STMicroelectronics has introduced a new software package called X-CUBE-AWS-H5 as part of its STM32Cube development tools. This software is designed to make it easier to connect high-performance Internet of Things (IoT) devices to the Amazon Web Services (AWS) cloud platform.
The STM32H5 series microcontrollers are powerful devices commonly used in IoT applications. These microcontrollers act as “end devices” in IoT systems, meaning they are the devices that collect data or perform specific functions within an IoT network. However, connecting these devices securely to the AWS cloud can be a complex task due to the need for data protection and secure communication.
STMicroelectronics has addressed this challenge by releasing the X-CUBE-AWS-H5 expansion package. This software package includes a collection of libraries and application examples tailored for the STM32H5 microcontrollers. Its primary purpose is to simplify and secure the process of connecting these devices to AWS IoT Core, which is Amazon’s cloud service designed for IoT applications.
“The STM32H5 is ready for the next generation of IoT edge devices, bringing the performance to handle complex applications within a tight energy budget,” says Daniel Colonna, STM32 Marketing Director, STMicroelectronics. “The STM32Cube ecosystem helps developers unleash its powerful capabilities, accelerate development, and, with our latest software, connect securely to the powerful storage and data-analytics services in the AWS cloud.”
Key benefits of the X-CUBE-AWS-H5 expansion package include:
Simplicity: It provides pre-built libraries and examples, making it easier for developers to implement secure connections between STM32H5-based IoT devices and AWS IoT Core.
Security: The software leverages ST’s Secure Manager to enhance the security of the IoT device’s connection to AWS IoT Core, ensuring that data remains protected during transmission.
Efficiency: STM32H5 microcontrollers are known for their high performance, and this software package takes advantage of their capabilities to ensure efficient data exchange between IoT devices and the AWS cloud.
The solution allows for remote provisioning and administration of security credentials. This means that during the production of devices and even after they are deployed in the field, security credentials and configurations can be managed and updated remotely. Third-party service providers can facilitate this process, making it easier for manufacturers and operators to maintain the security and functionality of their IoT devices.
Quectel Wireless Solutions, a global provider of IoT solutions, has introduced a new product called the EG800Q-NA, a module designed for IoT applications across the North American market. The product is described as an LTE Cat 1 bis module, a specific LTE category specifying certain capabilities and performance characteristics. The module is powered by the Qualcomm QCX216 LTE IoT modem developed for wireless communication.
The module is highlighted for its small physical size, which is significant in IoT applications where space is often limited. It offers a maximum downlink data rate of 10Mbps (download speed) and an uplink rate of 5Mbps (upload speed). These data rates are crucial for various high-performance IoT applications.
The module’s support for Cat 1 bis technology means it can operate with a single antenna. This helps in balancing the cost of deployment and maintaining good performance. It is particularly useful for IoT devices that need to be compact and cost-effective. The EG800Q-NA is designed to support a wide range of applications, including smart utility meters, asset trackers, electric mobility (e-mobility), parking meters, and home automation.
“We’re thrilled to introduce the EG800Q-NA module to our customers in North America,” says Norbert Muhrer, president and CSO at Quectel Wireless Solutions. “As one of the pioneering modules built upon the Qualcomm QCX216 LTE IoT Modem, it perfectly caters to a wide range of mid-range applications and deployment scenarios where dependable and economical communication solutions are essential.”
The module is designed to be highly compatible with various wireless networks, which is crucial for IoT devices connecting to diverse communication networks. The EG800Q-NA is adaptable to different regions, which means it can work effectively in various parts of the world. This adaptability is essential as different regions may have different network standards and frequencies.
The module supports a range of robust internet protocols and industry-standard interfaces, including USB 2.0, UART (Universal Asynchronous Receiver-Transmitter), I2C (Inter-Integrated Circuit), PCM (Pulse-Code Modulation), and USIM (Universal Subscriber Identity Module). These interfaces and protocols enhance its versatility, making it suitable for a wide range of IoT applications, such as asset management, remotely managed access control (RMAC), and smart grid solutions.
For more information on the Quectel EG800Q-NA module, head to the official product page.
SparkFun has developed DataLogger IoT based on the company’s original DataLogger IoT 9DoF compromise of the STMicroelectronics ISM330DHCX and MEMSIC MMC5983MA. The all-new DataLogger IoT is a device designed to log various data types, such as GPS coordinates, pressure, humidity, and distance measurements.
The device can automatically detect and configure Qwiic sensors, making it easy to connect and use a variety of sensors without manual setup. It can log data from sensors and GNSS (Global Navigation Satellite System) receivers. This means it can capture data from multiple sources simultaneously.
