very simple and inexpensive way.

In typical lithium-ion battery design, the negative electrode or anode is made from graphite. This new design, however, uses graphite as the positive electrode or cathode. In order to make such batteries run, the liquid electrolyte needs to consist of special ions that form a kind of melt and do not crystallize at room temperature. The metal ions move back and forth between the cathode and the anode in this “cold melt”, encased in a thick covering of chloride ions.

Alternatively, large but lightweight and metal-free organic anions could be used. But, this raises some questions which cannot be solved easily – where are these “large” ions supposed to go when the battery is charged? What could be a suited cathode material? In comparison, the cathode of the lithium-ion battery is made of a metal oxide which can easily absorb the small lithium cations during charging. This does not work for such large organic ions.

To solve the problem, Kovalenko’s team came up with a unique and tricky solution: the researchers turned the principle of the lithium-ion battery upside down. In Kovalenko’s battery, the graphite is used as a cathode; i.e., the positive pole. The thick anions are deposited in the intermediate spaces in the graphite. While searching for the “right” graphite, they found that waste graphite produced in steel production (known as kish graphite) works the best as a cathode material. Natural graphite is suitable when it is in the form of coarse flakes and not too finely ground.

Thin, flexible cooling device

Researchers Developed New Efficient, Thin, and Flexible Cooling Device

Engineers and scientists from the UCLA Henry Samueli School of Engineering and Applied Science and SRI International, California, have created a thin flexible device that could keep smartphones and laptop computers cool and prevent overheating. The component is based on the electrocaloric effect – a phenomenon where the temperature of material changes when an electric field is applied to it. The research has been published in Science.

Thin, flexible cooling device
Thin, flexible cooling device

The system’s flexibility also allows it to be used in wearable electronics, robotic systems, and new types of personalized cooling systems. It is the first demonstration of a solid-state cooling device based on the electrocaloric effect. The method devised by UCLA and SRI researchers is very energy-efficient. It uses a thin polymer film that transfers heat from the heat source – a battery or a processor – to a heat sink, and alternates contact between the two by switching on and off the electric voltage.

Because the polymer film is very flexible, the system can be used in devices with complex shapes or moving surfaces. Body tracking wearable devices can easily accommodate this flexible cooling device. Such cooling pad could keep a person comfortable in a hot office and thus lower the electricity consumption for air conditioning. Or it could be placed in a shoe to keep a runner comfortable while running in the sun. It’s like a personal air conditioner.

The tendency of flexible electronics to overheat remains a major challenge for engineers. The cooling systems in larger devices like air conditioners and refrigerators, which use vapor compression, are just too large for mobile electronics. The new cooling device produces a specific cooling power of 2.8 watts per gram and a COP of 13. This is more efficient and compact than the existing surface-mountable solid-state cooling technologies, opening a path to using the technology for a variety of practical applications.

Roy Kornbluh, an SRI research engineer, said,

The development of practical efficient cooling systems that do not use chemical coolants that are potent greenhouse gases is becoming even more important as developing nations increase their use of air conditioning.

loihi - Intel's self-learning chip

Intel Introduces Loihi – A Self Learning Processor That Mimics Brain Functions

Intel has developed a first-of-its-kind self-learning neuromorphic chip – codenamed Loihi. It mimics the animal brain functions by learning to operate based on various modes of feedback from the environment. Unlike convolutional neural network (CNN) and other deep learning processors, Intel’s Loihi uses an asynchronous spiking model to mimic neuron and synapse behavior in a much closer analog to animal brain behavior.

loihi - Intel's self-learning chip
Loihi – Intel’s self-learning chip

Machine learning models based on CNN use large training sets to set up recognition of objects and events. This extremely energy-efficient chip, which uses the data to learn and make inferences, gets smarter over time and does not need to be trained in the traditional way. The Loihi chip includes digital circuits that mimic the brain’s basic mechanics, making machine learning faster and more efficient while requiring much lower computing power.

The chip offers highly flexible on-chip learning and combines training and inference on a single chip. This allows machines to be autonomous and to adapt in real time instead of waiting for the next update from the cloud. Compared to convolutional neural networks and deep learning neural networks, the Loihi test chip uses many fewer resources on the same task. Researchers have demonstrated learning at a rate that is a 1 million times improvement compared with other typical neural network devices.

The self-learning capabilities prototyped by this test chip have huge potential to improve automotive and industrial applications as well as personal robotics – any application that would benefit from the autonomous operation and continuous learning in an unstructured environment. For example, recognizing the movement of a car or bike for an autonomous vehicle. More importantly, it is up to 1,000 times more energy-efficient than general purpose computing.


  • Fully asynchronous neuromorphic many core mesh.
  • Each neuron capable of communicating with thousands of other neurons.
  • Each neuromorphic core includes a learning engine that can be programmed to adapt network parameters during operation.
  • Fabrication on Intel’s 14 nm process technology.
  • A total of 130,000 neurons and 130 million synapses.
  • Development and testing of several algorithms with high algorithmic efficiency for problems including path planning, constraint satisfaction, sparse coding, dictionary learning, and dynamic pattern learning and adaptation.


