ICECool – An Intra-Chip Cooling System That Is More Efficient

https://www.electronics-lab.com/icecool-intra-chip-cooling-system-efficient/

In the Moore’s Law race to keep improving computer performance, the IT industry has turned upward, stacking chips like nano-sized 3D skyscrapers. But those stacks have their limits, due to overheating. Researchers from IBM have solved this problem by developing an intra-chip cooling system as a contribution to ICECool program research project by the DARPA (Defense Advanced Research Projects […]