Choosing the right Surface Finish for Chip on Board assembly is crucial. One of the most frequent questions we are asked at KingCredie Technologies is how should my PCB be plated in order to ensure wire bond-ability. PCB Plating for Chip on Board Assembly must be planned in advance to ensure manufacturability of the device. This planning begins with design rules and selecting the wire bond method to be used. Common wire bond materials include aluminum or gold wire.
Aluminum Wedge Wire Bonding and ENIG Plating
One of the most common wire bond methods for COB assembly is aluminu
Choosing the right Surface Finish for Chip on Board assembly is crucial. One of the most frequent questions we are asked at KingCredie Technologies is how should my PCB be plated in order to ensure wire bond-ability. PCB Plating for Chip on Board Assembly must be planned in advance to ensure manufacturability of the device. This planning begins with design rules and selecting the wire bond method to be used. Common wire bond materials include aluminum or gold wire. Aluminum Wedge Wire Bonding and ENIG Plating One of the most common wire bond methods for COB assembly is aluminu