Tag Archives: SSD

Intel Optane, Intel’s Next-Generation SSD Technology

In July 2015, Intel and Micron Technology announced a new technology for memory and storage solutions called “3D XPoint™ technology“. It is a new category of nonvolatile memory that addresses the need for high-performance, high-endurance, and high-capacity memory and storage.

Now Intel had produced its Optane™ technology that provides an unparalleled combination of high throughput, low latency, high quality of service, and high endurance. The new technology is a special combination of 3D XPoint™ memory media, Intel Memory and Storage Controllers, Intel Interconnect IP and Intel® software.

From system acceleration and fast caching to storage and memory expansion, Intel Optane delivers a revolutionary leap forward in decreasing latency and accelerating systems for workloads demanding large capacity and fast storage.

3D-Xpoint memory structure, Source: Intel Corp

The first product with this technology is the Intel Optane SSD DC P4800X. It is a 375GB add-in card that communicates via NVMe over a four-lane PCIe 3.0 link, and it is available for $1,520 or $4.05 per GB.

Optane™ storage could be used in many sectors and domains. It will help healthcare researchers to work with larger data sets in real-time, financial institutions to speed trading, and retailers to identify fraud detection patterns more quickly. Optane™ technology can also be used at home to optimize personal computer for immersive gaming experience.

The 3D XPoint innovative, transistor-less cross point architecture creates a three-dimensional checkerboard where memory cells sit at the intersection of words lines and bit lines, allowing the cells to be addressed individually. As a result, data can be written and read in small sizes, leading to fast and efficient read/write processes.

Memory cells are written or read by varying the amount of voltage sent to each selector. This eliminates the need for transistors, increasing capacity and reducing cost. The initial technology stores 128Gb per die across two stacked memory layers. Future generations of this technology can increase the number of memory layers and/or use traditional lithographic pitch scaling to increase die capacity.

3D XPoint Technology Wafer

You can get more detailed information about 3D Xpoint and Intel Optane technologies through their official websites. You can also take a look at these two Intel P4800X reviews; Billy Tallis fromAnandTech and Paul Alcorn from Tom’s Hardware.

SK Hynix Introduces Industry’s Highest 72-Layer 3D NAND Flash

SK Hynix Incorporated introduced the world’s first 72-Layer 256Gb (Gigabit) 3D (Three-Dimensional) NAND Flash based on its TLC (Triple-Level Cell) arrays and own technologies. This company also launched 6-Layer 128Gb 3D NAND chips in April 2016 and has been mass producing 48-Layer 256Gb 3D NAND chips since November 2016. Within 5 months the researchers in SK Hynix developed the new technology of producing 72-layer 3D NAND flash.

3D NAND flash 72 layers
72 layers 3D NAND flash

The technological achievement of this 72-Layer 3D NAND is compared to the difficulty of building approximately 4 billion 72-storied skyscrapers on a single dime. Well, now the question maybe, “Is the difficulty and complexity of this new technology giving any remarkable outcome?”. The answer is a big YES. The 72-layer NAND is said to stack 1.5 times more cells than the 48-layer, achieving 30% more efficiency in productivity and 20% higher read/write performance than a 48-layer 3D NAND chip, the predecessor of this 72-layer .D 256Gb NAND flash.

With this new chips having 30% more efficiency in productivity and 20% higher performance, SK Hynix has been currently developing NAND Flash solutions such as SSD (Solid State Drive) and storage for mobile devices such as smartphones. Having high reliability and low power consumption this 3D NAND flash should be an ideal solution for storage problems of mobile devices.

SK Hynix plans to expand the usage of the product to SSDs and mobile gadgets to further improve its business structure weighted towards DRAM. The vice president Jong Ho Kim said in the press release,

With the introduction of this industry’s highest productivity 3D NAND, SK Hynix will mass produce the 256Gb 3D NAND in the second half of this year to provide this to worldwide business clients for optimum use in storage solutions

According to a market research, 3D NAND flash demand is rapidly increasing across AI(Artificial Intelligence), big data, and cloud storage. The research by Gartner says that NAND Flash market revenue is expected to total USD 46.5 billion in this year and it will grow up to an amount of USD 56.5 billion in 2021.

Multi-Function SSD Shield for the Raspberry Pi 2

SSD_Rasp_Shield

We came across this kickstarter campaign that features a multifunction SSD shield for Raspberry Pi 2. The shield includes SSD, WiFi, RTC w/Battery and high power USB:

Pi 2 Design is excited to introduce the first offering in a new line of Embedded and Media-based I/O shields for the popular Raspberry Pi 2. The CSB502SSD Multi-Function Solid State Drive shield allows users to create a low cost, high performance, embedded network storage device. The powerful combination of the CSB502SSD and the Raspberry Pi 2 lets you leverage the ever expanding RPi 2 ecosystem for a wide variety of Embedded, Data Storage, Medical and Industrial applications.

Multi-Function SSD Shield for the Raspberry Pi 2  – [Link]