3D Image Sensor REAL3 for Face Authentication announced at CES 2020
https://www.electronics-lab.com/3d-image-sensor-real3-face-authentication-announced-ces-2020/
Infineon Technologies AG has collaborated with software and 3D Time-of-Flight (ToF) system specialist pmdtechnologies ag to develop reportedly the world’s smallest, most powerful 3D image sensor. Designated the REAL3, the single-chip solution measures just 4.4 x 5.1 mm and is the fifth generation of time-of-flight deep sensors from Infineon. The sensor can be incorporated into […]
REAL3™ Time-of-Flight image sensor: fourth generation with HVGA resolution
https://www.electronics-lab.com/real3-time-flight-image-sensor-fourth-generation-hvga-resolution/
Infineon Technologies AG is presenting the fourth generation of its REAL3™ image sensor IRS2771C at Mobile World Congress 2019 in Barcelona, Spain. The 3D Time-of-Flight (ToF) single chip is especially designed to meet the requirements of the mobile consumer device market and, in particular, demand for higher resolutions with small lenses. The wide range of […]