Google Coral – An i.MX8M dev board with Edge TPU AI chip
https://www.electronics-lab.com/google-coral-mx8m-dev-board-edge-tpu-ai-chip/
Single board computers are not a new wonder anymore and the market has already experienced so many different devices based on numerous SoC and SOM. So, why should we be excited this time about the launch of a $150 “Coral Dev Board”? Well, there are multiple reasons – but the most important one is, the […]
Latest TySOM Kit Accelerates the Development of AI
https://www.electronics-lab.com/latest-tysom-kit-accelerates-development-ai/
Aldec’s TySOM-3A-ZU19EG embedded system development board, showcased at Embedded World 2019, supports the early co-development and co-verification of hardware and software. Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has launched the TySOM-3A-ZU19EG, to assist in the development of AI, Deep-learning Neural Network (DNN) and other […]
Gyrfalcon Launches Second-Gen AI Accelerator Chip
https://www.electronics-lab.com/gyrfalcon-launches-second-gen-ai-accelerator-chip/
Lightspeeur 2803 – a follow on to the Lightspeeur 2801S ASIC – enables upgrading of existing data center hardware to speed AI processing while providing 10X reduction in energy consumption. Gyrfalcon Technology Inc. (GTI), the world’s leading developer of low-cost, low-power, high-performance Artificial Intelligence (AI) processors, today announced the availability of its second-generation chip, the […]
MMC3630KJ – Magnetic sensor in BGA package
https://www.electronics-lab.com/mmc3630kj-magnetic-sensor-in-bga-package/
MEMSIC has announced the MMC3630KJ magnetometer that integrates a monolithic 3-axis AMR (anisotropic magnetoresistive) sensor and a signal conditioning ASIC into a 1.2 × 1.2 × 0.5-mm BGA package. According to MEMSIC, devices in the series offer the ability to deliver a magnetic sensitivity in a range of ±30 Gauss and achieve a noise level that is […]