Hi
I need to attach a few TO-220 devices on a common (large) heatsink, using mica insulators and thermal compound.
Since the mica insulator is sandwiched between then device and the heatsink, I am little confused where should the thermal compound be applied:
1) between the heatsink and the insulator
2) between the device and the insulator
3) both
I need to attach a few TO-220 devices on a common (large) heatsink, using mica insulators and thermal compound.
Since the mica insulator is sandwiched between then device and the heatsink, I am little confused where should the thermal compound be applied:
1) between the heatsink and the insulator
2) between the device and the insulator
3) both