Tag Archives: Android

NanoPi M4 – RK3399 Based RPi Clone SBC Costs $65 Only

FriendlyElec has launched the NanoPi M4. It is one of the smallest, most affordable Rockchip RK3399 based SBC yet. The NanoPi M4 has essentially the same layout as the latest Raspberry Pi 3 Model B+ and has all of its stand out features. Aside from the different processor, this is a very close resemblance of the RPi 3 B+ except for the lack of PoE support on the GbE port.

On the other hand, it has a faster, native GbE port instead of the RPi 3 B+’s USB-based connection. Like the B+, it has dual-channel 802.11ac on the WiFi/Bluetooth module.

Despite the performance improvements on the RPi 3 B+, the Rockchip RK3399 beats it in speed tests. It also defeats the vast majority of Arm SoCs. The RK3399 has dual Cortex-A72 cores clocked to up to 2.0GHz and 4x Cortex-A53 cores at 1.5GHz. There’s also a high-end Mali-T864 GPU and a VPU that supports 4K VP9 and 4K 10-bit H265/H264 60fps decoding.

The NanoPi M4 is intended for applications including machine learning, AI, deep learning, robots, industrial control, industrial cameras, advertisement machines, game machines, and blockchain. OS support for this board includes Android 7.1.2 and three Ubuntu-based Linux distributions: Lubuntu 16.04, FriendlyCore 18.04 (Ubuntu Core), and FriendlyDesktop 18.04.

Specifications for the NanoPi M4:

  • Processor:
    • Rockchip RK3399 (2x Cortex-A72 at up to 2.0GHz,
    • 4x Cortex-A53 @ up to 1.5GHz); Mali-T864 GPU
  • Memory:                                                            
    • 2GB or 4GB LPDDR3 RAM (dual-channel)
    • eMMC socket
    • MicroSD slot for up to 128GB
  • Wireless:
    • 802.11b/g/n/ac (2.4GHz/5GHz) with Bluetooth 4.1;
    • 2x IPX antenna connectors
  • Networking: Gigabit Ethernet port
  • Media:
    • HDMI 2.0a port (with audio and HDCP 1.4/2.2) for up to 4K at 60Hz
    • MIPI-DSI (4-lane) with MIPI-CSI co-lay
    • 1x or 2x 4-lane MIPI-CSI (up to 13MP) with dual ISP support; (2nd CSI available via DSI)
    • 3.5mm analog audio I/O jack
  • Other I/O:
    • 4x USB 3.0 host ports
    • USB 3.0 Type-C port (USB 2.0 OTG or power input)
    • Serial debug 4-pin header
  • Expansion:
    • 40-pin RPi compatible header — 3x 3V/1.8V I2C, 3V UART,
    • 3V SPI, SPDIF_TX, up to 8x 3V GPIOs, 1.8V 8-ch. I2S
  • Power: DC 5V/3A input or USB Type-C
  • Operating temperature: -20 to 70℃
  • Dimensions: 85 x 56mm; 8-layer PCB
  • OS Support: Android 7.1.2; Lubuntu 16.04 (32-bit); FriendlyCore 18.04 (64-bit), FriendlyDesktop 18.04 (64-bit)

The NanoPi M4 with 2GB RAM is available now for $65 (for first 300 units), otherwise, the price is $75. The 4GB version costs $105. More information may be found at FriendlyElec’s NanoPi M4 shopping pagewiki, and GitHub page.

SinoVoip Unveils Open-spec Banana Pi BPI-P2 Zero SBC

SinoVoIP is going to launch their inexpensive Raspberry Pi Zero compatible, Allwinner H2+ powered board Banana Pi-P2 Zero. This is going to be the successor to Banana Pi M2 Zero. The new Banana Pi-P2 Zero combines support for PoE (Power-over-Ethernet) as well as a CSI camera interface.

Sinovoip Banana Pi BPI-P2 Zero
Sinovoip Banana Pi BPI-P2 Zero

The Banana Pi BPI-P2 Zero is almost identical to last year’s $21 Banana Pi BPI-M2 Zero with a few significant enhancements. The board attaches 8GB eMMC storage, as well as a 10/100 Ethernet port with Power-over-Ethernet support available via an optional PoE module. The new board doubles the weight to 30 grams and extends the smaller dimension by 22.5mm giving it a 65 x 52.5mm footprint.

