Munich-based high-tech startup Toposens is releasing its 3D Ultrasonic Echolocation Sensor ECHO ONE
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Munich-based high-tech startup Toposens is releasing its 3D Ultrasonic Echolocation Sensor ECHO ONE

The Munich based high-tech startup Toposens is announcing the market launch of its first commercial Toposens 3D COLLISION AVOIDANCE SYSTEM for mobile robots based on the proprietary Toposens 3D ultrasonic echolocation technology. This represents a key milestone for the company following...

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Broadcom AFBR-S4N44P164M 4×4 NUV-MT Photo Multiplier Array
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Broadcom AFBR-S4N44P164M 4×4 NUV-MT Photo Multiplier Array

The Broadcom/Avago AFBR-S4N44P164M 4×4 NUV-MT Photo Multiplier Array features encapsulation achieving excellent mechanical stability and robustness. A clear epoxy mold compound realizes these features, which is highly transparent down to UV wavelengths, resulting in a broad response in...

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Meet the First High-Resolution Module for 3D Depth Sensing and Vision Systems
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Meet the First High-Resolution Module for 3D Depth Sensing and Vision Systems

Analog Devices has unveiled a robust high resolution, indirect Time-of-Flight (iToF) module for 3D depth sensing and vision systems -- the first ever in the industry. “Machine vision needs to make the leap to perceiving smaller, more subtle objects faster in industrial environments...

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New Ultrasonic Transceivers Feature IP Ratings and Higher Frequencies
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New Ultrasonic Transceivers Feature IP Ratings and Higher Frequencies

CUI Devices’ Sensors Group today announced the expansion of its ultrasonic sensors product line with a range of new ultrasonic transceiver models. Featuring ingress protection ratings of IP67 or IP68 and high frequency ratings up to 400 kHz, these ultrasonic transceivers boast...

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Brookman Technology develops a three-dimensional range image sensor for up to 30 meters
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Brookman Technology develops a three-dimensional range image sensor for up to 30 meters

Japanese communications and embedded device manufacturer, Brookman Technology, collaborated on using a hybrid Time-of-Flight method developed by Prof. Shoji Kawahito of Shizuoka University. The collaboration has led to the (as claimed) "world's first" next-generation 3D Time-of-Flight...

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Coreless Current Sensors with High Accuracy and TMR Elements Suitable for EV Charging Infrastructure
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Coreless Current Sensors with High Accuracy and TMR Elements Suitable for EV Charging Infrastructure

Murata has announced the new MRD series of open-loop current sensors that integrates high-performance tunnel magneto-resistive (TMR) elements - enabling precision measurement with regard to both DC and AC currents up to 40A, along with maintaining stable characteristics across an...

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Two-axis inclinometer for harsh environments eliminates need for recalibration
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Two-axis inclinometer for harsh environments eliminates need for recalibration

The new SCL3400 MEMS inclinometer from Murata is suitable for industrial applications that require high stability, accuracy and reliability. Featuring minimal offset drift of ≤0.12° over its lifetime, the SCL3400 can be used in isolated locations with little or no maintenance, as no...

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Metalenz and STMicroelectronics collaboratively announce the world’s first optical metasurface technology
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Metalenz and STMicroelectronics collaboratively announce the world’s first optical metasurface technology

Metalenz, the fabless semiconductor company, and the Swiss semiconductor manufacturing company STMicroelectronics announced the VL53L8 direct Time-of-Flight (dToF) sensor, a market debut of the meta-optics devices developed through their partnership. The meta-optics technology by...

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