Kioxia & Western Digital develop 162-layer 3D-NAND
https://www.electronics-lab.com/kioxia-western-digital-develop-162-layer-3d-nand/
Kioxia Corporation and Western Digital Corp., today announced that the companies have developed their sixth-generation, 162-layer 3D flash memory technology. Marking the next milestone in the companies’ 20-year joint-venture partnership, this is the companies’ highest density and most advanced 3D flash memory technology to date, utilizing a wide range of technology and manufacturing innovations. “Through […]
KIOXIA unveils fifth-generation BiCS FLASH
https://www.electronics-lab.com/kioxia-unveils-fifth-generation-bics-flash/
New generation 3D flash memory adds layers, boosts capacity, broader bandwidth and provides new design flexibility KIOXIA Europe GmbH, the world leader in memory solutions, today announced that it has successfully developed its fifth-generation BiCS FLASH three-dimensional (3D) flash memory with a 112-layer vertically stacked structure. KIOXIA plans to start shipping samples of the new […]
96-layer BiCS FLASH prototype from Toshiba uses QLC technology
https://www.electronics-lab.com/96-layer-bics-flash-prototype-from-toshiba-uses-qlc-technology/
Toshiba Memory Europe has developed a prototype sample of a 96-layer BiCS FLASH, memory device using its proprietary 3D flash quad level cell (QLC) technology, claimed to boost single-chip memory capacity to the highest level yet achieved. QLC technology increases the bit count for data per memory cell from three to four, “significantly expanding capacity” […]