Other features are almost the same as the M2 Zero, which itself is an emulation of a Raspberry Pi Zero W. The P2 Zero board can run Linux and Android on a 1.2GHz, quad -A7 Allwinner H2+, which is like an Allwinner H3, but with HD instead of 4K video support. The SoC integrates a Mali400 MP2 GPU.

The Banana Pi BPI-P2 Zero comes with 512MB DDR3, a microSD card slot, and a WiFi/Bluetooth module. Other features include MIPI-CSI, 40-pin RPi expansion, a mini-HDMI port, a USB 2.0 host port, and a power-only micro-USB OTG port.

Banana Pi BPI-P2 Zero specifications:

  • SoC: Allwinner H2+ quad-core Arm Cortex A7 processor with Mali-400MP GPU.
  • Memory:
    • 512MB DDR3 SDRAM.
    • 8GB eMMC flash
    • Micro SD card slot
  • Video Output: mini HDMI port
  • Connectivity:                    
    • 10/100M Ethernet with PoE support
    •  WiFi & Bluetooth via AP6212 module
  • The camera I/F: CSI camera interface
  • USB: 1x USB OTG port
  • Expansion:
    • 40-pin GPIO header with UART, SPI, I2C, etc…
    • 3-pin UART header for serial console access
  • Power Supply:                    
    • 5V/2A via micro USB port
    • Power-over-Ethernet (PoE)
  • Dimensions: 65 x 52.5mm
  • Supported OS: Linux, Android

No pricing or availability information was provided for the Banana Pi BPI-P2. More information may be found on SinoVoip’s Banana Pi BPI-P2 Zero wiki page.

Seco’s New i.MX8M And i.MX8Quad Based Modules Run Linux

Seco Embedded Creators have launched the i.MX8M based Q7-C25 and i.MX8Quad based Q7-C26. Both can run Linux and Android, and are available in 0 to 60°C and -40 to 85°C models. The 5V modules have many similar features, but the Q7-C26 based on the more powerful, up to hexacore i.MX8Quad adds some extras such as SATA III support.

Seco Q7-C25
Seco Q7-C25

The Q7-C25 utilizes NXP’s dual- or quadcore, 1.5GHz Cortex-A53 i.MX8M. It facilitates a 266MHz Cortex-M4 MCU and a Vivante GC7000Lite GPU. Unlike the Quad and Dual models, the quad-core i.MX8M QuadLite model lacks a VPU.

On the other hand, the Q7-C26 features the more powerful i.MX8Quad, which is available in quad A53 configurations, but clocked to a lower 1.26GHz. All three i.MX8Quad Quad models also accommodate dual Cortex-M4 MCUs and dual GC7000Lite GPUs. The mid-range i.MX8QuadPlus model combines 1x Cortex-A72 core and the high-end QuadMax adds 2x -A72 cores.

Seco Q7-C26
Seco Q7-C26

Both the Q7-C25 and Q7-C26 ship with onboard LPDDR4-3200 RAM, but only the Q7-C25 lists a quantity, which is up to 4GB. They both offer presumably optional eMMC and QSPI flash onboard, but no quantities are listed. Only the Q7-C26 supports SATA III, but it’s a factory option swap-out for one of the 2x PCIe x1 interfaces provided by both modules. Both COMs also combine a GbE controller.

Both the Q7-C25 and Q7-C26 support up to 4096 x 2160p60 video output with HDR via an HDMI 2.0A port. On the Q7-C26 DisplayPort 1.3 is supported, and the Q7-C26 also supports HDCP 2.2. Both modules also provide an HD-ready LVDS interface, I2S audio, and a MIPI-CSI camera interface.

