Imec Invented Unique Cost-effective Cooling For High-Performance Chips
Technology

Imec Invented Unique Cost-effective Cooling For High-Performance Chips

Imec, the distinguished Belgian research center has invented a new and cost-effective method of cooling chips. This achievement can be an important innovation to tackle the ever-increasing cooling demands of high-performance 3D chips and systems. Present powerful electronic systems have...

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ICECool – An Intra-Chip Cooling System That Is More Efficient
ICScienceTechnology

ICECool – An Intra-Chip Cooling System That Is More Efficient

In the Moore’s Law race to keep improving computer performance, the IT industry has turned upward, stacking chips like nano-sized 3D skyscrapers. But those stacks have their limits, due to overheating. Researchers from IBM have solved this problem by developing an intra-chip...

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Researchers Developed New Efficient, Thin, and Flexible Cooling Device
ScienceTechnology

Researchers Developed New Efficient, Thin, and Flexible Cooling Device

Engineers and scientists from the UCLA Henry Samueli School of Engineering and Applied Science and SRI International, California, have created a thin flexible device that could keep smartphones and laptop computers cool and prevent overheating. The component is based on...

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Hot rods keep the die cool
IC

Hot rods keep the die cool

Clemens Valens @ elektormagazine.com shows us a new IC Package that keeps the IC cool. Texas Instruments’ HotRod QFN is a thermally enhanced plastic package with solder lands on all sides as well as power buses for enhanced current carrying capability. Inside the package the die...

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