DC Electronic Load – 1A

This is a very precise Electronic Load project built using the ultra-Precision, Low-Noise OPAMP MAX44251 from Analog Devices. The project can sink current from a power source. It can be used as test gear for power supplies, chargers, solar panels, batteries, and DC-DC converters. The resistor R11 acts as a shunt, OPAMPs convert current into voltage, 2nd op-amp, and Q1 MOSFET are used to control the load current. A Multi-turn potentiometer helps to adjust the load current in the range of 0 to 1A. The supply voltage is up to 60V DC. The board works with dual supply +/-15V DC and draws a few milli amps. LM317 regulator provides 12V DC top op-amp and LM337 provides regulated -7V supply to op-amp. At full load, MOSFET Q1 produces lots of heat, and a fan and large heatsink on MOSFET will help cool it down. Users may use a current meter in series to load to display the current. Optional onboard Trimmer potentiometer provided in case external potentiometer is not required.

Features

  • Operating Power Supply Dual 15V DC (+/-15V DC)
  • Load Current 1Amp, Power Supply Up to 60V DC
  • Highly Efficient and Ultra-Precision Current Control
  • On-Board Power LED
  • Barrier Block Connector for Load connection
  • External Or On-Board Trimmer Potentiometer Option for Current Control
  • PCB dimensions: 66.52 x 33.66 mm

Connections and other details

  • CN1: Pin 1 = +Load, Pin 2 = GND
  • CN2: Pin 1 = +15V DC Power Supply, Pin 2 = GND, Pin 3 = +15V Power Supply
  • D1: Power LED
  • PR1: Optional Trimmer Potentiometer (Do Not Use CN3 Potentiometer If this is used)
  • CN3: External Potentiometer Pin 1 = Reference Voltage, Pin 2 = Input, Pin 3 = GND

Schematic

Parts List

NOQNYTYREFDESCMANUFACTURERSUPPLIERSUPPLIER PART NO
11CN12 PIN BARRIER BLOCK CONNECTOR PITCH 9.53MMTE COONECTIVITYDIGIKEYA98495-ND
21CN23 PIN MALE HEADER PITCH 2.54MMWURTHDIGIKEY732-5316-ND
31CN33 PIN MALE HEADER PITCH 2.54MM 5K POTWURTHDIGIKEY732-5316-ND
42C1,C81uF/25V CERAMUC SMD SIZE 1206YAGEO/MURATADIGIKEY
52C2,C9100nF/50V CERAMIC SMD SIZE 0805YAGEO/MURATADIGIKEY
61C310uF/25V CERAMIC SMD SIZE 1210YAGEO/MURATADIGIKEY
71C41uF/80V CERAMIC SMD SIZE 1210YAGEO/MURATADIGIKEY
82C5,C74.7nF/50V CERAMIC SMD SIZE 0805YAGEO/MURATADIGIKEY
92C6,C10100PF/50V CERAMIC SMD SIZE 0805YAGEO/MURATADIGIKEY
101D1LED RED SMD SIZE 0805OSRAMDIGIKEY475-1278-1-ND
114PR1,U2,R9,R10DNP
121Q1IRFP250 TO247 MOSFETVISHAYDIGIKEYIRFP250PBF-ND
132R1,R13240E 1% SMD SIZE 0805YAGEO/MURATADIGIKEY
141R236K 1% SMD SIZE 0805YAGEO/MURATADIGIKEY
151R32.1K 1% SMD SIZE 0805YAGEO/MURATADIGIKEY
161R4100E 1% SMD SIZE 0805YAGEO/MURATADIGIKEY
171R51M 5% SMD SIZE 0805YAGEO/MURATADIGIKEY
184R6,R12,R14,R161K 1% SMD SIZE 0805YAGEO/MURATADIGIKEY
193R7,R8,R1810K 1% SMD SIZE 0805YAGEO/MURATADIGIKEY
201R110.025E/1W 1% SMD SZIE 2512YAGEO/MURATADIGIKEY
211R153.3K 1% SMD SIZE 0805YAGEO/MURATADIGIKEY
221R17680E 1% SMD SIZE 0805YAGEO/MURATADIGIKEY
231U1LM317 DPAKTIDIGIKEY497-1574-1-ND
241U3MAX44251 ANALOG DEVICEDIGIKEYMAX44251AUA+TTR-ND
251U4LM337 DPAKTIDIGIKEY296-21578-1-ND
26APOTMULTI-TURN POTENTIOMETER 5K OHMBOURNSDIGIKEY3590S-1-502L-ND

Connections

Gerber View

Photos

Video

MAX44251 Datasheet

AAEON Unveils the BOXER-6406-ADN: A Compact and Durable Embedded Computer for Smart Factory Applications

AAEON’s newest system targets the smart factory market with high-performance computing in a rugged fanless PC.