The Q7-C25 supports 5x USB ports compared to 6x on the Q7-C26. Yet on the Q7-C25, two of those are USB 3.0 compared to one on the Q7-C26, which is the only one to support a USB OTG port. Common features on both modules are 2x I2C, 8x GPIO, and single UART, CAN, SPI, and SD connections. They both supply a watchdog and power management signals and the Q7-C26 also features a boot select signal.

Both modulessupport the same 3.5-inch form-factor, cross-platform (Arm and x86) CQ7-A42 carrier board. Another option is a Q7 Dev Kit 2.0 that offers a different and much larger CQ7-A30 board with more legacy connections.

No pricing or availability information was provided for the  Q7-C25 and Q7-C26 modules or related carrier boards and kits as they are currently under development. More information may be found in the following Seco product pages for Q7-C25Q7-C26CQ7-A42 and Q7 Dev Kit 2.0.

Google Unveils USB Type-C Version Of It’s Edge TPU AI Chip

Google has come up with its Edge TPU machine learning chip announcement by also revealing a USB Type-C based device that can be plugged into any Linux or Android Things computer, including a Raspberry Pi. The company announced a USB stick computer version of Edge TPU that can work with any Linux or Android Things computer. It also published more details on the upcoming, NXP-based Edge TPU development kit, including its SoC NXP i.MX8M.

Two views of the Edge TPU dev kit
Google’s Edge TPU dev kit

The Edge TPU Accelerator uses the same mini-scaled Edge TPU neural network coprocessor that is built into the upcoming dev kit. It has a USB Type-C port to connect with any Debian Linux or Android Things computer to accelerate machine learning (ML) inferencing for local edge analytics. The 65 x 30mm device has mounting holes for host boards such as a Raspberry Pi Zero.

Same as the Edge TPU development kit, the Edge TPU Accelerator enables the processing of machine learning (ML) inference data directly on-device. This local ML accelerator increases privacy, removes the need for persistent connections, reduces latency, and allows for high performance using less power.

The Edge TPU Accelerator starts competing with products like Intel’s Neural Compute Stick, previously referred to as the Fathom. The USB-equipped Neural Compute Stick is equipped with the Movidius Myriad 2 VPU and neural network accelerator.

The Edge TPU dev kit details

The Edge TPU Accelerator is going to ship in October this year along with the Edge TPU chip and development kit. It was informed that the computer-on-module that features the Edge TPU will run either Debian Linux or Android Things on NXP’s i.MX8M. The 1.5GHz, Cortex-A53 based i.MX8M integrates a Vivante GC7000Lite GPU and VPU, as well as a 266MHz Cortex-M4 MCU.

The yet unnamed, 48 x 40mm module will ship with 1GB LPDDR4, 8GB eMMC, dual-band WiFi-ac, and Bluetooth 4.1. The baseboard of the dev kit will add a microSD slot, as well as single USB Type-C OTG, Type-C power (5V input), USB 3.0 host, and micro-USB serial console ports.

The Edge TPU development kit baseboard is further provided with GbE and HDMI 2.0a ports, as well as a 39-pin FPC connector for 4-lane MIPI-DSI and a 24-pin FPC for 4-lane MIPI-CSI2. There’s also a 40-pin expansion connector, but with no claims for Raspberry Pi compatibility. The 85 x 56mm board also provides an audio jack, a digital mic, and a 4-pin terminal for stereo speakers.

More information may be found in the Edge TPU Accelerator announcement, as well as the original Edge TPU announcement.

ICNexus’s SBC3100 Runs Linux On Rockchip RK3399 SoC

Taiwan-based ICNexus’ latest entry with Rockchip RK3399 SoC, SBC3100 joins the growing list of high-end SBCs. It features the high-end SoC to provide an extensive feature list. However, it is not publicly priced and appears to be a proprietary product, such as Aaeon’s Pico-ITX based RICO-3399.

ICNexus SBC3100
ICNexus SBC3100

ICNexus announced the SBC3100 back in 2017, the SBC3100 was showcased at last week’s Computex show in Taipei. The board ships with Ubuntu and Android images, and is designed for applications including digital signage, POS, gaming, STBs, kiosks and other smart devices.

