J
[email protected]
- Jan 1, 1970
- 0
Hi,
I'm looking for some guidelines regarding replacement/substitution of
obsolete components in our products.
Currently the procedure is as follows:
Passive components are evaluated by datasheet, and replaced without
testing in case of matching data.
Semiconductors are evaluated by datasheet, and tested in 5 pcs. of the
product.
The test is a standard functional production test, which basically
consists of a verification of the functionality; signal levels, band
widths, memory addressing etc. No temperature cycling, EMC test or
burn in is performed.
My worry is, that you in case of e.g. a die schrinked SRAM or uP, you
might reduce your margin to an unacceptable level, making the product
more sensible to EMC, temperature or what ever...
How is this qualification done in the industry? E.g automotive?
Thanks
Jesper
I'm looking for some guidelines regarding replacement/substitution of
obsolete components in our products.
Currently the procedure is as follows:
Passive components are evaluated by datasheet, and replaced without
testing in case of matching data.
Semiconductors are evaluated by datasheet, and tested in 5 pcs. of the
product.
The test is a standard functional production test, which basically
consists of a verification of the functionality; signal levels, band
widths, memory addressing etc. No temperature cycling, EMC test or
burn in is performed.
My worry is, that you in case of e.g. a die schrinked SRAM or uP, you
might reduce your margin to an unacceptable level, making the product
more sensible to EMC, temperature or what ever...
How is this qualification done in the industry? E.g automotive?
Thanks
Jesper