Leading provider of embedded PC solutions, AAEON, is delighted to announce the official launch of the BOXER-6406-ADN, a compact and fanless embedded computer built upon the Intel Atom® Processor X Series/Intel® Processor N-series Processor platform.

Designed to cater to the demands of smart factory applications, the BOXER-6406-ADN boasts a range of features that establish it as a remarkably robust choice for industrial projects. Notably, the system boasts an impressive operational temperature range spanning from -20°C to 60°C. Furthermore, it supports a wide voltage input range of 9V to 36V, inclusive of over/under-voltage current protection as well as short-circuit protection. To enhance its durability, the system is equipped with IEC 68-2-27 anti-shock tolerance and advanced anti-vibration capabilities. Lockable I/O connectors have also been incorporated to safeguard against wear and tear.

With dimensions measuring just 186mm x 104.6mm x 49.1mm, the BOXER-6406-ADN’s compact chassis can be easily wall-mounted for convenient deployment. The system relies solely on passive cooling mechanisms, foregoing fan-assisted cooling systems to prevent the accumulation of contaminants when deployed in smart factory settings.

The BOXER-6406-ADN is available in various SKUs, powered by the Intel® Processor N200, Intel® Processor N50, or the Intel Atom® x7211E. These selections were made due to their exceptional combination of power-efficiency and capable processing performance.

For system memory, the BOXER-6406-ADN offers 32GB of DDR5 running at 4800Mhz via SODIMM slot, which gives high-bandwidth data transmission to its collection of industrially conducive interfaces, such as DB-9 and DB-15 ports for RS-232/422/485 and digital I/O functions. On top of this, its I/O also includes two RJ-45 ports for Intel® I226-LM ethernet running at 2.5GbE, dual HDMI, and a total of four USB type-A ports (USB 3.2 Gen 2 x 2, USB 2.0 x 2).

Flexible storage is offered via a 2.5″ SATA drive and an M.2 2280 M-Key, with additional expansion supported by the presence of an M.2 2230 E-Key for Wi-Fi, as well as full-size Mini Card and SIM slots.

AAEON has affirmed that due to its rugged, compact, and fanless construction, coupled with an array of high-speed interfaces, the BOXER-6406-ADN is precisely tailored to the needs of the smart factory market. The company specifically highlights its suitability for applications such as automated guided vehicles (AGVs), edge gateways, and automated manufacturing.

The BOXER-6406-ADN is now available for order via the AAEON eShop and its standard sales channels.

For more information about the BOXER-6406-ADN, please visit its product page.

MYIR Launched ARM SoM based on New-generation TI AM62x Efficient Processors

MYIR has launched a new ARM SoM MYC-YM62X CPU Module based on AM62x (AM625/AM623), the latest Sitara processor from TI, equipped with quad/dual/single Arm Cortex-A53 core (up to 1.4GHz) and single Cortex-M4F core (400MHz). In addition to the AM62x MPU, the MYC-YM62X CPU Module has integrated 1GB/2GB DDR4, 8GB eMMC, 32Kbit EEPROM and PMIC. It carries out a variety of peripheral and IO signals through the 1.0 mm pitch 222-pin Castellated-Hole expansion interface including dual TSN-enabled Gigabit Ethernet ports, USB, MMC/SD, Camera interface, OSPI, CAN-FD and GPMC. It also takes advantage of the AM62x processor to support dual-display and 3D GPU (only for AM625). This makes it particularly suitable for Human-machine Interaction (HMI), Internet of Things (IoT) and Gateway applications.

MYC-YM62X CPU Module (MYC-YM6231 / MYC-YM6252 / MYC-YM6254)

The MYC-YM62X CPU Module measures only 43mm by 45mm. It is capable of running Linux and provided software resources including kernel and driver source code, together with detailed user manuals and documents to help customer start their development rapidly.