Despite the high-end features, not much stands out from the other equally powerful RK3399 contender SBCs, except for its wide-range 9-36V DC input and its optional add-on modules. The board can be equipped with an HDMI input, an LVDS touchscreen interface, and a 4-port serial add-on.

The board comes with up to 4GB DDR3 and 16GB flash (presumably eMMC). Media ports accommodate HDMI 2.0, eDP, and DP (via USB Type-C). There are up to 2x MIPI-DSI or -CSI, but not 2x of both, and there’s also a separate camera port and I2C touch interface. There’s a GbE port plus optional WiFi/BT module, and the mini-PCIe slot (with micro-SIM) supports optional 3G or 4G modules.

The SBC3100 provides 4x USB ports, 2x of them are 3.0, plus the Type-C port and additional USB headers. Other features include GPIO, serial debug, IR, I2C, and optional sensors.

Specifications list for the SBC3100:

  • Processor:
    • Rockchip RK3399 (2x Cortex-A72 at up to 2.0GHz, 4x Cortex-A53);
    • Mali-T860 GPU
  • Memory :
    • 1GB, 2GB, or 4GB DDR3 RAM
    • 8GB or 16GB flash
    • MicroSD slot
  • Display/camera:
    • HDMI 2.0 out port at up to 4Kx2K@60fps
    • DisplayPort 1.2 at up to 4Kx2K@60fps (via USB Type-C)
    • eDP 1.3 at up to 2560×1600@60fps
    • 1x or 2x MIPI-DSI at up to 2560×1600 at 60fps with optional MIPI/LVDS touchscreen module
    • 1x or 2x MIPI-CSI with optional HDMI input module
    • Camera port
    • An i2c-based capacitive touch interface
  • Audio: mic/earphone connector; 2x speaker connectors
  • Wireless:
    • Optional 802.11b/g/n and Bluetooth 4.0
    • Optional 3G or LTE modules for mini-PCIe slot
    • Micro-SIM card slot
  • Networking: Gigabit Ethernet port
  • Other I/O:
    • 4x USB 3.0 host (2x ports, 2x headers)
    • 3x USB 2.0 host (2x ports, 1x header)
    • USB 3.0 Type-C port with DP support
    • Serial console debug
    • Optional serial module with 4x RS232/422/485 DB9 ports
    • 8-bit GPIO
    • I2C master
    • Keypad interface
  • Expansion: Mini-PCIe slot with 3G/LTE support
  • Other features: IR receiver; buzzer; heatsink; optional 3-axis accelerometer; optional gyro/G-Sensor (only on 4GB RAM model)
  • Power: 9-36V DC input; 3/5/12V DC output; power and reset buttons
  • Dimensions:150 x 102 x 2.6mm
  • OS Support: Pre-installed Ubuntu or Android

No pricing information is provided for the SBC3100, but it appears to be available. More information may be found on the ICNexus SBC3100 product page.

Firefly’s Latest Core-PX3-SEJ COM Runs Ubuntu or Android

Firefly has launched a new SODIMM-style, 67.6 x 40mm Core-PX3-SEJ module that runs Android 5.1 or Ubuntu 15.04 on a Rockchip PX3-SE. It’s a new 1.3GHz, quad-core, Cortex-A7 SoC. The 40 USD module is available in a 1GB RAM/8GB eMMC configuration on a $120, 117 x 85mm Firefly-PX3-SE development board. Other memory configurations may also be available soon.

Firefly Core-PX3-SEJ module
Firefly Core-PX3-SEJ module

The PX3-SE SoC gives the module a sandwich-style dev board and increases the operating temperature to -20 to 80 range. The Core-PX3-SEJ module is praised for its anti-corrosion gold finger expansion connector, and the dev board for its “double stud fixed” design.

Rockchip’s PX3-SE SoC was announced in May 2017. The main target of this SoC is Linux and Android-driven “mobile vehicle interconnect solutions.” The quad-A7 SoC implements a Mali-400 GPU and supports HD video.

The Firefly-PX3-SE board’s 2.4GHz WiFi and Bluetooth 4.0 are supplied separately from the compact Core-PX3-SEJ COM. Despite the lack of 4K support, there are a numerous media interfaces, including a variety of audio features. There are HDMI, CVBS, MIPI-DSI or LVDS, and a DVP camera interface. Analog, SPDIF, and I2S audio connections are available along with an onboard mic and a “phone” I/O port.

