Hello everyone,
I’ve been working on my PCB designs and wanted to know more about best practices for solder mask application. I understand solder mask plays a crucial role in protecting copper traces and preventing solder bridging, but I want to know about some details when it comes to high-density and reliable designs.
Some key questions I’d love to get insights on:
1) While designing for fine-pitch components (like BGAs and QFNs), how do you determine whether to use solder mask-defined (SMD) or non-solder mask-defined (NSMD) pads?
2) How does solder mask thickness affect impedance control in high-speed designs?
3) Have you experienced any manufacturing challenges when using different solder mask colors (e.g., black, white) in terms of thermal performance
Would love to hear your thoughts and insights on this! Let’s discuss.
I’ve been working on my PCB designs and wanted to know more about best practices for solder mask application. I understand solder mask plays a crucial role in protecting copper traces and preventing solder bridging, but I want to know about some details when it comes to high-density and reliable designs.
Some key questions I’d love to get insights on:
1) While designing for fine-pitch components (like BGAs and QFNs), how do you determine whether to use solder mask-defined (SMD) or non-solder mask-defined (NSMD) pads?
2) How does solder mask thickness affect impedance control in high-speed designs?
3) Have you experienced any manufacturing challenges when using different solder mask colors (e.g., black, white) in terms of thermal performance
Would love to hear your thoughts and insights on this! Let’s discuss.
