HARTING 3D-MID Component Carriers
https://www.electronics-lab.com/harting-3d-mid-component-carriers/
HARTING 3D-MID Component Carriers enable alternative component positioning and mounting utilizing fully automated assembly and soldering. These 3D molded interconnect devices can replace circuit boards utilizing a 3-dimensional circuit on molded plastic. This 3D shape can allow for more compact integration of electrical components into the available space. HARTING 3D-MID Component Carriers utilize a high-temperature […]
Component carriers replace flexible printed circuit boards in linear measuring systems
https://www.electronics-lab.com/component-carriers-replace-flexible-printed-circuit-boards-in-linear-measuring-systems/
HARTING has developed a component carrier that can be used directly with electronic components eliminating manual assembly and replacing flexible PCBs. Increasing precision and reducing assembly costs Component carriers are equipped with measuring sensors for detecting position The component carrier serves as a connecting element between a printed circuit board (PCB) and electronic components (such […]
Electronic assemblies without PCBs but with Laser direct structuring
https://www.electronics-lab.com/electronic-assemblies-without-pcbs-but-with-laser-direct-structuring/
Laser direct structuring (LDS) is a special success story. For almost 20 years, it has been possible to apply electronic conductor paths directly onto plastic parts during series production. Laser Direct Structuring (LDS) – The structure of the conductor path is applied using the LDS process. LDS enables electronic assemblies to be made in flexible […]
HARTING Europe, Component carrier now replacing flexible PCBs
https://www.electronics-lab.com/harting-europe-component-carrier-now-replacing-flexible-pcbs/
Flexible circuit boards offer numerous advantages. However, the mechanical fixation of these circuit boards is highly complex. HARTING has developed a new solution based on 3D-MID technology that is capable of replacing flexible circuit boards. Thanks to component carriers, cost savings of up to two-thirds can be achieved. At the MID process, on the injection […]