MYC-YM62X CPU Module Function Block Diagram

Features of MYC-YM62X CPU Module

  • Dimensions: 43mm x 45mm
  • PCB Layers: 10-layer design
  • Power supply: 5V/1A
  • Working temperature: -40~85 Celsius (industrial grade)
  • TI Sitara AM62x Processor (AM6254/AM6252/AM6231)
    – TI AM6254: 4*[email protected] + Cortex-M4F@400MHz (AM6254ATCGGAALW)
    – TI AM6252: 2*[email protected] + Cortex-M4F@400MHz (AM6252ATCGGAALW)
    – TI AM6231: 1*[email protected] + Cortex-M4F@400MHz (AM6231ASGGGAALW)
    – Two PRU-SS running up to 333MHz
    – 3D GPU graphics accelerator (only for AM625 processors)1GB/2GB DDR4
  • 8GB eMMC
  • 32KB EEPROM
  • 0mm pitch 222-pin stamp hole expansion interface
    • 2 x RGMII
    • 2 x USB2.0
    • 9 x URAT
    • 3 x CAN FD
    • 6 x I2C
    • 5 x SPI
    • 1 x GPMC
    • 2 x LVDS
    • 1 x RGB
    • 1 x MIPI CSI
    • 3 x MCASP
    • 1 x JTAG
    • Up to 143 x GPIOs
  • Linux OS

Note: the peripheral signals brought out to the expansion interface are listed in maximum number. Some signals are reused. Please refer to the processor datasheet and CPU Module pin-out description file.

The MYD-YM62X Development Board is a demo board for evaluating the MYC-YM62X CPU Module. It has a versatile base board to facilitate the expansion from the MYC-YM62X through the 222-pin expansion interface, a rich set of peripherals and interfaces have been brought out such as two RS485, two CAN, two USB 2.0 HOST and one USB 2.0 OTG, two Gigabit Ethernet, one M.2 Socket for USB based 4G/5G LTE Module with two SIM card holders, one Micro SD card slot, one SDIO based WIFI/BT module, one HDMI display interface, one dual-channel LVDS display interface, two single-channel LVDS interfaces, one MIPI CSI camera interface and one audio input/output interface, as well as one 30-pin extension header for GPMC. The MY-CAM003M MIPI Camera Module and MY-LVDS070C LCD Module can be used as options for the MYD-YM62X board which allows customers to acquire a better development experience.

MYD-YM62X Development Board Top-view
MYD-YM62X Development Board Bottom-view
MYD-YM62X Development Board Function Block Diagram

The MYC-YM62X CPU Module is provided with three standard configurations at cost-effective prices. The part MYC-YM6231-8E1D-100-I is pricing at only $29/pc. Discount is to be offered for volume quantities.

MYIR also provides OEM/ODM services to help customers accelerate their time to market and save costs.

More information about the above new products can be found at: https://www.myirtech.com/list.asp?id=730

ADLINK’s COM-HPC module powered by 13th Gen Intel® Core processor offers up to i9, 24 cores, and 36MB cache at 65W TDP

Featuring 1 x16 PCIe Gen5 and up to 16 Performance-cores plus 8 Efficient-cores, the module is ideal for compute-intensive use cases such as test & measurement, medical imaging, and industrial AI

Summary:

  • The ADLINK COM-HPC-cRLS Client type Size C module based on 13th Gen Intel® Core™ processor is available for order with:
    • up to 13th Gen Intel® Core™ i9 processor, 16 Performance-cores, 8 Efficient-cores, and 32 threads
    • up to 128GB DDR5 SODIMM at 4000MT/s
      and 36MB cache (6MB more than predecessors)
    • 1 x16 PCIe Gen 5, 2x 2.5GbE LANs
  • Supporting Intel® TCC, and Time Sensitive Networking (TSN), COM-HPC-cRLS is well-suited for hard-real-time computing workloads required by applications such as industrial automation semiconductor equipment testing, and AI robots

ADLINK Technology Inc., a global leader in edge computing, announces the readily availability of one of its most sought-after Computer-on-Modules based on the latest, 13th Gen Intel® Core™ processors — The COM-HPC-cRLS, a COM-HPC Client type Size C module.

Utilizing Intel’s advanced hybrid architecture, with up to 16 Performance-cores plus 8 Efficient-cores and an increased cache of 36MB, the module demonstrates brilliant performance per watt along with AVX-512 VNNI and Intel® UHD AI inferencing support for realizing diverse edge AI and IoT use cases.