The logged data can be saved in standard formats like CSV (Comma-Separated Values) or JSON (JavaScript Object Notation), making it easy to analyze and work with the recorded information. The user can store the logged data on a microSD card or send it wirelessly to an Internet of Things (IoT) service of your preference.
The device can time-stamp the data when it’s synchronized with time sources like NTP (Network Time Protocol), GNSS (Global Navigation Satellite System), or RTC (Real-Time Clock). This ensures accurate time information for your logged data.
The DataLogger IoT offers a high degree of configurability, meaning you can customize its settings to suit your specific needs. To interact with the DataLogger IoT’s configuration settings, you need to connect it to a computer using a USB-C cable. After connecting the device, you’ll need to open a serial terminal program on your computer. The serial terminal communicates with the DataLogger IoT using a specific baud rate of 115200 bits per second.
Once the serial terminal is open and connected, the data being logged by the DataLogger IoT is automatically streamed to the terminal window. To configure the DataLogger IoT, you can access the configuration menu by pressing any key within the terminal window.
The device comes with MicroSD card compatibility. Specifically, it supports 4-bit SDIO with microSD cards formatted as FAT32 and the older FAT16 (FAT) formats, up to a capacity of 32 gigabytes (GB).
The DataLogger IoT offers flexibility in data logging intervals. It can be configured to take readings as frequently as 26 times a second with the default sensors activated or as infrequently as one reading every 24 hours. This level of control allows users to adjust the logging frequency based on the specific requirements of their application.
The SparkFun DataLogger IoT is $20.00 cheaper than the original 9DoF version. For interested engineers, the device is currently available for purchase on SparkFun’s official product page at $54.95.
Qualcomm has announced the expansion of the S3 Gen2 Sound Platform, which includes a set of audio technologies and hardware components that focus on delivering high-quality audio experiences. This expanded portfolio is specifically designed for the use in dongles and adapter, which are small devices that can be connected to various source devices like phones, laptops, and TVs.
The expanded portfolio includes support for Snapdragon Sound Technology. Snapdragon Sound is the company’s audio technology designed to provide high-quality wireless audio experiences. This technology is known for its audio quality and low latency.
One of the key features of this expanded platform is its optimization for low latency. Latency refers to the delay between an audio signal being transmitted and received. In this case, the goal is to achieve latency below 20 milliseconds (ms). This low latency is crucial for gaming audio because it ensures that in-game sounds are synchronized with the on-screen action, creating a more immersive and lag-free gaming experience.
“With every generation of Snapdragon Sound, we have driven down latencies and improved audio quality, and with this latest addition to our Qualcomm S3 Gen 2 Sound portfolio, we are providing our best wireless gaming experience yet,” says Mike Canevaro, director, marketing, and head of Snapdragon Sound, Qualcomm Technologies, Inc.
The platform supports LE Audio, which is Low Energy Audio, a wireless audio technology standard that is designed to be energy-efficient and is often associated with Bluetooth technology.
The platform allows Original Equipment Manufacturers (OEMs) to incorporate a feature called Auracast broadcast audio functionality into their dongles and adapters. Auracast enables audio broadcasting from a source device to multiple receivers or speakers, providing a more immersive and shared audio experience.
For music enthusiasts, the solution offers 24-bit 96kHz high-resolution Bluetooth streaming. This high-quality streaming is possible through Snapdragon Sound and Qualcomm aptX Adaptive audio technology.
“Our research also showed huge consumer anticipation for audio sharing use cases that can now be enabled by Auracast Broadcast, including easily sharing audio with multiple friends or family from your phone or laptop, or listening in to wirelessly streamed Auracast audio in public places,” Canevaro continues.
Worcester Polytechnic Institute has developed an experiential robotics platform (XRP), a comprehensive robotics system, as part of their OpenSTEM platform. The purpose of the solution is to offer a solution for hands-on experience in the field of robotics, mainly aimed at middle and high school students and beginners.
The experiential robotics platform currently listed on SparkFun offers a structured learning path that starts with fundamental robotics concepts and gradually progresses to more advanced topics. Users can learn about robotics basics, driving, line following, sensor usage, robotic arm operation, and even autonomous robot development. The platform includes all the critical components and resources required to build and program a robot capable of performing several tasks, from basic to advanced.
The platform includes a coding environment that supports various programming languages and tools. This includes Blockly, a visual programming language suitable for beginners, Python for more advanced programming, and WPILib, a coding development tool commonly used in FIRST Robotics.
The hardware kit is designed to be easy to assemble without requiring specialized tools, soldering, or screws. This feature ensures that users can quickly and safely build their robots. The platform offers a variety of online activities and modules that are designed to be educational and engaging. These resources will likely cover many robotics-related topics and can be accessed remotely.
