I do not think there is an impact or effect when re-working. I was referring to the fact that using the "no clean" process, in my personal experience, causes the need for re-work. The so-called "no need to clean the boards" process causes bad soldering and has to be more thoroughly inspected. In many cases, solder points have to be re-flowed. Many agencies are now developing procedures for cleaning the boards after the "no clean" process to keep down the failure rate. Kind of defeats the purpose in my opinion.
The greatest benefit to the "no clean" process: It was developed so that there was less impact on the environment.
MP