Available with up to 13th Gen Intel® Core™ i9 processor at 65W TDP, the COM-HPC-cRLS provides two 2.5GbE LANs and up to 128GB DDR5 SODIMM at 4000MT/s. Most importantly, it packs 1 x16 PCIe Gen5 lanes that can fulfill the same computing and transmission performance with fewer lanes than its predecessors, and with a bandwidth of up to 32GT/s, in driving next-gen compute-intensive edge innovations.

What’s more, the module offers Intel® TCC (Time-Coordinated Computing) and TSN (Time Sensitive Networking) support. TCC brings precise time synchronization and CPU/IO timeliness within a system, whereas TSN optimizes time precision for synchronized networking between multiple systems. With these two features working coincide with one another, COM-HPC-cRLS can be assured of the timely execution of deterministic, hard real-time workloads with ultra-low latency, making it well fitted for hard real-time computing workloads required by applications such as industrial automation, semiconductor equipment testing, AI robots, autonomous driving, and aviation.

All in all, the ADLINK COM-HPC-cRLS cannot only simplify developers’ application-specific carrier designs and reduce their time to market significantly with PCIe Gen5 but also caters to various future-proof edge AI use cases at all fronts

COM-HPC-cRLS

  • Up to 24 cores (16 P-cores + E-cores), 32 threads
  • 16 PCIe Gen5 lanes, 8 PCIe Gen4 lanes
  • Up to 128GB DDR5 SO-DIMM at 4000 MT/s
  • 2x 2.5GbE LANs
  • AI inferencing (AVX-512 VNNI, Intel® UHD)

ADLINK is also working to provide I-Pi development kits based on the ADLINK COM-HPC-cRLS module for on-the-spot prototyping and referencing.

For more information about the ADLINK COM-HPC-cRLS module, please follow the following link here at adlniktech.com: COM-HPC-cRLS (COM-HPC Client Type)

AAEON Launch MIX-ALND1, an Intel Processor N-series Powered Mini-ITX for Gaming, Machine Automation, and Kiosk Solutions

Hosting an efficient processor platform and diverse range of interfaces, the MIX-ALND1 is ideal for cost-efficient, low-power deployment.

AAEON, a leading producer of industrial motherboards, has released the MIX-ALND1, a versatile Mini-ITX board that supports Intel® Processor N-series CPUs. Powered by either the Intel® Processor N97 or the Intel® Processor N50, the MIX-ALND1 offers users flexible 4800MHz DDR5 system memory via the SODIMM slot. This provides high-bandwidth data transmission for the board’s dual Realtek RTL8111H-CG Ethernet, dual USB 3.2 Gen 2 ports, and numerous internal pin headers providing functions such as RS-232/422/485, Digital I/O, and HD audio.

Highlights include:

  • Intel® Processor N97 or Intel® Processor N50
  • Wi-Fi, 5G, and AI acceleration module support
  • HDMI 2.0 and DP 1.4 (4K @60Hz) + LVDS/eDP
  • SSD-based expandable storage + DDR5 via SODIMM slot

As with all platforms based on the new Intel® Processor N-series, the MIX-ALND1 is equipped with Intel® UHD Graphics. AAEON’s board design takes advantage of this package with an intricate configuration of display options, which consist of HDMI 2.0 and DP 1.4 for resolutions of up to 4K @60Hz, along with an 18/24-bit dual-channel LVDS connector (colay with eDP), resulting in the capacity to support three simultaneous displays.

Like its system memory, the MIX-ALND1’s storage is flexible, with SATA III joined by an M.2 2280 M-Key offering NVMe, PCIe, or additional SATA storage options. Its other expansion slots include an M.2 3042/3052 B-Key and an M.2 2230 E-Key, which support Wi-Fi, 5G, and AI acceleration modules.

Given its efficient processor platform, multiple display configurations, and high density of internal pin connectors, AAEON has earmarked the MIX-ALND1 as a cost-friendly, low-power solution for markets such as machine automation, advanced gaming, and point-of-sale and kiosk machines.

The MIX-ALND1 is now in mass production and available for order via the AAEON eShop and its standard sales channels.

For more information about the MIX-ALND1, please visit our product page.

Mixtile Core 3588E compatible with NVIDIA Jetson TX2 NX carrier boards: 18% OFF Now Available For Pre-orders

Mixtile, the IoT hardware solution provider, has announced Core 3588E as available for pre-orders. Mixtile Core 3588E is a high-performance, low-power System-on-Module (SoM) powered by the RK3588 chipset. Highlights of the product are an 8-core CPU, a 4-core GPU, and up to 6 TOPS performance. The module also has a 260-pin SO-DIMM edge connector compatible with NVIDIA Jetson TX2 NX carrier boards.