The central component of the kit is the XRP controller board that contains an onboard Raspberry Pi Pico W, which features the RP2040 microcontroller. The Raspberry Pi Pico is a powerful microcontroller that can be programmed to control various aspects of the robot. It can handle tasks like sensor data processing and motor control.
The kit includes a 6-DoF (Degrees of Freedom) IMU with a low-power accelerometer and gyroscope. This sensor allows the robot to detect its orientation and movement in three-dimensional space. The kit is equipped withtwo dual-channel motor drivers, which can control up to four motors in total. These motor drivers enable precise control of the robot’s movement.
The Qwiic connector is a convenient feature for easily integrating additional sensors and accessories into the robot. It simplifies the process of connecting and expanding the robot’s capabilities.
A battery holder is included to power the robot. The robot is normally powered by four AA batteries, but it can also be powered by an external supply of up to 11V via the barrel connector. This kit provides all the essential hardware components needed to build a functional robot for the Experiential Robotics Platform (XRP).
For interested engineers, the board is currently available for purchase on SparkFun’s official product page for $114.95.
e-con Systems™, with over two decades of experience in designing, developing, and manufacturing OEM cameras, has recently launched STURDeCAM31 – a 3MP GMSL2 HDR IP69K camera powered by Sony® ISX031 sensor for NVIDIA® Jetson AGX Orin™. Designed for automotive grade, this small form factor camera has been engineered to make autonomous mobility safer by ensuring reliable and superior imaging quality even in challenging outdoor lighting conditions.
Leveraging Sony ISX031’s sub-pixel HDR technology, STURDeCAM31 has been fine-tuned to provide impressive HDR performance of up to 120 dB and LFM, thereby providing a solution for capturing dynamic scenes without motion blur. With the reliable GMSL2 interface, this rugged camera meets IP69K standards, ensuring durability and protection against dust, water, high temperature, high pressure, heavy vibration, and shock.
e-con Systems’ STURDeCAM31 is compatible with NVIDIA® Jetson AGX Orin™ system on modules, offering synchronized multi-camera solutions that can support up to eight cameras through the GMSL2 interface. This powerful combination of STURDeCAM31 and NVIDIA Jetson Orin platform for edge AI and robotics is a game changer in the autonomous mobility industry, especially for ADAS, delivery robots, autonomous agriculture vehicles, etc.
“In a rapidly evolving market with surging demand for autonomous mobility in challenging outdoor lighting conditions, whether it be robotics or automotive vehicles, STURDeCAM31 emerges as the perfect fit. Through its superior HDR and LFM capabilities, we are transforming mobility and enhancing global safety. Our IP69K-rated cameras set a new benchmark for reliability, ruggedness, and performance, effortlessly enduring the rigors of high vibrations, shocks, dust, and water environments. In collaboration with NVIDIA, we stand at the forefront of pioneering a safer future through cutting-edge imaging technology.“ said Gomathi Sankar, Business Unit Head-Industrial Cameras at e-con Systems.
Introduction Video
Key features of STURDeCAM31:
120 dB HDR – Leveraging sub-pixel HDR technology, it enables HDR performance of up to 120 dB and LFM – eradicating motion blur and the occurrence of underexposed or overexposed images.
Synchronized Multi-Camera Support – It can connect up to 8 cameras to the NVIDIA Jetson AGX Orin platform using the GMSL2 interface.
Designed for Automotive Standards – It withstands harsh environmental conditions – protecting against dust, water, high pressure, high temperature, vibration and shock.
GMSL Link Monitoring – It ensures the safety and reliability of data transmission over the GMSL, preventing system failures, and enabling timely diagnostics for enhanced security in applications.
Availability
If you are interested in evaluating STURDeCAM31, please visit the online web store and purchase the product.
First Commercial iSIM with Remote SIM Provisioning: G+D and Sony Semiconductor Israel are proud to announce the first-ever commercial iSIM solution that supports remote SIM provisioning, a landmark that is set to make IoT connectivity more seamless and cost-effective.
Optimized Efficiency & Security: The iSIM-enabled ALT1350 chipset by Sony incorporates G+D’s secure SIM operating system in a tamper-resistant element, providing unparalleled security features and operational efficiency.
Flexible Network Selection & Global Scaling: This pioneering iSIM technology enables high flexibility in choosing cellular networks and simplifies the global scaling of deployments, addressing the varying needs of IoT devices across diverse sectors.
The integrated SIM (iSIM) is an important evolutionary step in SIM technology, empowering simple and cost-efficient connection, deployment, and go-to-market for Internet of Things (IoT) devices. Giesecke+Devrient (G+D) is playing a key role in shaping this development and, together with Sony Semiconductor Israel (Sony), is launching the first commercial iSIM solution that supports remote SIM provisioning.
