Munich, January 9, 2018 — SimScale is announcing a free webinar on 24th of January to teach electronics engineers how conjugate heat transfer simulation in the cloud can help better investigate the thermal response of electronic packaging.
According to the Electrical and Electronic Manufacturing Market Briefing 2017 report from The Business Research Company (TBRC), the global electrical and electronics manufacturing market is expected to reach $3 trillion by 2020.
In such an innovation-driven and competitive industry, engineers deal with increasingly stringent thermal requirements due to the rapid increase in high-power density electronics. Thermal integrity is one of the most important considerations for electronics packaging or enclosures that affect the product lifecycle. The thermal impact on the electronic packaging is a key factor in material selection, cooling and form-related decisions that eventually determine the weight, size, and cost of the final design. It is vital for designers to determine the heat signatures of their system. (more…)