As an alternative to the Jetson TX2 NX, Core 3588E outperforms even the Jetson TX2 NX regarding video processing performance. Jetson TX2 NX can only decode 2x 4K@p60 videos and encode 1x 4K@p60 videos, while Core 3588E decodes 8K@p60 and encode 8K@p30. It can handle higher-resolution videos at much faster frame rates compared to Jetson TX2 NX.

Core 3588E also outshines the PCIe design. Jetson TX2 NX only has 2 lanes, and a few undefined pins. Core 3588E creates a PCIe 3.0 4-lane interface, which is four times faster than the 2-lane interface of Jetson TX2 NX. This distinction makes the Core 3588E a better fit for developers looking for improved performance and faster data transfer capabilities.

Pre-Orders

Mixtile currently offers a limited-time discount of 18% off for pre-orders. Prices will increase on August 31.

There are currently two options available for different memory and storage configurations:

  • 4GB memory and 32GB eMMC is available for $109
  • 16GB memory and 128GB eMMC is available for $159

The product is shipped through international airmail, and delivery will start in mid-October.

Product Specifications at a Glance

BSPs for different operating systems are supported, including Android 11, Debian 11, Ubuntu 22.04, and Armbian 23.07. The module also comes with an ARM Mali-G610 MP4 GPU, which delivers top-notch graphics performance. Expect it to seamlessly handle graphic-intensive tasks such as gaming, multimedia rendering, and advanced visualizations.

Mixtile Core 3588E has a built-in NPU of up to 6 TOPS. It can handle a whopping 6 trillion operations per second for AI workloads. Moreover, it’s compatible with several popular AI and deep learning frameworks, including TensorFlow, MXNet, Caffe, and PyTorch.

For detailed specifications of the Core 3588E SoM, you can visit the product page on the official Mixtile website.

Hailo Expands Hailo-8 AI Accelerator Portfolio, Delivering Unprecedented Performance to a Diverse Range of Edge AI Applications

The new Hailo-8 Century and Hailo-8L AI accelerators extend the Hailo-8 offering with a wide-range of AI platforms to enable high performance AI in edge devices ranging from entry level to high-capacity deployments.

Hailo, the pioneering chipmaker of edge artificial intelligence (AI) processors, today announced it has expanded its groundbreaking Hailo-8™ AI accelerator offering following hundreds of successful deployments in customer programs and products. The new high-performance Hailo-8 Century PCIe card line offers up to 208 Tera Operations per Second (TOPS) for most demanding applications, and the Hailo-8L makes advanced AI processing available for entry-level applications. Both product lines are offered at a competitive price compared to the respective category leaders.

“The expansion of our Hailo-8 AI accelerator portfolio is unlocking new opportunities for our customers to harness real-time, power-efficient intelligence in a diverse range of applications and industries,” said Orr Danon, CEO of Hailo. “With the rise of generative AI driven applications, our powerful and cost-efficient solutions bring unmatched AI performance and power efficiency, enabling state-of-the-art transformer-based models such as ViT, CLIP and SAM, at the edge.”

The competitively priced Hailo-8L, with up to 13 TOPS, is designed to support entry-level products requiring limited AI capacity or lower performance. The Hailo-8 Century line, comprising PCIe cards delivering 52 to 208 TOPS, enables demanding applications such as video management systems handling a large number of video streams. The Hailo-8 Century PCIe cards deliver best-in-class power efficiency at 400 FPS per watt on the ResNet50 benchmark model. They are also offering the highest cost efficiency, starting at $249 for the 52 TOPS card, representing up to 70% reduction in edge AI deployment costs. They feature a robust design that supports industrial temperature ranges and ensures compatibility with virtually any environment or application.

“We see the Hailo-8 Century product line as an enabler for many market verticals, such as security, retail and smart cities, which show increasing demand for AI compute power in large camera deployments,” said Tom Larson, President of Velasea. “By offering Hailo-8 Century empowered edge boxes, we offer our customers a cost-effective solution for high performance video analytics at scale.”

Hailo-8 Century and Hailo-8L both boast exceptional low-latency, high-efficiency processing, capable of handling complex pipelines with multiple real-time streams and concurrent processing of multiple models and AI tasks. The expanded portfolio of Hailo-8 products features seamless scalability for future upgrades, as all products are compatible with the same field-proven and comprehensive Hailo-8 software suite.