The iSIM, or integrated Universal Integrated Circuit Card (iUICC), has the potential to revolutionize IoT and makes devices more flexible and efficient. It is cost-optimized, smaller, more adaptable, and sustainable than previous generations of SIMs and will complement established solutions such as the pluggable SIM and eSIM. As the world’s first providers, G+D and Sony are now taking iSIM development a step further by introducing a secure solution that is specifically designed for remote SIM provisioning (RSP), enabling seamless over-the-air activation and management of SIM profiles. This allows for high flexibility to choose the preferred cellular network throughout the long lifespan of an IoT device, while also offering the most cost-effective solution over its lifetime, according to a recent whitepaper from Transforma Insights. The capability to set profiles depending on the device’s location simplifies the global scaling of deployments. Additionally, RSP helps streamline production, storage, and logistics processes, to enhance operational efficiency.
The new solution is based on the iSIM-enabled ALT1350 chipset by Sony, which now supports standardized and future-proof RSP. G+D’s secure SIM operating system (OS) is stored in a tamper-resistant element (TRE) within a system-on-a-chip (SoC), unlike insertable SIM cards or soldered eSIMs. It acts as an isolated hardware component that is combined with a baseband chipset to form a single connectivity module.
The iSIM offers numerous advantages: Less hardware comes with a minimal footprint and enables the production of small, lightweight, and therefore cost-effective devices, and the optimized energy consumption increases device efficiency. High security is provided by the isolated hardware in combination with G+D’s secure and certified SIM OS. Production and warehousing processes can be optimized because there is no need to solder different hardware components or plug SIM cards into the device. Finally, iSIMs also support higher sustainability requirements, with the absence of slots, additional housings, or plastic.
Due to its low power consumption and small size, the iSIM is an ideal choice for battery-constrained IoT devices operating in low-power wide-area networks (LPWANs) through Narrowband IoT (NB-IoT) or Long Term Evolution for Machines (LTE-M) technologies. Wearables are also among the potential areas of application. Typical use cases can be found in market segments such as smart metering, agtech, smart health, tracking and tracing or the entire spectrum of massive IoT.
With the AirOn360® central SIM management solution, G+D provides a comprehensive service for over-the-air administration of iSIMs. It supports both remote SIM provisioning of network operator-specific data and update management. The solution complies with GSMA RSP specifications for consumer, M2M, and IoT applications and helps Original Equipment Manufacturers (OEMs) or device owners manage the iSIM lifecycle efficiently and securely. RSP in accordance with the new GSMA SGP.32 standard for M2M/IoT use cases empowers IoT device operators with maximum flexibility in their choice of mobile network operators. This allows them to choose the optimal provider in terms of cost, service quality or network coverage, for example.
“As market leader in eSIM, G+D has been investing in the research and development of iSIM technology for a long time. Together with industry partners, we want to accelerate SIM innovation. A good example for this is our cooperation with Sony, under which we are now announcing the industry’s first commercial iSIM with remote SIM provisioning. This pioneering achievement empowers our customers to unlock the full potential of the IoT with flexible and cost-optimized connectivity. We are convinced that this will be another important milestone in the iSIM evolution,” explains Bernd Müller, Head of Technology and Strategy in the connectivity & IoT business at G+D.
“This solution marks another joint success between Sony and G+D. The iSIM is poised to reshape the future of IoT in which everything is connected,” added Dima Feldman, VP Product Management & Marketing at Sony Semiconductor Israel. “Our ALT1350 baseband chipset combined with G+D’s SIM operating system and management solution, has led to a powerful, simple, and secure IoT connectivity management system that will drive the market forward.”
About Giesecke+Devrient
Giesecke+Devrient (G+D) is a global security technology group headquartered in Munich. As a trusted partner to customers with the highest demands, G+D secures the essential values of the world with its solutions. The company develops technology with passion and precision in four major playing fields: payment, connectivity, identities and digital infrastructures.
G+D was founded in 1852. In the fiscal year 2022, the company generated with more than 12,600 employees a turnover of 2.53 billion euros. G+D is represented by 103 subsidiaries and joint ventures in 33 countries. Further information: www.gi-de.com
The Raspberry Pi 5 is the newest version of everyone’s favorite tiny and affordable quad-core computer that can fit in your pocket and has the power and performance of a desktop PC.
