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hxpcircuit

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  1. hxpcircuit
    Update. 8 layer hybrid PCBMaterial: RO4003C+FR-4 with TG180Copper: 1oz/0.5 oz inner/1ozThickness: 1.4mmENIG, Green solder mask, White legend.Prototyping and Mass production.If you have similar project, please contact me vias [email protected]
  2. hxpcircuit
    3 layer Hybrid Multilayer PCB 107.6*120.44 mm,6pcs/array 1.65 mm thick FR4+RO4350B 10mil 1/0.5/1 oz copper ENIG,Green soldermask top only ,White silkscreen top only 2 layer Long PCB 508*114.3 mm 1.6 mm thick,FR4,2/2 oz copper ENIG,Black soldermask,White silkscreen 8 layer Impedance controlled PCB 96*86 mm,4pcs/array 1.6 mm thick ,Special stack up FR4 TG170 1 oz copper outer layers 0.5 oz copper inner layers ENIG,Red soldermask,White silkscreen
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