The Firefly-PX3-SE board is further provided with a GbE port, 4x USB 2.0 host ports, a micro-USB OTG port, and an 84-pin expansion header. RTC, debug, and IR are also onboard.

Specifications summary for the Firefly-PX3-SE development board with Core-PX3-SEJ module:

  • Processor : Rockchip PX3-SE (4x Cortex-A7 cores @ 1.3GHz); Mali-400 MP2 GPU
  • Memory:
    • 256MB, 512MB, 1GB, or 2GB DDR3 RAM (via Core-PX3-SEJ)
    • 4GB to 64GB eMMC flash (via Core-PX3-SEJ) with 4GB and 8GB default SKUs
    • MicroSD slot
  • Wireless:
    • 2.4GHz 802.11b/g/n with antenna
    • Bluetooth 4.0 with BLE
  • Networking: Gigabit Ethernet port (Realtek RTL8211E)
  • Display & media:
    • HDMI port with audio
    • MIPI-DSI or LVDS LCD interface
    • CVBS with video and audio
    • DVP camera interface for up to 5MP
    • 3.5mm analog audio input jack
    • SPDIF optical output
    • Microphone input
    • I2S audio I/O
    • A phone I/O interface
  • Other I/O:
    • 4x USB 2.0 host ports
    • Micro-USB 2.0 with OTG
    • Serial console debug
    • 84-pin expansion header (MIPI, LVDS, PWM, SPI, UART, ADC, I2C, I2S, GPIO)
  • Other features: RTC with battery; IR receiver; power, reset, recover buttons; acrylic rack kit
  • Power: 5V, 2A (via DC jack); PMU (via Core-PX3-SEJ)
  • Dimensions: 117 x 85mm (with 67.6 x 40mm integrated COM)
  • OS Support: Android 5.1; Ubuntu 15.04; includes Linux Buildroot/Qt

The Core-PX3-SEJ module and Firefly-PX3-SE development board are available for $80 and $140 (including module), respectively, plus shipping. More information may be found at Firefly’s Core-PX3-SEJ and Firefly-PX3-SE shopping pages.

Google Reveals Four New ARM-based production Boards For Android Things 1.0

Earlier this month, Google released Android Things 1.0 and announced many consumer products that will ship in the coming months based on the stripped-down, IoT-oriented Android variant. Google uncovered four ARM-based production boards for Android Things 1.0: Innocomm’s i.MX8M based on WB10-ATIntrinsyc’s Open-Q 212A and Open-Q 624A, based on the Snapdragon 212 and 634, respectively, and the MediaTek MT8516.

The most important news with the first market-ready release of Android Things is that Google is offering free OTA security and patch updates for three years to all targeted devices. However, Google needs a licensing deal to deploy more than 100 commercial systems using the OTA updated long-term version of Android Things, and the OS itself is “managed” and tightly controlled by Google.

The modules share the same small footprints of about a 50 x 50mm. They also focus on audio features that might support integration with the Google Assistant voice agent. The first round of consumer devices using Android Things are smart speakers and automation hubs that integrate Google Assistant.

WB10-AT

InnoComm Google WB10AT COM
InnoComm Google WB10AT COM

InnoComm’s 50 x 50mm WB10-AT COM is almost identical to the WB10 module announced in March. The only difference except for the OS is that the AT version ships with 1GB LPDDR4 instead of 2GB. The WB10-AT includes a 1.5GHzCortex-A53 based NXP i.MX8M Quad SoC with a 266MHz Cortex-M4 core. It extends 8GB eMMC, 802.11ac, Bluetooth 4.2, and a GbE controller.

The WB10-AT allows HDMI 2.0 with 4K HDR support, as well as extensive audio I/O enabled by the audio-savvy i.MX8M. Audio specs include 4x SAI, DSD512, and S/PDIF.