Raspberry Pi 5 builds on the phenomenal success of Raspberry Pi 4. Featuring a 64-bit quad-core Arm Cortex-A76 processor running at 2.4GHz, Raspberry Pi 5 delivers a 2–3× increase in CPU performance relative to Raspberry Pi 4. Alongside a substantial uplift in graphics performance from an 800MHz VideoCore VII GPU. Other enhancements include improvements to the camera, display, and USB interfacing (Aggregate USB bandwidth is more than doubled). The Raspberry Pi 5 delivers a smoother desktop experience and performance that opens the door to new applications for industrial customers.
These interfacing improvements are delivered by the RP1 I/O controller chip, designed in-house at Raspberry Pi. For the first time, there is Raspberry Pi silicon on a flagship product! The Raspberry Pi 5 is a quad-core computer that can drive 2 x 4k monitors, LPDDR4X-4267 SDRAM, Gigabit Ethernet, with PoE+ support, USB3.0, wireless LAN, Bluetooth 5.0, and more! It has all of the specs and the raw performance normally found on desktop PCs. The Raspberry Pi 5 is currently available in both 4BG & 8GB versions. For the first time, the Pi now features its own onboard on/off switch.
BCM2712 Processor
BCM2712 is a new 16-nanometer application processor (AP) from Broadcom, derived from the 28-nanometer BCM2711 AP which powers Raspberry Pi 4, with numerous architectural enhancements. At its heart is a quad-core 64-bit Arm Cortex-A76 processor, clocked at 2.4GHz, with 512KB per-core L2 caches, and a 2MB shared L3 cache. Cortex-A76 is three microarchitectural generations beyond Cortex-A72, and offers both more instructions per clock (IPC) and lower energy per instruction. The combination of a newer core, a higher clock speed, and a smaller process geometry yields a much faster Raspberry Pi, and one that consumes much less power for a given workload.
BCM2712
Key features include:
2.4GHz quad-core 64-bit Arm Cortex-A76 CPU
VideoCore VII GPU, supporting OpenGL ES 3.1, Vulkan 1.2
Dual 4Kp60 HDMI® display output
4Kp60 HEVC decoder
Dual-band 802.11ac Wi-Fi®
Bluetooth 5.0 / Bluetooth Low Energy (BLE)
High-speed microSD card interface with SDR104 mode support
2 × USB 3.0 ports, supporting simultaneous 5Gbps operation
2 × USB 2.0 ports
Gigabit Ethernet, with PoE+ support (requires separate PoE+ HAT, coming soon)
2 × 4-lane MIPI camera/display transceivers
PCIe 2.0 x1 interface for fast peripherals
Raspberry Pi standard 40-pin GPIO header
Real-time clock
Power button
Features:
The Raspberry Pi 5 is the latest model of everyone’s favorite single-board computer.
Pi 5 sees significant upgrades and speed increases (2-3x in CPU performance) over its predecessor, the Raspberry Pi 4 Model B. A full feature comparison can be found here.
The board is available in both 4GB and 8GB versions.
A pocket-sized, dual-display, desktop computer, robot brain, smart home hub, media center, networked AI core, factory controller, NAS, and much more.
It offers performance that rivals entry-level PCs at a fraction of the cost.
Drop it straight into your old projects, it’s the same general size and shape as its predecessors and it features the same backward-compatible GPIO interface as its predecessors.
The fanless, energy-efficient Raspberry Pi runs silently and uses far less power than other computers.
It offers the perfect platform for learning/teaching; coding, Linux, IoT systems, streaming media, playing games, automated domestic and industrial applications, or your complete desktop solution and much much more.
It is the first time the flagship product has features Raspberry Pi silicon, the RP1 I/O controller chip has been designed in-house at Raspberry Pi HQ.
Raspberry Pi 5 builds on the phenomenal success of Raspberry Pi 4. In comparison with its predecessor, it delivers a 2-3x increase in CPU performance, and a significant uplift in GPU performance, alongside improvements to camera, display, and USB interfacing.
Each board will include a marking on the upper side of the PCB to identify what memory density is fitted to a specific board.
All boards now carry a unique serial number on the PCB.
Raspberry Pi 5 will remain in production until at least January 2035.
The Raspberry Pi 5 tech specs are;
CPU: 2.4GHz quad-core, 64-bit Arm Cortex-A76, with 512KB L2 cache and a 2MB shared L3 cache.
GPU: 800MHz VideoCore VII GPU supporting OpenGL ES 3.1, Vulkan 1.2.
RAM: LPDDR4X-4267 SDRAM (4GB or 8GB).
WiFi: Dual band 2.4 GHz and 5.0 GHz 802.11ac Wi-Fi.
Bluetooth: Bluetooth 5.0 / Bluetooth Low Energy (BLE).
Storage: Micro SD card slot, with support for high-speed SDR104 mode.
USB 3.0: 2 x USB 3.0 ports, supporting simultaneous 5Gbps operation.
