Researchers at Stanford University claim to have developed the world’s first peel-and-stick thin-film solar cells (TFSCs) that don’t require any modification of existing processes or materials. The new process would allow the creation of decal-like solar panels that could be applied to virtually any surface.
Unlike with standard thin-film solar cells, the new process doesn’t require direct fabrication on a final carrier substrate. Instead, a 300-nm film of nickel (Ni) is deposited on a silicon/silicon dioxide (Si/SiO2) wafer, on which thin-film solar cells are then deposited using standard fabrication techniques, and covered with a layer of protective polymer. A thermal release tape is then attached to the top of the thin-film solar cells as a temporary transfer holder. [via]
Peel-and-stick solar cells – [Link]