D
David
- Jan 1, 1970
- 0
Does anybody have any suggestions for good books to help with the process of
physically laying out a board, especially for non-RF applications ? I know
there are good app notes from IC manufacturers for high speed circuit
layout, and I've read a bunch of them over the years, but I'm looking for
guidelines like:
board materials and thicknesses
trace widths and trace separation
how wide and thick a trace needs to be for a given current
what all the different layers really mean to the manufacturing process
what all the output files mean in the manufacturing process
types of vias
copper thicknesses
layer organization tips
techniques for reducing board manufacturing costs
physically laying out a board, especially for non-RF applications ? I know
there are good app notes from IC manufacturers for high speed circuit
layout, and I've read a bunch of them over the years, but I'm looking for
guidelines like:
board materials and thicknesses
trace widths and trace separation
how wide and thick a trace needs to be for a given current
what all the different layers really mean to the manufacturing process
what all the output files mean in the manufacturing process
types of vias
copper thicknesses
layer organization tips
techniques for reducing board manufacturing costs