USB 2.0: 2 x USB 3.0 ports.
Ethernet: Gigabit Ethernet, with PoE+ support (requires PoE+ HAT).
HDMI: 2 x micro-HDMI® ports (up to 4kp60 supported) HEVC decoder and HDR support.
PCle: PCIe 2.0 x1 interface for fast peripherals (requires separate M.2 HAT or other adapter).
Power: 5V/5A DC power via USB-C, with Power Delivery support.
GPIO: Raspberry Pi standard 40-pin header (Backwards compatible).
RTC: Real-Time Clock (RTC), powered by an external battery.
On/Off Switch: On-board power button!!
The Pi 5 is fitted with a new 2.4GHz quad-core, 64-bit Arm Cortex-A76, with 512KB L2 cache and a 2MB shared L3 cache. This provides a 2-3x speed increase over the previous model. The impressive array of technical specifications enables the Raspberry Pi 5 to become a powerful desktop solution, capable of handling your daily computing needs. It doesn’t just stop at the desktop, it also has all of the power needed for other computing applications such; as a web server, media server, NAS, console emulator, and more.
The new Pi offers the perfect coding environment for all ability levels and there are plenty of guides online for any project you can imagine. The onboard connectivity; Wi-Fi, USB2.0/3.0, Gigabit Ethernet, and Bluetooth give you all of the networking options you could possibly want. The 40-pin GPIO connectors mean that you can expand the board via HATs and connect a whole array of extra devices. The twin 4k display option means that you can have everything open at once without any tab/window dancing.
The Raspberry Pi 5 is 100% ready for education, it offers the perfect platform for learning and teaching; coding, Linux, IoT systems, streaming media, playing games, automated domestic and industrial applications, a complete desktop solution, and much much more.
New System-on-Modules Based on Renesas RZ Family with Dual Cortex®-A55/M33 CPU Provide High Performance for Industrial Video Applications
ARIES Embedded, a specialist in embedded services and products, presents the new SMARC®-compliant system-on-modules (SoM) MRZG2LS and MRZV2LS. The SoMs are based on the Renesas RZ family architecture and provide high performance for embedded systems. The RZ/G2L microprocessor from Renesas includes a Dual Cortex®-A55 (1.2 GHz) CPU, 16-bit DDR3L/DDR4 interface, 3D graphics engine with Arm Mali-G31 and video codec (H.264). “While the MRZG2LS SoM integrates the single/dual Cortex®-A55/Cortex®-M33, the MRZV2LS is equipped with a Cortex®-A55 (1.2GHz) CPU and built-in AI accelerator ‘DRP-AI’ for vision applications, which is Renesas’ original technology,” explained Andreas Widder, Managing Director of ARIES Embedded. “Our new SoMs are ideal for applications such as entry-class industrial human-machine interfaces (HMIs), embedded vision, edge artificial intelligence (edge-AI), real-time control, industrial ethernet connectivity, and embedded devices with video capabilities.”
With the MRZG2LS and MRZV2LS, ARIES Embedded provides their first SoMs compliant with the SMARC® 2.1 (Smart Mobility Architecture) standard by SGET (Standardization Group for Embedded Technologies e. V.). This standard defines a versatile small form factor computer module targeting applications that require low power, low costs, and high performance.
Artificial Intelligence Acceleration
The AI accelerator “DRP-AI” from Renesas is configured with DRP and AI-MAC. DRP-AI’s excellent power efficiency eliminates the need for heat dissipation measures such as heat sinks or cooling fans. AI can be implemented cost efficiently, not only in consumer electronics and industrial equipment but also in a wide range of applications such as point-of-sale (POS) terminals for retail. Also, the DRP-AI provides both real-time AI inference and image processing functions with the capabilities essential for camera support, such as color correction and noise reduction. This enables customers to implement AI-based vision applications without requiring an external image signal processor (ISP).
High-Performance Embedded Systems
The new SoMs MRZG2LS and MRZV2LS offer a manifold feature set around the single or dual Cortex-A55, up to 1 GHz, and the Cortex-M33. In addition to the optional AI accelerator (DRP-AI on MRZV2L), they have a 3D graphics engine (Arm Mali-G31) and video codec (H.264). The memory options are comprised of 512 MB – 4 GB DDR4 RAM, SPI NOR, and 4 GB – 64 GB eMMC NAND Flash. The SoMs are very flexible and versatile thanks to their broad variety of interfaces, including dual 10/100/1000MBit Ethernet with PHY, USB2.0 Host/OTG, 2x CAN, UART, I2C, SPI, ADC, as well as a MIPI-CSI camera interface and a MIPI-DSI display interface. The temperature range is 0 °C to +70 °C for commercial and -40 °C to +85 °C for industrial environments.
