HARTING 3D-MID Component Carriers

HARTING 3D-MID Component Carriers

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HARTING 3D-MID Component Carriers enable alternative component positioning and mounting utilizing fully automated assembly and soldering. These 3D molded interconnect devices can replace circuit boards utilizing a 3-dimensional circuit on molded plastic. This 3D shape can allow for more compact integration of electrical components into the available space. HARTING 3D-MID Component Carriers utilize a high-temperature thermoplastic, enabling compatibility with reflow soldering.

Features

  • Universal design of substrate
  • Customized layout for traces
  • High-temperature plastic for reflow soldering
  • Shipped in tape and reel as sub-assembly for fully automated SMT processing

more information: https://www.harting.com/DE/en-gb/company/harting-ag-3d-mid

About mixos

Mike is the founder and editor of Electronics-Lab.com, an electronics engineering community/news and project sharing platform. He studied Electronics and Physics and enjoys everything that has moving electrons and fun. His interests lying on solar cells, microcontrollers and switchmode power supplies. Feel free to reach him for feedback, random tips or just to say hello :-)

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