Recently (2012), a reactive silver ink was developed that has quite good conductivity and sinters at mild temperatures. It is basically a variation of the very old Tollens method for silvering that gives thicker deposits. It would not provide the physical strength of solder, but it might facilitate making 1000+ connections.
Here is a link to the news release:
http://news.illinois.edu/news/12/0112ink_JenniferLewis.html
The abstract originally posted on the ACS site was quite informative and had all the experimental details needed. Unfortunately, that abstract has been taken down. As I recall, the method uses a silver/ammonium/acetate mixture, which upon gentle heating releases ammonia to deposit nano-particles of silver.
I do have the article (at another location) and could abstract the method here, if there is sufficient interest. It will take me a day to retrieve it.
John