Evaluation Kit for Prompt Project Entry
ARIES Embedded supports a quick and smooth start-up into the new architecture with the corresponding evaluation kits MRZG2LSEVK and MRZV2LSEVK. Thanks to their high functionalities, they support developers for a quick project entry, help to develop software and can also be used as platforms for rapid prototyping. The baseboard supports both MRZG2LS and MRZV2LS.
The MRZG2LS and MRZV2LS SoMs will be available in the fourth quarter of 2023.
The art of wine appreciation and the joy of opening a bottle have long been intertwined with using a corkscrew. Over the years, advancements in technology have revolutionized this process, bringing about the advent of electric corkscrews. These innovative devices, powered by a motor, have streamlined the wine-opening experience, making it effortless, efficient, and enjoyable for wine enthusiasts and professionals alike. This article guides how to use the Renesas’ SLG47105 HVPAK so as to implement an electric corkscrew. However, you may download our free GreenPAK Designer software to open the .gp file and view the proposed circuit design. Use the GreenPAK development tools to freeze the design into your own customized IC in a matter of minutes.
Brushed DC motors are used to implement the design. The motor driver plays a crucial role in them, providing the necessary torque, speed, and control required to perform the delicate task of removing the cork from the bottle.
The Renesas’ SLG47105 HVPAK combines mixed-signal logic and high-drive H-/Half-Bridges and proves to be an ideal choice for implementing the functionality of an electric corkscrew. Figure 2 illustrates a general schematic of the device based on the HVPAK.
Figure 2. General Schematic of Electric Corkscrew Based on the SLG47105 HVPAK
GreenPAK Design
Figure 3 shows an internal design of the electric corkscrew in the GreenPAK Designer software.
Figure 3. Electric Corkscrew GreenPAK Designer Schematic
The main role in driving the motor is performed by high-drive pins 7, 8, 9, and 10 along with their corresponding control macrocells HV OUT Ctrl0 and HV Out Ctrl1. To increase the current rating, users have the option to connect the outputs in parallel, which was implemented in the corkscrew circuit.
Because the corkscrew needs to rotate in both directions, the macrocells HV OUT Ctrl0 and HV Out Ctrl1 are configured in Full-Bridge mode. By supplying a HIGH level signal from the POR (Power-On Reset) to the Decay inputs of HV OUT Ctrl0 and HV Out Ctrl1, a Slow decay mode is activated. This mode allows for a gradual reduction in an inductive current, resulting in a quick halt of the motor’s movement.
Current Regulation
In this design, a current control was used. The current control circuit is provided to regulate the system in the event of an overcurrent condition, such as an abnormal mechanical load on a DC motor. The current is sensed by an external sense resistor connected to the SENSE_A and SENSE_B pins. The resistor value is calculated using the formula:
The current sense comparator (CCMP0) is used to convert the sense resistor current into a logic level, thus limiting the output current. In this case, Rsense was chosen to be equal to 0.11 Ω, Vref was set to 998 mV, and the gain was set to 4, resulting in a limiting current of 2.2 A. This current comparator signal is utilized by the PWM Chopper to chop the PWM duty cycle. By using the current comparator with the PWM block, the output current can be dynamically adjusted. The operational principle of the PWM chopper is illustrated in Figure 4.
Figure 4. PWM Chopper Circuit Block Diagram
A delay allows us to ignore the Current Comparator signal during the Blanking time, which occurs during the motor start period. Any active signal from the Current CMP after the Blanking time causes the PWM Duty Cycle to be chopped to the end of the current period. Figure 5 demonstrates the PWM chopping process in the electric corkscrew.
Figure 5. PWM Chopper Working Waveform
Voltage Regulation
Because the device is powered by a lithium-ion battery, the PWM voltage regulation is useful for this design. It allows us to maintain a constant motor speed with a changeable power supply level. When the VDD is decreasing (the battery discharging), it becomes possible to increase the PWM duty cycle.
For the voltage regulation, the Differential Amplifier with Integrator and Analog Comparator macrocell is used. This macrocell monitors the voltage difference between HV_GPO0_HD and HV_GPO1_HD pins of the Full Bridge and integrates it to get an average voltage value. If the average output voltage is lower than Vref, the duty cycle of the PWM output needs to increase; if the average output value is higher than Vref, the duty cycle needs to decrease; when the average output value is equal to the comparator threshold, the PWM duty cycle is kept by EQUAL output. Figure 6, Figure 7, and Figure 8 show the voltage regulation process in the electric corkscrew.
