Thundercomm unveils TurboX C6690 SoM at embedded world 2025

https://www.electronics-lab.com/thundercomm-unveils-turbox-c6690-som-at-embedded-world-2025/

Thundercomm, established in 2016 as a joint venture between Thundersoft and Qualcomm, specializes in advanced technologies such as AI, IoT, 5G, and cloud computing. The company recently introduced its latest system-on-module, the TurboX C6690. The compact module is built on the Qualcomm Dragonwing QCS6690 chip, which is manufactured using advanced 4nm process technology designed to […]