M
markp
- Jan 1, 1970
- 0
Hi All,
I recently potted some electronics using an epoxy with a filler to increase
thermal conductivity and reduce the thermal expansion co-efficient. However,
I had a problem later with some calibrated circuitry drifting. I did not
conformally coat the board before potting, which I think was a mistake!
There are issues with glass temperature and thermally induced stress in
surface mounted components too that I'd like to address. Operating temp
is -40degC to +80degC.
I don't want to risk any of this happening again, and so I'm considering
potting in a polyurethane based compound with a low Tg this time,
conformally coating the board, and to be extra safe putting a thin layer of
neutral RTV silicone over the top of the calibrated components. Any views on
whether the RTV itself might cause problems? Is it necessary? Any other
comments?
Thanks for your help, any comments welcome.
Mark.
I recently potted some electronics using an epoxy with a filler to increase
thermal conductivity and reduce the thermal expansion co-efficient. However,
I had a problem later with some calibrated circuitry drifting. I did not
conformally coat the board before potting, which I think was a mistake!
There are issues with glass temperature and thermally induced stress in
surface mounted components too that I'd like to address. Operating temp
is -40degC to +80degC.
I don't want to risk any of this happening again, and so I'm considering
potting in a polyurethane based compound with a low Tg this time,
conformally coating the board, and to be extra safe putting a thin layer of
neutral RTV silicone over the top of the calibrated components. Any views on
whether the RTV itself might cause problems? Is it necessary? Any other
comments?
Thanks for your help, any comments welcome.
Mark.