For reference, the Hailo-8L can run the benchmark classification model ResNet50 at 500 FPS, and the Century high-performance PCIe cards can run this model at up to 10K FPS, outperforming Nvidia’s comparable products in performance, cost efficiency and power efficiency parameters.

“With the power of Hailo-8 now accessible to a wider range of applications and products, catering to both demanding and entry-level use-cases, we are driving the industry forward in an era where efficient, scalable edge AI processing is increasingly important for businesses to achieve their targets using enhanced processing and analytic capabilities with unparalleled speed and accuracy,” Danon concluded. “This significant expansion marks a milestone in delivering seamless real-time intelligence for diverse edge AI applications ranging from security and smart cities to transportation, smart retail, industrial automation, automotive, and beyond.”

The Hailo-8 expansion follows Hailo’s successful launch of the Hailo-15™ vision processor units in Q1 2023, which are currently sampling and integrate unprecedented AI performance directly into cameras, enhancing both video quality and video analytics. Both Hailo-8L and the Hailo-8 Century product lines are available for order. High AI capacity products similar to the Hailo-8 Century are available also from Hailo’s ODM partners Aetina, Lanner, and Mitac.

For more information about Hailo’s AI processors for edge devices, visit hailo.ai.

ASUS IoT announces the Tinker Board 3N

ASUS IoT has announced Tinker Board 3N series, a versatile, Arm-based single-board computer (SBC) that empowers easy system integration, broad adaptability and expandability.

The NUC-sized SBC series is equipped with rich I/O and supports Linux Debian, Yocto, and Android operating systems, presenting an all-new premium option for developers and system integrators’ diverse IIoT projects. Its optimised thermal design simplifies the deployment of embedded applications, ensuring efficient operation in demanding environments.

With its durable and reliable design, Tinker Board 3N offers enhanced computing performance, low power consumption and a wide range of interfaces, so it’s primed and ready for smart manufacturing applications powering the IoT revolution.

Versatile performance and advanced graphics processing

To deliver the raw power and versatility demanded by IIoT applications, Tinker Board 3N is equipped with a 64-bit, quad-core Arm Rockchip RK3568 processor. Built on the Arm v8 architecture, this generates remarkable GPU performance for seamless graphics processing with low power consumption. Exacting in-house tests show that Tinker Board 3N delivers up to 17%-higher GPU performance and up to 31% increase in total UX score, encompassing data security, processing capabilities and image and video processing, Tinker Board 3N excels in IoT gateway, human-machine interfacing (HMI), and factory automation.

Robust and resilient thermal design

In addition to its outstanding computing performance, Tinker Board 3N incorporates several mechanical design enhancements to facilitate embedded application use with flexibility. For example, it features a low-profile pushpin heatsink and SoC placement on the back side for added strength and ease of installation, with its diminutive NUC-scale dimensions allowing for SWaP-constrained space deployment and flexible system integration. It is also engineered to operate smoothly in harsh industrial environments, with an impressive operating-temperature range of -40 to 85°C in order to fulfill industrial automation needs.

Enhanced connectivity for diverse applications

Tinker Board 3N-series devices are equipped with PoE, LVDS, COM, and CAN bus interfaces, along with M.2 E and M.2 B slots to accommodate WiFi 5/6 and 4G/5G expansion modules for cloud computing. The onboard LVDS supports FHD output via dual channels, making it suitable for multiple display solutions, while embedded COM headers and CAN bus can be utilized in diverse applications, such as controllers and robotic arms, expanding the board’s usability. Delivering enhanced computing performance, remarkable expandability and cost-effectiveness, Tinker Board 3N series is perfectly suited for industrial automation and smart factory environments. It fulfills the need for real-time communication, frictionless integration, long-term operation, and stringent revision control, making it an ideal choice for fulfilling the demands of versatile applications in these settings.

Support for the latest operating systems

Tinker Board 3N supports a variety of the latest and mainstream operating system platforms, catering to different development environment needs. Users can choose from Linux Debian, Yocto, and Android operating systems. The latest ASUS IoT SBC supports firmware over the air (FOTA) for both Android and Linux, ensuring regular software updates and system maintenance for efficient and optimal performance.

Tinker Board 3N is available in three distinct flavors to meet diverse project requirements. These include Tinker Board 3N PLUS, Tinker Board 3N and Tinker Board 3N LITE.

