Tag Archives: ic

Microchip to Buy Atmel for Nearly $3.6 Billion


MicroAtMelChipMicrochip Technology to Buy Atmel for Nearly $3.6 Billion @ The New York Times.

Microchip Technology agreed to acquire a fellow chipmaker, the Atmel Corporation, for about $3.6 billion, part of a wave of mergers and acquisitions within the semiconductor industry.

Chip makers have been combining to cut costs and build scale for their customers. Microchip agreed to acquire the 37-year-old chipmaker Micrel in May for about $839 million. Microchip purchased Supertex for $394 million in 2014, and the year before that, bought the closely held Brussels-based EqcoLogic for an undisclosed amount.

Microchip joins larger peers in this round of consolidation, including Avago Technologies, which agreed to acquire Broadcom for $37 billion, one of the biggest deals ever within the semiconductor industry.

Microchip to Buy Atmel for Nearly $3.6 Billion – [Link]

LTC3643 – 2A Bidirectional Power Backup Supply


Linear Technology Corporation introduces the LTC3643, a bidirectional, high voltage boost capacitor charger that automatically converts to a buck regulator for system backup. The proprietary, single-inductor topology with integrated PowerPath™ functionality does the work of two separate switching regulators, reducing size, cost and complexity. The LTC3643 operates in two modes – boost charge mode and buck backup mode. The charging mode efficiently charges an electrolytic capacitor array up to 40V with an internal switch current rating of 2A from an input supply between 3V to 17V. In backup mode, when the input supply falls below the programmable power-fail (PFI) threshold, the step-up charger operates in reverse as a synchronous step-down regulator to power and hold up the system rail from the backup capacitor. During backup, the current limit can be programmed from 2A to 4A, making this device ideal for high energy, relatively short duration backup capacitor systems, power failure backup systems, solid-state drives and battery stack charging applications.

LTC3643 – 2A Bidirectional Power Backup Supply – [Link]

Precision programmable current source uses two ICs


by Stefano Salvatori & Pietro Oliva @ edn.com:

This Design Idea mates a precision current source IC with precision difference amp chips to create a programmable current source or sink.

The resistor-programmable current source/sink in Figure 1 illustrates the basic topology, taking advantage of tightly matched on-chip resistor ratios instead of relying on absolute tolerances.

Precision programmable current source uses two ICs – [Link]

Wafer pooling: low-cost prototyping service for ICs

20151112145948_wafer-pooling2 (1)

AMS is providing a fast and cost effective IC prototyping service. by Clemens Valens @ elektormagazine.com:

The Full Service Foundry division of ams AG announced its fast and cost-efficient IC prototyping service, known as Multi-Project Wafer (MPW) or shuttle run. The prototyping service combines several designs from different customers onto a single wafer to offer significant cost advantages as the costs for wafers and masks are shared among a number of different participants.

Wafer pooling: low-cost prototyping service for ICs – [Link]

Understanding silicon circuits: inside the ubiquitous 741 op amp


Ken Shirriff’s blog looks inside the famous 741 OPMAP and discuss how it’s made and how it’s working:

The 741 op amp is one of the most famous and popular ICs[1] with hundreds of millions sold since its invention in 1968 by famous IC designer Dave Fullagar. In this article, I look at the silicon die for the 741, discuss how it works, and explain how circuits are built from silicon.

Understanding silicon circuits: inside the ubiquitous 741 op amp – [Link]

Charger interface IC avoids handset overheating at fast-charge rates


by Graham Prophet @ edn-europe.com:

Power Integrations offers a charger interface IC compatible with Qualcomm’s Quick Charge 3.0 specification; PI says its CHY103D IC optimises efficiency to prevent handset overheating during high-speed charging.

Added to the ChiPhy charger-interface IC family, PI saya this is the first IC for off-line AC-DC chargers compatible with the Quick Charge (QC) 3.0 protocol from Qualcomm Technologies. Used alongside Power Integrations’ InnoSwitch AC-DC switcher ICs, the CHY103D device incorporates all of the functions needed to support QC 3.0. The QC 3.0 protocol implemented in the CHY103D device substantially reduces losses in the smart mobile device handset during rapid charging. This permits system designers to choose to charge handsets faster or reduce phone touch-temperature during charging, and enhances the efficiency of the charging process.

Charger interface IC avoids handset overheating at fast-charge rates – [Link]

Infineon’s Security Chip


by Martin Cooke @ elektormagazine.com:

Protection of Intellectual Property is a major issue as industrial systems become increasingly more interconnected. According to Bartol Filipovic, head of the Product Protection and Industrial Security department at the Fraunhofer Institute for Research “Most companies have no idea just how easy it is to copy their products, encrypted software is not enough to protect standard products or machine code. The software must be ideally stored inside protected hardware.”

Infineon has developed a broad range of semiconductor technologies to counter these growing security threats. The OPTIGA Trust E SLS32AIA hardware security device provides a cost effective solution for high value goods. It forms part of the OPTIGA™ Trust family high-security solution for industrial automation systems, smart homes, consumer and medical devices. The OPTIGA™ Trust E provides enhanced protection of services, business models and user experience. Based on its 1-way authentication mechanism, it uniquely identifies objects and provides protection of Public Key Infrastructure (PKI) networks.

Infineon’s Security Chip – [Link]

Site enables detailed component comparisons


by Sagar Savant @ edn.com:

Choosing components is a series of time-consuming tasks, from surveying the market for possible candidates to properly evaluating performance. As a hardware engineer who has worked in Silicon Valley for 10 years, I have spent significant time developing test plans and specs, building fixtures, and testing components. One of the reasons comparing components takes a long time is because you can’t always rely on datasheets to give you the information you need. The problem with datasheets is that they only tell you the story the vendor of the component wants. If an IC characteristic is better under specific conditions, you can be sure the vendor will showcase their components under those conditions.

Site enables detailed component comparisons – [Link]

Homemade breadboard


by robertgawron.blogspot.com:

A breadboard can be also made at home, from one side, it will be more expensive than those on the markets, but for another side, it’s possible to add commonly used elements, like LEDs, switches, or other things, for example I added a precision IC socket that makes putting in and out of ICs much easier. Choosing what to put there is a bit like a making homemade pizza, one can put anything he likes (and what he has currently in the fridge).

Homemade breadboard – [Link]