Some general information about fluxes, compiled from multiple sources...
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Flux is an acidic material that is designed to clean oxides from the solder joint and help transfer heat to the solder joint. In general, there are four categories of flux.
* Clean (RA): Your traditional flux. Has a highly activated rosin core.
* Clean (RMA): Another traditional type of flux, RMA has more acidic content.
* No-Clean: By far the most common in today's marketplace. There is less flux per volume in wire core solder. No-Clean flux has weaker acid than RMA.
* OA (Aqueous): The acid in OA flux is organic or semi-organic and more active than the acid found in RMA flux.
Flux will affect your solder joint quality.
* Clean (RA or Rosin Activated) flux is highly acidic, but provides instant wetting action, even for difficult to solder metals such as nickel. Leaves residues which can be corrosive if not cleaned and has been known to cause board contamination because of splatter. Higher smoke and caustic odor. Recommended to use RMA or No-clean flux solder instead.
* Clean (RMA or Rosin Mildly Activated) flux is more acidic. Provides wetting action comparable to typical RA fluxes. It leaves heavy residue that needs to be cleaned off the PCB. Lower smoke and odor than RA flux. Pure (99% or greater) Isopropyl Alcohol is the recommended cleaner. Anhydrous (literally meaning "without water") isopropyl alcohol is a non-ODS solvent typically used for removal of partical contamination and inorganic films such as salts, fingerprints, polar soils, white mineral residue, and highly activated fluxes. Parts usually meet dielectric tests immediately after cleaning. Pure Isopropyl Alcohol meets all current Mil-Spec requirements. Rubbing alcohol is typically approximately 1/3rd water by volume and can be used, but is not recommended over Pure Isopropyl.
* No-Clean flux leaves much less residue. After light touch-up with No-Clean, cleaning is not necessary. No-Clean also offers improved wetting capabilities and "cosmetics". If you use No-Cleans, you must lower your tip temperatures. High temperatures will flash No-Cleans right off the board. Smoking varies by brand and odor is typically mild.
* OA (Organically Activated or Aqueous) flux is highly active and water-soluble. Typically used where there are hazardous waste restrictions or when trying to solder difficult metals. Optimal cleanability with minimal smoke and odor. Tip temperatures used are typically lower even than with No-clean fluxes.
Flux greatly affects your solder tip life.
* RMA flux is much better for the solder tip. It stays on the tip longer due to its gummy consistency. While soldering, RMA core solder wire will cover the tip and protect it from oxidation.
* No-Clean flux is much worse for your solder tip. It burns off right away, and there's less of it. Therefore, the tip will oxidize faster.