login
Toshiba will start mass production of 64-layer 3D NAND, BiCS3, with 3-bit-per-cell technology and a 64GB capacity in the first half of 2017. The applications of this new massive storage chip include enterprise and consumer SSD, smartphones, tablets and memory cards. This achievement succeeds the 48-layer BiCS FLASH one.
Western Digital, the well known industry-leading provider of storage technologies, recently announced world’s first 64 Layer 3D NAND. “BiCS3 has been developed jointly with Western Digital’s technology and manufacturing partner Toshiba. It will be initially deployed in 256 gigabit(32GB) capacity” according to Western Digital’s press release.
In the same context, Samsung seems going to start production of 64-layer 3D NAND at the end of this year 2016.
RELATED POSTS
31 July, 2015 Infineon’s Security Chip
13 July, 2020 Evo M51 Compute module Features Atmel SAMD51 MCU with Intel MAX 10 FPGA
20 October, 2020 CodemanHB Posts His DIY NAS Device on Reddit
2 November, 2018 SHIVR -The Ultimate Noise Cancelling 3D Headphones
5 November, 2020 FET1028A-C SoM Powered by LS1028A Offers Five-Port Networking Solution
7 March, 2018 VIA Smart Recognition Module Recognizes Emotion, Face, Age & Gender