Figure 6. PWM Chopper OUT at VDD = 4.2 V (Duty Cycle = 76 %).Figure 7. PWM Chopper OUT at VDD = 3.7 V (Duty Cycle = 86 %)Figure 8. PWM Chopper OUT at VDD = 3.3 V (Duty Cycle = 97 %)
The integrator reference voltage was set to 864 mV, resulting in a threshold of 3.456 V. This threshold value guarantees a constant voltage of 3 V across the motor winding, regardless of the battery voltage.
Motor Control Logic
When the user presses the “Uncork” button, a short LOW level pulse is generated at the output of Pin 16. To eliminate switch bouncing, a Delay macrocell DLY2 is used. In sleep mode, the output of the 3-bit LUT9 remains LOW. However, when any of the following events occurs: the “Uncork” button is pressed, the cork activates the microswitch, or the timer is triggered – the output transitions to a HIGH level. On the rising edge of this pulse, DFF8 changes its state to the opposite, resulting in a LOW level output. Subsequently, the output of the 4-bit LUT1 goes HIGH. This signal is fed to the Edge Detector macrocell that works as both edges delayed inverter. It activates the HV OUT control blocks and auxiliary macrocells, bringing them out of sleep mode and initiating the clockwise rotation of the motor. The 4 ms DLY3 is necessary to ensure that the comparators are powered up before the 3-bit LUT9 output signal reaches the CLK input of the DFF8.
Additionally, the rising edge of the signal from the output of 4-bit LUT1 is delayed by DLY0 for 30 seconds. If the corkscrew is not turned off within 30 seconds, this delayed rising edge signal reaches the input of the 3-bit LUT9, causing its output to go HIGH. This change in state forces DFF8 to switch its state, and the output of the 4-bit LUT1 goes LOW, resulting in the motor ceasing its operation. A similar sequence of events occurs when the cork is unscrewed to a sufficient extent to activate the microswitch (signaling the end of uncorking), which connects Pin 3 to GND. The 30-second timer function ensures that the motor shuts off and the corkscrew enters sleep mode for both the uncorking and cork removal modes. This shutdown function enables power conservation and prevents overheating.
When the user presses the “Remove Cork” button, DFF7 changes its state to the opposite, resulting in a LOW level output. Subsequently, the output of the 4-bit LUT1 goes HIGH, initiating the motor’s counterclockwise rotation. Similarly, to eliminate this switch bouncing, a Delay macrocell DLY1 is used. Furthermore, to eliminate microswitch bouncing, a Pipe Delay is employed.
P DLY macrocell that works as a delayed rising edge detector, paired with DFF0, is designed to detect which button was pressed. The signal from the output of DFF0 is fed to the PH inputs of the HV OUT Control blocks, determining the direction of motor rotation based on the button pressed. Specifically, if the output of DFF0 is LOW, the motor rotates clockwise, and if it is HIGH, the motor rotates counterclockwise.
Depending on which button is pressed and if the corkscrew is in working mode, the 2-bit LUT2 and 2-bit LUT3 generate a HIGH level signal for one of the LEDs. The red LED illuminates when the output of the 2-bit LUT2 is HIGH (indicating the active uncorking mode), while the blue LED lights up when the output of the 2-bit LUT3 is HIGH (indicating the active cork removal mode).
Additionally, the corkscrew can be turned off by pressing either of two buttons while it is in working mode.
The 3-bit LUT0 enables DFF7 and DFF8 only if the following conditions are met: no charger is connected, the battery voltage is above 3 V, and the POR output signal is HIGH. The ACMP1 measures the battery level, while paneACMP0 detects the presence of a connected charger.
To ensure low energy consumption in sleep mode, the Differential Amplifier with Integrator and Analog Comparator macrocell, along with analog comparators ACMP0H and ACMP1H, are designed to exit sleep mode upon pressing any button. The signals from these buttons first pass through the 2-bit LUT1, which outputs a pulse for any change in its inputs. The DFF9 changes its state in response to this pulse. Subsequently, the signal is inverted and supplied to the power inputs of the comparators and the amplifier.
The 3-bit LUT3 enables the operation of HV OUT Control blocks if signals FAULT A and FAULT B are LOW (indicating no fault events).
Conclusion
This article explores the utilization of the SLG47105 HVPAK in a corkscrew implementation. This HVPAK is a versatile device that offers a wide range of mixed-signal functionalities combined with high-voltage capabilities, all packed into a compact and thermally efficient integrated circuit. With its abundance of digital and analog blocks, it can replace multiple ICs required for the corkscrew’s operation, including the motor driver, logic components, and a voltage monitor. Additionally, it provides features such as voltage and current control, along with advanced protection mechanisms against abnormal situations. The device is cost-effective and energy-efficient, making it an excellent choice.
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