Vishay VCSEL-Based Reflective Optical Sensor Saves Space, Delivers Improved Performance

Offered in Compact 1.85 mm by 1.2 mm by 0.6 mm SMD Package, Device Features CTR of 31 %, Sensing Distance of 15 mm, and Lower Power Consumption.

The Optoelectronics group of Vishay Intertechnology, Inc. today introduced a new reflective optical sensor for industrial, computer, consumer, and mobility applications. Saving space compared to previous-generation solutions — while delivering improved performance with a higher current transfer ratio (CTR), increased sensing distance, and lower power consumption — the Vishay Semiconductors VCNT2030 features a vertical-cavity surface-emitting laser (VCSEL) and a silicon phototransistor in a miniature 1.85 mm by 1.2 mm by 0.6 mm surface-mount package.

The device released today features a compact construction in which the emitting light source and detector are arranged in the same plane. It offers excellent internal crosstalk suppression due to the VCSEL’s narrow ± 17°emission angle, which also enables improved proximity performance behind cover glass. The VCNT2030’s analog output signal at the phototransistor is dependent on the amount of light emitted by the VCSEL and reflected off an object in the sensor’s field of view. The device offers a sensing distance of 15 mm, which is three times higher than the closest competing device on the market.

With its compact footprint, the VCNT2030 saves > 40 % PCB space compared to previous-generation devices, allowing the sensor to serve as a space-saving solution for optical switching in industrial infrastructure, home and building controls, notebook and desktop computers, home appliances, consumer electronics, and metering applications; optical encoding for motor control in e-bikes, golf carts, tractors, and harvesters; and paper presence detection in printers and scanners. In these applications the low 8 mA driving current of the device’s VCSEL is enough to achieve the same performance as solutions using 20 mA infrared emitters, dramatically lowering power consumption.

The sensor offers a detection range of 0.3 mm to 6 mm, an emitter wavelength of 940 nm, and a typical output current of 2.5 mA, which represents a typical CTR of 31 % under test conditions. This value is > 100 % higher than previous-generation solutions and the closest competing sensor. The device features a Moisture Sensitivity Level (MSL) of 3 for reflow soldering according to J-STD-020. It is RoHS-compliant, halogen-free, and Vishay Green.

Samples and production quantities of the VCNT2030 are available now, with lead times of eight to 16 weeks.

Nexperia unveils industry’s first coin cell battery life and power booster

The NBM7100 and NBM5100, are revolutionary new types of battery life boosting ICs designed to extend the life of a typical non-rechargeable lithium coin cell battery by up to 10x compared to competing solutions while also increasing its peak output current capability by up to 25x compared to what a typical coin cell can deliver without a battery booster. This unrivaled extension in working life will significantly reduce the amount of battery waste in low-power Internet of Things (IoT) and other portable applications while making coin cells a viable power source for applications that could previously only operate from AA- or AAA- batteries.

The NBM7100A/B contains two stages of high-efficiency DC-DC conversion and an intelligent learning algorithm. The first stage DC-DC conversion transfers energy from the lithium battery at a low constant current to a capacitive storage element. Once charged, a second DC-DC conversion cycle utilizes this stored energy to supply a regulated voltage with high pulse load current capability on the VDH output pin. The battery is never directly subjected to large load pulse currents, resulting in a longer, more predictable battery lifetime.

Key features

  • Extends useful battery life of coin cell-powered IoT devices
  • Regulated output voltage powers RF circuits requiring high pulse current
  • Low standby current minimizes battery drain
  • Protection against battery voltage dips (brown-out)

Additional features

  • Programmable constant battery load current: 2 to 16 mA
  • Protection against battery voltage dips (Brown-out)
  • Pulse load output current: ≤ 200 mA
  • Regulated programmable output voltage VDH: 1.8 V to 3.6 V
  • Ultra-low standby current: < 50 nA
  • Typical conversion efficiency of > 90% with adaptive optimization
  • 63 adaptive load optimization settings
  • Integrated fuel gauge
  • Small 16 pin lead-free package (SOT763-1/DHVQFN16; 2.5 mm × 3.5 mm × 0.85 mm)
  • Specified from -40 °C to +85 °C

more information: https://gr.mouser.com/pdfDocs/IntelligentBatteryLifeBoosterICmakesPoweringtheIoTLeanerandGreener_EfficiencyWins2.pdf

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