M
Mr.CRC
- Jan 1, 1970
- 0
Hi:
I have a document which I obsessively revise that contains my formulas
for SMT lands. There is one formula that I can never settle on. It is
for what I call the "land inner bound" (LIB) which is the distance from
the origin on one axis to where the land begins. The land outer bound
(LOB) I have no trouble with. The inner bound is tricky. I base the
LIB and LOB on the lead and/or body dims and tolerances to compute the
land size and location. I use my own formulas mainly because I hand
solder many prototypes, and prefer my own land designs to IPC and
manufacturers recommendations.
In order to come up with a logical argument for how to compute the LIB,
I need to understand more about the manufacturing process for these
packages.
I imagine that the "lead frame" is flat until just before or after the
injection molding process, at which point it is slammed against some die
which bends the leads into the wing shape, and simultaneously snips the
excess length.
The main issue is this: If there is a die, then I expect the tolerances
on the foot sizes to be rather independent of the tolerances of the
plastic body dimensions. In this case, any formula for the LIB should
be based solely on dims. and tolerances for the leads and feet.
Alternately there is a coupling of the dim. tolerances of the feet and
the body dims. I think this is unlikely.
Also, I expect there is a tight coupling of the lead length and the foot
length according to this manufacturing process. Ie., you would expect
that if the lead length is toward its max. tolerance, that the foot
length would be as well, and vice/versa. You would not expect that the
foot length was at its max tol. and the the lead length was minimum.
However, if there was a correlation between body tolerances and the lead
bending process, then the above paragraph might be incorrect.
Perhaps if someone can explain the chip packaging and lead forming
process, we will all be better informed and I might be able to make the
final revision of my LIB formula!
Thanks for comments.
I have a document which I obsessively revise that contains my formulas
for SMT lands. There is one formula that I can never settle on. It is
for what I call the "land inner bound" (LIB) which is the distance from
the origin on one axis to where the land begins. The land outer bound
(LOB) I have no trouble with. The inner bound is tricky. I base the
LIB and LOB on the lead and/or body dims and tolerances to compute the
land size and location. I use my own formulas mainly because I hand
solder many prototypes, and prefer my own land designs to IPC and
manufacturers recommendations.
In order to come up with a logical argument for how to compute the LIB,
I need to understand more about the manufacturing process for these
packages.
I imagine that the "lead frame" is flat until just before or after the
injection molding process, at which point it is slammed against some die
which bends the leads into the wing shape, and simultaneously snips the
excess length.
The main issue is this: If there is a die, then I expect the tolerances
on the foot sizes to be rather independent of the tolerances of the
plastic body dimensions. In this case, any formula for the LIB should
be based solely on dims. and tolerances for the leads and feet.
Alternately there is a coupling of the dim. tolerances of the feet and
the body dims. I think this is unlikely.
Also, I expect there is a tight coupling of the lead length and the foot
length according to this manufacturing process. Ie., you would expect
that if the lead length is toward its max. tolerance, that the foot
length would be as well, and vice/versa. You would not expect that the
foot length was at its max tol. and the the lead length was minimum.
However, if there was a correlation between body tolerances and the lead
bending process, then the above paragraph might be incorrect.
Perhaps if someone can explain the chip packaging and lead forming
process, we will all be better informed and I might be able to make the
final revision of my LIB formula!
Thanks for comments.