J
Joerg
- Jan 1, 1970
- 0
Fred said:Joerg a écrit :
Borderline but... using a low voltage avalanche rated mosfet?
That's what Lasse also mentioned but I'd rather not ...
Fred said:Joerg a écrit :
Borderline but... using a low voltage avalanche rated mosfet?
legg said:That's TO262, SC83, SOT404 - D2pak for a mosfet.
Assuming you have somewhere for the heat to go.....
As for real estate, have you considered wave-side smd component use?
Martin said:Go vertical, make the vertical board part of the main board panel.
Assemble the board as usual and v-score when you assemble it.
E said:DO4 ? (ok, that one is not modern)
More descriptively called 'roach wires' where I come from. IBM used to
call them 'yellow wires' back when you could use wire to run signals in
computers.
Cheers
Phil Hobbs
Phenolic terminal strips and 12AT7s.
Cheers
Phil Hobbs
Jim said:That would be back when computers were wired using punch-down blocks
and wire-wrap ?![]()
Sure; just put a power NPN with low-wattage zener from collector
to base (base/emitter pulldown resistor optional). The good
news: Miller effect is on your side, for once!
Jamie said:Have you looked at TVS diodes?
Rich said:And, with a little care, a zener in one of those little rectangular
packages could be soldered right across the leads!![]()
Well, so far I only found DO-5 for power zeners. Which is very wide
because they designed those for wrench-fastening.
Have you looked at TVS diodes?Joerg said:It's not to generate a controlled voltage but to dump unwanted spike
energy. Without creating smoke
But it looks like it will have to be a FET. Machining a DO-5 package to
a smaller size isn't exactly my favorite method.
E said:NTE makes DO4 NTE5174A thru NTE5232A. Expensive
http://www1.elfa.se/elfa~fi_fi/go.jsp?s=fi-fi&a=48CB877281B7453BE10000000A0A036A
Phil said:So mount it underneath the TO-220 lead bend.
Phil said:I was actually serious...something like a BZT52H-C68 68V Zener should
fit under there, nicely surface mounted, waiting for the TO-220 to be
hand-soldered into its through-hole mounting. Just using through holes
instead of SMT pads should save enough real estate for that.
It could but in this app that would likely be shot down as a
non-approvable kludge ;-)
Spehro said:Actually, machining a semiconductor package down as you suggest is a
FAR more risky move reliability-wise.
Wave-side? I'd have to pipe the heat into some metal, some beefy metal.
legg said:I'm talking about using both sides of your board real estate for the
small stuff. If you're soldering TO262 or TO220AC bodies, presumably
in a wave soldering their through-hole leads (TO252 DPAK has smd leads
for reflow), the wave-side real estate could harbour resistors, zener,
caps and other 'smd' parts that are processed in the same wave
operation.
That would be back when computers were wired using punch-down blocks
and wire-wrap ?![]()