SolidRun’s Fanless Industrial PCs Feature AMD Ryzen AI 300 Mobile AI SoC
https://www.electronics-lab.com/news/solidruns-fanless-industrial-pcs-feature-amd-ryzen-ai-300-mobile-ai-soc/
SolidRun has expanded its modular IPC lineup with the Bedrock RAI300, powered by AMD Ryzen AI 300 processors, targeting edge AI inference with higher NPU performance and fanless cooling.
Geehy G32R430 Cortex-M52 Encoder MCU Integrates ATAN Accelerator and Dual ADCs
https://www.electronics-lab.com/news/geehy-g32r430-cortex-m52-encoder-mcu-integrates-atan-accelerator-and-dual-adcs/
Geehy Semiconductor’s Cortex-M52-based G32R430 targets high-precision encoders with sub-1 µs angle computation, dual 16-bit ADCs, and low-power operation for industrial motion control.
Avalue ECM-ASL3 3.5-Inch SBC Supports Intel Alder Lake-N and Amston Lake SoCs
https://www.electronics-lab.com/news/avalue-ecm-asl3-3-5-inch-sbc-supports-intel-alder-lake-n-and-amston-lake-socs/
This rugged 3.5-inch SBC features Intel N97/i3-N305 processors, triple M.2 expansion, 2.5GbE LAN, and 9-36V input for edge AI applications.
ESP32-S3 Smart 86 Box – A 86-Type IoT Controller With 4-inch Display, Audio, IMU & Battery
https://www.electronics-lab.com/news/esp32-s3-smart-86-box-a-86-type-iot-controller-with-4-inch-display-audio-imu-and-battery-support/
Waveshare's ESP32-S3-based 86-type IoT controller with a 4-inch touch display, audio codec, IMU, Wi-Fi/BLE, and rich expansion for smart panels, HMI, and IoT control systems.
AMD Launches Ryzen AI Embedded P100 and X100 With Up to 50 TOPS AI Power
https://www.electronics-lab.com/news/amd-launches-ryzen-ai-embedded-p100-and-x100-with-up-to-50-tops-ai-power/
AMD is bringing its "Ryzen AI" branding to the embedded sector, with Zen 5 CPUs, RDNA 3.5 graphics, and an XDNA 2 NPU for Edge AI applications.
Quectel i.MX 9 Industrial AIoT Modules Remove RF Complexity for Matter Gateways
https://www.electronics-lab.com/news/quectel-i-mx-9-industrial-aiot-modules-remove-rf-complexity-for-matter-gateways/
Quectel’s new i.MX 9 AIoT modules integrate Wi-Fi 6, Bluetooth 5.4, and 802.15.4 to simplify Matter border routers and industrial edge designs.
CES 2026: Intel Panther Lake-H Powers Vecow TGS-2000 Stackable Edge AI PCs
https://www.electronics-lab.com/news/ces-2026-intel-panther-lake-h-powers-vecow-tgs-2000-stackable-edge-ai-pcs/
Vecow’s compact TGS-2000 series uses Intel Core Ultra Series 3 Panther Lake-H CPUs to deliver up to 100 TOPS AI performance for industrial edge applications.
Banana Pi BPI-SM9 16-ENC-A3 SoM Features SOPHGO BM1688 AI SOC
https://www.electronics-lab.com/news/banana-pi-bpi-sm9-16-enc-a3-som-features-sophgo-bm1688-ai-soc/
The BPI-SM9 16-ENC-A3 pairs the BM1688 AI chip with multimedia and I/O for multi-stream video analytics and edge AI applications.
SiTime ENDR-TTT: A MEMS Super-TCXO for GNSS Holdover and Anti-Spoofing
https://www.electronics-lab.com/news/sitime-endr-ttt-a-mems-super-tcxo-for-gnss-holdover-and-anti-spoofing/
SiTime’s ENDR-TTT Super-TCXO improves GNSS holdover and PNT accuracy with ultra-low drift, wide temperature support, and rugged MEMS performance.
Toshiba TCKE6 Industrial eFuse ICs Features Auto-Retry and Latch Modes
https://www.electronics-lab.com/news/toshiba-tcke6-series-industrial-efuse-ics-features-auto-retry-and-latch-modes/
Toshiba’s TCKE6 40V eFuses ICs replace physical fuses with 1μs response & 52mΩ on resistance. They support 5 to 24V industrial rails in a TSOP6F package.