Quectel FGH200M Wi-Fi HaLow Module Supports Long-Range IoT Connectivity
https://www.electronics-lab.com/quectel-fgh200m-wi-fi-halow-module-supports-long-range-iot-connectivity/
Designed for sub-GHz 802.11ah connectivity, the compact module enables long-distance communication, low power operation, and support for thousands of IoT devices.
Congatec Announces Edge Computing Modules and Full-Custom Design Service
https://www.electronics-lab.com/congatec-announces-edge-computing-modules-and-full-custom-design-service/
At Embedded World 2026, Congatec unveiled new variants of its conga-TCRP1 COM Express module, launched the new conga-HPC/cBLS COM-HPC module, and debuted a custom design service, aReady.YOURS.
STMicroelectronics Introduces Entry-Level MCU Series for Smart Devices
https://www.electronics-lab.com/stmicroelectronics-introduces-entry-level-mcu-series-for-smart-devices/
The new STM32C5 series microcontrollers are powered by an Arm Cortex-M33 embedded processor and STMicroelectronics’ 40 nm node, bringing performance to a range of cost-sensitive designs.
Congatec Introduces Rugged COM Express Compact Module for Edge Applications
https://www.electronics-lab.com/congatec-introduces-rugged-com-express-compact-module-for-edge-applications/
The new conga-TCRP1 COM Express 3.1 Type 6 Compact modules are built on the AMD Ryzen AI Embedded P100 processor series and offer a -40 to 85°C industrial-grade temperature range.
Innodisk Teams Up With Qualcomm, Develops COM-HPC Mini Module
https://www.electronics-lab.com/innodisk-teams-up-with-qualcomm-develops-com-hpc-mini-module/
The new EXMP-Q911 COM-HPC Mini module integrates Qualcomm's Dragonwing IQ-9075 processor, delivering 100 TOPS AI performance with wide-temperature operation for industrial edge applications.
ASRock Industrial DSC-NV003-WT Jetson AGX Orin devkit with up to 12 PoE ports, PCIe Gen4 x8 slots
https://www.electronics-lab.com/asrock-industrial-dsc-nv003-wt-jetson-agx-orin-devkit-with-up-to-12-poe-ports-pcie-gen4-x8-slots/
ASRock's DSC-NV003-WT is a rugged NVIDIA Jetson AGX Orin devkit with 275 TOPS NPU for edge AI, robotics, drones, and smart city applications.
Ebyte ECB30 Industrial SBC Features Dual-core Cortex-A7 SoC, MIPI DSI Display, and Multiple Interfaces
https://www.electronics-lab.com/ebyte-ecb30-industrial-sbc-features-dual-core-cortex-a7-soc-mipi-dsi-display-and-multiple-interfaces/
The Ebyte ECB30-P4T13IA5ME8G-I is a compact, credit card-sized industrial SBC powered by the Allwinner T113-i SoC. It combines a dual-core Arm Cortex-A7 CPU with a 64-bit RISC-V real-time core and is designed for rugged applications requiring wide temperature support from -40°C to 85°C. The board features 512MB DDR3 RAM, 8GB eMMC storage, and a microSD […]