Congatec Introduces Rugged COM Express Compact Module for Edge Applications
The new conga-TCRP1 COM Express 3.1 Type 6 Compact modules are built on the AMD Ryzen AI Embedded P100 processor series and offer a -40 to 85°C industrial-grade temperature range.
Congatec has released the conga-TCRP1, a COM Express 3.1 Type 6 Compact module built around AMD’s Ryzen AI Embedded P100 series processors.
The module targets transportation systems, medical devices, smart cities, gaming applications, point-of-sale terminals, robotics, and industrial automation, where AI processing, environmental resilience, and scalable performance requirements intersect. The module’s configurable TDP range and temperature variants allow designers to implement a single module design across applications with different power and environmental specifications.
Congatec’s conga-TCRP1 modules, built on the AMD Ryzen AI Embedded P100 series processors. Image used courtesy of Congatec
Processor Architecture and AI Performance
The conga-TCRP1 module uses AMD Ryzen AI Embedded P100 series processors available in four- and six-core configurations. The processors combine AMD Zen5 performance cores with Zen5c efficiency cores, both based on the same underlying architecture. This architectural consistency provides predictable execution timing for deterministic applications, which can be relevant for real-time control systems.
The module delivers up to 59 TOPS of combined AI inference performance distributed across three processing elements. The integrated XDNA2 NPU contributes up to 50 TOPS, with the remaining performance provided by the Zen5 CPU cores and the RDNA3.5 GPU. According to Congatec, this configuration enables local processing of larger language models without requiring cloud connectivity or discrete accelerators.
The RDNA3.5 GPU supports up to four independent display outputs with 4K resolution. Graphics processing is handled by either two or four compute units, depending on the selected processor variant.
Thermal Design and Environmental Specifications
The conga-TCRP1 supports configurable TDP settings from 15 W to 54 W, allowing designers to balance performance against thermal constraints. The 15 W minimum TDP enables passively cooled designs in fully enclosed systems. Industrial temperature variants operate from -40 to 85°C, while commercial variants are rated for 0 to 60°C operation.
Congatec offers matching thermal solutions, including active cooling with integrated heat pipes and 12 V fans, passive heat pipe-based coolers, and heat spreaders. The cooling solutions are available with either 2.7 mm bore holes or M2.5 threaded standoffs for different mounting requirements.
Top (left) and bottom (right) view of the conga-TCRP1 module. Image used courtesy of Congatec
Memory and Storage Configuration
Congatec’s module supports up to 96 GB of DDR5-5600 RAM through dual SODIMM sockets, accommodating up to 48 GB. ECC memory is available as an option for applications requiring error correction. Memory configurations include both commercial- and industrial-temperature-rated modules.
For storage, the conga-TCRP1 provides either up to 512 MB of onboard NVMe SSD or two SATA 6 Gb/s interfaces for external storage media. The SATA interfaces become unavailable when the NVMe option is implemented.
Interface and Connectivity Features
The conga-TCRP1 module provides eight fully configurable PCIe Gen4 lanes plus PEG x4 Gen4 for expansion and peripheral connectivity. Network connectivity is handled by Intel i226-series controllers, which offer 2.5 GbE capability. USB connectivity includes four USB 3.2 Gen2 ports and four USB 2.0 ports.
Additional I/O includes one I²C bus, GPSPI, two UART ports, eight GPIO lines, one SMBus, and one LPC interface. The module incorporates a Congatec Board Controller that provides watchdog functionality, non-volatile user data storage, power-loss protection, and hardware health monitoring.
The conga-TCRP1 supports multiple operating systems, including Windows 11, Windows 11 IoT Enterprise, various Linux distributions, ctrlX OS, Ubuntu Pro, and Kontron OS. Congatec offers the module as part of its aReady.COM platform with pre-configured, licensed operating systems. An aReady.VT option with an integrated hypervisor-on-module enables workload consolidation for applications that require concurrent real-time control, HMI, AI processing, and IoT gateway functions.