Open-Q 212A Development Kit

Open-Q 212A board and module
Open-Q 212A board and module

Intrinsyc’s Open-Q 212A is a sandwich-style SBC designed for next-gen smart speaker and voice-controlled home hub products. There is a new 50 x 46.5mm Open-Q 212A Android Things SOM with a quad-core, Cortex-A7 Qualcomm Snapdragon 212 (SDA212) — the lowest-end SoC available for Android Things mounted on a 170 x 115mm carrier board.

The new module provides 1GB LPDDR3, 4GB eMMC, WiFi-ac, and BT 4.2. The 12V carrier board adds 2x USB host ports, a micro-USB client port, and a micro-USB debug port. It also includes a MIPI-CSI and MIPI-DSI interfaces, with the latter capable of up to 720p LCD displays. PCB antennas are also available.

Open-Q 624A Development Kit

Open-Q 624A
Open-Q 624A

This new sandwich-style kit is Google’s high-end Android Things platform. It connects a new Open-Q 624A Android Things SOM and carrier board, each of which is the same size as their Open-Q 212A counterparts.

The module extends 2GB RAM4GB eMMCWiFi-ac, BT 4.2, and a new, undocumented octa-core Snapdragon 624 SoC based on the existing Snapdragon 625. Like the Snapdragon 625, the 624 provides 8x Cortex-A53 cores at up to 1.8GHz along with an Adreno 506 GPU with support for 4K @ 30fps video. Google calls the Snapdragon 624 the SDA624, and in one place Intrinsyc refers to it as the APQ8053, which is also the name of the Snapdragon 825.

The Open-Q 624A carrier board has a feature set that is very similar to that of the similarly sized Open-Q 212A board. However, it adds a USB 3.0 Type-C port, sensor expansion and haptic output, and an optional GPS receiver, which like the module’s WiFi and Bluetooth, is available with an antenna.

MediaTek MT8516

MediaTek MT8516
MediaTek MT8516

Google refers to the MT8516 as a virtual SoM, as opposed to the other physical modules, and suggests that the module’s capabilities are directly integrated into a reference board designed for high volume applications.

Whatever the form factor, the MT8516 provides a quad-core, 1.3GHz Cortex-A35 processor with 4GB eMMC, WiFi, BT, and RF. The platform is intended for voice assistance and other audio applications and provides 4-channel I2S x2, 8-channel TDM, and 2-channel PDM input for voice input control and connected audio.

The Cortex-A35 cores draw about 33 percent less power per core and occupy 25 percent less silicon area than Cortex-A53. The -A35 design lies at the heart of NXP’s i.MX8X SoC, which is also available in two dual-core models. The i.MX8X is found on Phytec’s phyCore-i.MX 8 module.

More information may be found on this Google Android Things Supported Platforms page, as well as at these four product pages:

New Wireless VAR-SOM-MX6 Adds Supports For i.MX6 QuadPlus SoC

Variscite a leading SOC manufacturer from Israel, has released a new version of its wireless-enabled “VAR-SOM-MX6” module. It adds support for the i.MX6 QuadPlus SoC. Variscite is renovating the old COM once again with a model that adds support for NXP’s QuadPlus. It is going to be a new addition to the i.MX6 Solo, DualLite, Dual, and Quad versions. The module runs Linux 4.9.11 and Android 8.0 (Oreo).

VAR-SOM-MX6 module with QuadPlus support
VAR-SOM-MX6 module with QuadPlus support

The i.MX6 QuadPlus, which is also available on the Wandboard Reload SBCs, iWave’s i.MX6 COMs, and other boards. It has the same, 1.2GHz quad-core CPU as the Quad, but offers an enhanced Vivante GC2000+ GPU with 50 percent elevated graphics performance. The SoC also provides HD-resolution H.264 decode and encode.

The 2018 version of the VAR-SOM-MX6 is identical with the pin configuration as the earlier models. It has up to 4GB DDR3 RAM and data storage of 4GB to 64GB via eMMC and 128MB to 1GB NAND flash. There’s a GbE controller, although with the usual i.MX6 bandwidth limits. The 802.11n WiFi, which is accompanied by Bluetooth 4.1 with BLE, is available with optional 2×2 MIMO.