Terahertz Electronics – Way To Bridge The largely-untapped Region Between 100GHz and 10THz

The terahertz (THz) region, which is based on 1THz frequency, separates electronics from photonics and has been difficult to access for ages. Semiconductor electronics cannot handle frequencies equal to or greater than 100GHz due to various transport-time related limitations. In other hand, photonics devices fail to work below 10THz as photon’s energy significantly drops to thermal energy. Terahertz Electronics (TE) is a new technology that extends the range of electronics into the THz-frequency region.

The Terahertz Gap
The Terahertz Gap

The main goal of Terahertz Electronics is to build a bridge between low-frequency “Electronics” and high-frequency “Photonics”. Since these devices use photon-electron particle interactions, as photon energy “hv” decreases below thermal energy “kT”, the device ceases to operate efficiently unless it is cooled down. At the low-frequency end, electronics cannot operate above 100GHz as transport time is dependent on drift and diffusion speeds of electrons/holes. As a result, a large region between 100GHz and 10THz remained inaccessible. Terahertz Electronics solves this problem efficiently by cleverly incorporating electronics with photonics.

Terahertz electronics technology offers practical applications in high-speed data transfer, THz imaging, and highly-integrated radar and communication systems. Surprisingly enough, It does not use semiconductors. Instead, it is based on metal-insulator tunneling structures to form diodes for detectors and ultra-high-speed transistors for oscillator based transmitters.

One drawback of the Terahertz Electronics is, it requires high-frequency radiation sources. Lack of a small, low-cost, moderate-power THz source is one of the main reasons that THz applications have not fully materialized yet. Scientists are trying to find a solution to this problem. They created a compact device that can lead to portable, battery-operated sources of THz radiation. This new solid-state T-ray source uses high-temperature superconducting crystals that contain stacks of Josephson junctions. So, even a small voltage, around two millivolts per junction, can induce frequencies in the THz range.

Mercury arc lamps generate light in terahertz
Mercury arc lamps generate light in terahertz

TE devices are extremely fast and they are made entirely of thin-film materials—metals and insulator. Hence, it is possible to fabricate Terahertz Electronics devices on top of complementary metal oxide semiconductor (CMOS) circuitry—a technology for creating integrated-circuits circuitry or on an extensive variety of substrate materials. In TE devices, charge transport through the junction occurs via electron tunneling. Further research and development will make Terahertz Electronics a reality in not-so-distant future.

enlarged cross-section of an experimental chip made of ultrathin semiconductors

New Ultrathin Semiconductors Can Make More Efficient and Ten Times Smaller Transistors Than Silicon

The researchers at Stanford University have discovered two ultrathin semiconductors – hafnium diselenide and zirconium diselenide. They share or even exceed some of the very important characteristics of silicon. Silicon has a great property of forming “rust” or silicon dioxide (SiO2) by reacting with oxygen. As the SiO2 acts as an insulator, chip manufacturers implement this property to isolate their circuits on a die. The most interesting fact about these newly discovered semiconductors is, they also form “rust” just like silicon.

enlarged cross-section of an experimental chip made of ultrathin semiconductors
An enlarged cross-section of an experimental chip made of ultrathin semiconductors

The new materials can also be contracted to functional circuits just three atoms thick and they require much less energy than silicon circuits. Hafnium diselenide and zirconium diselenide “rust” even better than silicon and form so-called high-K insulator. The researchers hope to use these materials to design thinner and more energy-efficient chips for satisfying the needs of future devices.

Apart from having the ability to “rust”, the newly discovered ultrathin semiconductors also have the perfect range of energy band gap – a secret feature of silicon. The band gap is the energy needed to switch transistors on and it is a critical factor in computing. Too low band gap causes the circuits to leak and make unreliable. Too high and the chip takes excessive energy to operate and becomes inefficient. Surprisingly, Hafnium diselenide and zirconium diselenide are in the same optimal range of band gap as silicon.

All this and the diselenides can also be used to make circuits which are just three atoms thick, or about two-thirds of a nanometer, something silicon can never do. Eric Pop, an associate professor of electrical engineering, who co-authored with post-doctoral scholar Michal Mleczko in a study paper, said,

Engineers have been unable to make silicon transistors thinner than about five nanometers, before the material properties begin to change in undesirable ways.

If these semiconductors can be integrated with silicon, much longer battery life and much more complex functionality can be achieved in consumer electronics. The combination of thinner circuits and desirable high-K insulation means that these ultrathin semiconductors could be made into transistors 10 times tinier than anything possible with silicon today. As Eric Pop said,

There’s more research to do, but a new path to thinner, smaller circuits – and more energy-efficient electronics – is within reach.