book suggestions for PCB layout design

D

David

Jan 1, 1970
0
Does anybody have any suggestions for good books to help with the process of
physically laying out a board, especially for non-RF applications ? I know
there are good app notes from IC manufacturers for high speed circuit
layout, and I've read a bunch of them over the years, but I'm looking for
guidelines like:

board materials and thicknesses
trace widths and trace separation
how wide and thick a trace needs to be for a given current
what all the different layers really mean to the manufacturing process
what all the output files mean in the manufacturing process
types of vias
copper thicknesses
layer organization tips
techniques for reducing board manufacturing costs
 
P

PaulCsouls

Jan 1, 1970
0
Does anybody have any suggestions for good books to help with the process of
physically laying out a board, especially for non-RF applications ? I know
there are good app notes from IC manufacturers for high speed circuit
layout, and I've read a bunch of them over the years, but I'm looking for
guidelines like:

board materials and thicknesses
trace widths and trace separation
how wide and thick a trace needs to be for a given current
what all the different layers really mean to the manufacturing process
what all the output files mean in the manufacturing process
types of vias
copper thicknesses
layer organization tips
techniques for reducing board manufacturing costs


High Speed Digital Design, A Handbook of Black Magic by Howard Johnson
and Martin Graham
 
T

Terry Given

Jan 1, 1970
0
PaulCsouls said:
High Speed Digital Design, A Handbook of Black Magic by Howard Johnson
and Martin Graham

excellent book.

Printed Circuits handbook, Clyde F. Coombs has a whole bunch of goodies.

One of the best techniques I have found is to lay out a truly ratshit
PCB, then spend 3 weeks making it work.

current charts are available on-line. look harder.


Cheers
Terry
 
D

David L. Jones

Jan 1, 1970
0
David said:
Does anybody have any suggestions for good books to help with the process of
physically laying out a board, especially for non-RF applications ? I know
there are good app notes from IC manufacturers for high speed circuit
layout, and I've read a bunch of them over the years, but I'm looking for
guidelines like:

board materials and thicknesses
trace widths and trace separation
how wide and thick a trace needs to be for a given current
what all the different layers really mean to the manufacturing process
what all the output files mean in the manufacturing process
types of vias
copper thicknesses
layer organization tips
techniques for reducing board manufacturing costs

You might find my PCB Design Tutorial useful:
http://www.alternatezone.com/electronics/pcbdesign.htm

Dave :)
 
Top