The 67.8 x 51.7mm module houses dual 24-bit LVDS interfaces with resistive touch, as well as an HDMI and DSI interfaces. The long list of peripherals includes dual CAN, SATA, PCIe, MIPI-CSI, and much more support. The module has a range of -40 to 85°C working temperatures.

VAR-SOM-MX6 eval kits

VAR-SOM-MX6 Development Kit
VAR-SOM-MX6 Development Kit

The $399 VAR-SOM-MX6 Starter Kit includes the carrier board with the VAR-SOM-MX6 module, an antenna, a debug cable, a microSD card, and a carrier board design package. The $499 Development Kit version adds a 12V power supply, an Ethernet cable, and a 7-inch resistive touch panel. The $549 Development Kit Pro advances to a 7-inch capacitive touchscreen.

The VAR-SOM-MX6 module with QuadPlus support is available now starting at $52 per unit in volume. The development kits start at $399. More information may be found in Variscite’s VAR-SOM-MX6 with the QuadPlus announcement and product page.

Run any Windows Software on your Android Mobile Devices

The definitive guide on how to transfer your entire Desktop Work or Entertainment to any Android Smartphone or Tablet

Windows applications are very common for our everyday work and life, so why should we leave them home (or office) on our Windows desktop PCs? What if we could use them on the go, right on our smartphones or tablets? Well, with the modern IT development level this is not the question anymore.

ExaGear Windows Emulator app can solve this issue. This is a virtual machine that allows you to natively run any PC application on any Android mobile device by creating the environment inside the Android operating system and launching the app within this environment. In fact, the overall usability, performance and speed of windows applications stay the same. You literally feel like you are working on your PC.

Run any Windows Software on your Android Mobile Devices – [Link]

Banana Pi BPI-W2 SBC – A Multimedia Router And NAS Board That Runs Android Or Linux

SinoVoip has released Banana Pi BPI-W2 multimedia network and smart NAS router SBC. The BPI-W2 has a faster processor and more advanced features than last year’s Banana Pi BPI-R2. However, the new model has only two Gigabit Ethernet ports instead of four.

This SBC is designed for applications such as high wireless performance, home entertainment, home automation, and many more. The BPI-W2 runs on a Realtek RTD1296 SoC with 4x Cortex-A53 cores clocked at up to 1.5GHz with a high-end Mali-T820 MP3 GPU. By comparison, previous year’s BPI-R2 used a quad-core, Cortex-A7 MediaTek MT7623 with a Mali-450 MP4. SinoVoip confirms full support for Android 6.0CentOSDebian 9Raspbian, and Ubuntu 15.04, and the board is also said to support OpenWrt.

Banana Pi BPI-W2
Banana Pi BPI-W2

The updated I/O support is shown in the BPI-W2’s dual SATA III ports, compared to only one on the single SATA interface found on the MT7623-based BPI-R2 and RTD1295-based devices. The BPI-W2 also has 8-64GB eMMC, a microSD slot, and 2GB of DDR4.

Although limited to dual GbE ports, the board also has a GbE WAN port for router applications. Unlike the R2, there is an HDMI input in addition to the HDMI output, and a mini-DisplayPort has replaced the earlier MIPI-DSI connection. In either case, the output resolution is still limited to HD (1080p) only.

Four USB ports are available, including single USB 3.0 and Type-C ports. There is a 40-pin header that is claimed to support Raspberry Pi 3 add-on boards. Other features involve RTC, IR, debug, audio I/O, and a 12V input.

Like other Banana Pi boards, the BPI-W2 is open source, shipping with schematics and other documentation. The AliExpress and wiki pages list and show PCIe 2.0 and 1.1/SDIO slots on the front as well as a single M.2 slot on the back. Yet the PCIe slots are also tagged as M.2 slots (E-Key), and it’s unclear which slots are capable of what. The PCIe slots are capable to support up to 802.11ac WiFi, and there’s also a SIM card slot.

The Banana Pi BPI-W2 is available now for $93 plus shipping on AliExpress. More information may be found on the BPI-W2 wiki page.