Congatec Introduces Five New Intel Core Ultra Series 3 Processor-Based COMs
The new COMs come in four form factors, with the ruggedized conga-TC1000r COM Express Compact module delivering up to 180 TOPS for high-performance applications in harsh environments.
Congatec announced the availability of five new Computer-on-Module (COM) devices supporting Intel Core Ultra Series 3 processors, spanning four form factors from COM Express Mini to COM-HPC Client. The modules integrate Intel’s heterogeneous core architecture with dedicated AI acceleration hardware, targeting embedded AI deployments without requiring discrete accelerator cards.
The conga-TC1000r: A Rugged COM Express Module
The conga-TC1000r module represents Congatec’s ruggedized solution in the COM Express Type 6 Compact form factor. This COM distinguishes itself through screw-locked LPCAMM2 memory modules, providing enhanced vibration resistance for applications in transportation, industrial automation, and military systems. The mechanical retention mechanism ensures memory module integrity under sustained mechanical stress and thermal cycling.
Congatec’s new conga-TC1000r COM Express Type 6 Compact Intel Core Ultra Series 3-based module. Image used courtesy of Congatec
The conga-TC1000r supports Intel Core Ultra processors with up to 16 cores, arranged in a hybrid architecture: four performance cores, eight efficiency cores, and four low-power efficiency cores. The module’s memory capacity extends to 96 GB using LPDDR5X modules operating at 8533 MT/s, with optional in-band ECC on selected SKUs. The module provides up to 12 PCIe Gen4 lanes on the highest-performance processor variants, scaling down to four lanes on efficiency-oriented models.
The COM’s graphics capabilities include Intel Arc B390 on the top-tier Intel Core Ultra X9 388H variant with 12 Xe cores, or Intel Graphics with 4 Xe cores on other processor options. The integrated NPU5 delivers 50 TOPS of AI inference performance, contributing to a total platform performance of 180 TOPS when combined with CPU and GPU compute resources.
The 95 x 95 mm module includes dual 2.5 GbE controllers via Intel i226 with TSN support and IEEE 1588 precision time protocol. Display outputs support up to four independent displays at 8K resolution through three DDI interfaces and LVDS or eDP connections. Operating temperature spans 0°C to 60°C for commercial variants.
Congatec’s five new COM platforms are based on the Intel Core Ultra Series 3 processors. Video used courtesy of Congatec
Platform Features and Software Support
The conga-TC1000r incorporates congatec’s board controller, which provides module management, multistage watchdog functionality, board statistics, power-loss control, and hardware health monitoring. Additionally, POST code redirection assists during system integration and debugging.
BIOS features include AMI Aptio UEFI firmware with OEM logo support, CMOS default customization, LCD control, display auto-detection, and backlight control. Security provisions include TPM 2.0 hardware. Power input accepts a wide range of 8.5 V to 20 V with ACPI 6.0 power management support.
Five New Edge AI COMs
Congatec’s broader COM portfolio addresses varying application requirements. The conga-MC1000 in COM Express Type 10 Mini provides a credit-card-sized form factor for space-constrained designs that require a technology refresh of existing systems. The standard conga-TC1000 COM Express Compact module targets cost-sensitive applications with soldered memory rather than the socketed LPCAMM2 approach.
Congatec’s five new COMs come in four different form factors. Image used courtesy of Congatec
For applications requiring maximum I/O bandwidth, congatec offers two COM-HPC modules. The conga-HPC/mPTL in the COM-HPC Mini form factor and conga-HPC/cPTL in the COM-HPC Client Size A both support PCIe Gen5 and USB4 interfaces. These modules enable higher data throughput for applications such as machine vision, data acquisition, and edge computing with multiple high-speed peripherals.
All modules support identical processor options, allowing designers to select form factors based on I/O requirements, thermal constraints, and board space rather than processor performance differences. Software compatibility across the family simplifies development and enables the use of common firmware images.
Applications and Availability
All five modules support a variety of operating systems, including Microsoft Windows 11, Windows 11 IoT Enterprise, Ubuntu Pro, ctrlX OS, KontronOS, Linux, and Yocto. Modules are available as aReady.COM configurations with pre-installed and licensed operating systems, including ctrlX OS and Ubuntu Pro. The aReady.VT option adds a hypervisor-on-module for workload consolidation, supporting real-time control, HMI, AI inference, and IoT gateway functions on a single platform.
The new COMs target industrial automation, robotics, smart infrastructure, transportation systems, medical equipment, and retail point-of-sale deployments. Applications include local NLP processing, LLM execution, image classification, sensor fusion, and SLAM implementations. The combination of high compute density, integrated AI acceleration, and ruggedization options enables deployment on factory floors, in vehicles, in outdoor installations, and in other challenging environments where discrete accelerator cards are impractical due to space, power, or reliability constraints.
