Tag: 3D flash

Kioxia Corporation and Western Digital Corp., today announced that the companies have developed their sixth-generation, 162-layer 3D flash memory technology. Marking the next milestone in the companies' 20-year joint-venture partnership, this is the companies' highest density and most...

New generation 3D flash memory adds layers, boosts capacity, broader bandwidth and provides new design flexibility KIOXIA Europe GmbH, the world leader in memory solutions, today announced that it has successfully developed its fifth-generation BiCS FLASH three-dimensional (3D)...

Toshiba Memory Europe has developed a prototype sample of a 96-layer BiCS FLASH, memory device using its proprietary 3D flash quad level cell (QLC) technology, claimed to boost single-chip memory capacity to the highest level yet achieved. QLC technology increases the bit count for...