TOPST D3-G SBC With Telechips TCC8050 And Quad DisplayPort
https://www.electronics-lab.com/news/topst-d3-g-sbc-with-telechips-tcc8050-and-quad-displayport/
Automotive-grade SBC featuring a 9-core TCC8050 SoC, up to 8GB LPDDR4X, PowerVR GPU, quad-display DP 1.4 MST, dual MIPI-CSI, PCIe Gen3 x1, and triple CAN bus support.
8devices Maca 2 Long-Range Wireless Radio Reaches 80 km
https://www.electronics-lab.com/news/8devices-maca-2-long-range-wireless-radio-reaches-80-km/
High-power 2×2 MIMO radio with 39 dBm output, 2152–2852 MHz coverage, Linux OS, and dual Ethernet, built for drones, UAS, industrial IoT, and defense links.
SolidRun’s Fanless Industrial PCs Feature AMD Ryzen AI 300 Mobile AI SoC
https://www.electronics-lab.com/news/solidruns-fanless-industrial-pcs-feature-amd-ryzen-ai-300-mobile-ai-soc/
SolidRun has expanded its modular IPC lineup with the Bedrock RAI300, powered by AMD Ryzen AI 300 processors, targeting edge AI inference with higher NPU performance and fanless cooling.
Avalue ECM-ASL3 3.5-Inch SBC Supports Intel Alder Lake-N and Amston Lake SoCs
https://www.electronics-lab.com/news/avalue-ecm-asl3-3-5-inch-sbc-supports-intel-alder-lake-n-and-amston-lake-socs/
This rugged 3.5-inch SBC features Intel N97/i3-N305 processors, triple M.2 expansion, 2.5GbE LAN, and 9-36V input for edge AI applications.
ASUS UGen300 Βrings Hailo-10H Εdge AI Αcceleration Οver USB-C
https://www.electronics-lab.com/news/asus-ugen300-%ce%b2rings-hailo-10h-%ce%b5dge-ai-%ce%b1cceleration-%ce%bfver-usb-c/
The ASUS UGen300 is a USB AI accelerator with Hailo-10H, 40 TOPS performance, and 8GB memory, enabling plug-and-play edge inference on Linux, Windows, and Android systems.
Quectel i.MX 9 Industrial AIoT Modules Remove RF Complexity for Matter Gateways
https://www.electronics-lab.com/news/quectel-i-mx-9-industrial-aiot-modules-remove-rf-complexity-for-matter-gateways/
Quectel’s new i.MX 9 AIoT modules integrate Wi-Fi 6, Bluetooth 5.4, and 802.15.4 to simplify Matter border routers and industrial edge designs.
CES 2026: Intel Panther Lake-H Powers Vecow TGS-2000 Stackable Edge AI PCs
https://www.electronics-lab.com/news/ces-2026-intel-panther-lake-h-powers-vecow-tgs-2000-stackable-edge-ai-pcs/
Vecow’s compact TGS-2000 series uses Intel Core Ultra Series 3 Panther Lake-H CPUs to deliver up to 100 TOPS AI performance for industrial edge applications.
Toradex Luna Is a “Pro Consumer” Edge AI SBC with Synaptics SL1680 SoC
https://www.electronics-lab.com/news/toradex-luna-is-a-pro-consumer-edge-ai-sbc-with-synaptics-sl1680-soc/
Toradex Luna SL1680 is a pro-consumer SBC with a quad-core Cortex-A73 SoC, 7.9 TOPS NPU, Pi-like I/O, and Torizon Linux for Edge AI applications.
Luxonis OAK 4 AI Vision Camera Brings 52 TOPS Edge AI Performance
https://www.electronics-lab.com/news/luxonis-oak-4-ai-vision-camera-brings-52-tops-edge-ai-performance/
The OAK 4 series integrates on-device AI, depth sensing, and rugged IP67 hardware, enabling real-time computer vision without cloud or external host systems.
VEGA AS2161 DHRUV64: India’s Indigenous RISC-V Dual-Core Microprocessor
https://www.electronics-lab.com/news/vega-as2161-dhruv64-indias-indigenous-risc-v-dual-core-microprocessor/
C-DAC’s VEGA AS2161 DHRUV64 is a 64-bit dual-core RISC-V processor with Linux support, advanced MMU, and debug features, strengthening India’s self-reliant chip ecosystem.