New Advanced Graphite Embedding Capability for PCB Thermal Management
https://www.electronics-lab.com/new-advanced-graphite-embedding-capability-for-pcb-thermal-management/
New innovation provides weight savings for applications where size, weight and power (SWaP) are key Teledyne Labtech announces a major new capability allowing the embedding of layers of synthetic graphite within RF and microwave printed circuit boards (PCBs). Heat management is a significant concern in many aerospace, defense and space applications where size, weight and […]
Bürklin Elektronik offers premium miniature fan units from Fischer Elektronik
https://www.electronics-lab.com/burklin-elektronik-offers-premium-miniature-fan-units-from-fischer-elektronik/
Leading international distributor Bürklin Elektronik offers a premier range of miniature fan units to meet the increasing demands of small, high-performance electronic components. The LAM K series from Fischer Elektronik comprises miniature fan units to dissipate large amounts of heat in small spaces. Electronic assemblies are becoming increasingly compact. Combined with high-performance components and high […]
Pod Bay 3’s PiRyte Brings ATX Power and Active Cooling to the Raspberry Pi Family
https://www.electronics-lab.com/pod-bay-3s-piryte-brings-atx-power-active-cooling-raspberry-pi-family/
Overheating and the resulting drop in performance and throughput has been one of the major drawbacks associated with using the Raspberry Pi. Several solutions have been developed to provide active or passive cooling solutions for it. One of the most recent solutions is the third generation of the PiRyte developed by Pod Bay 3. The PiRyte […]
Imec Invented Unique Cost-effective Cooling For High-Performance Chips
https://www.electronics-lab.com/imec-invented-unique-cost-effective-cooling-for-high-performance-chips/
Imec, the distinguished Belgian research center has invented a new and cost-effective method of cooling chips. This achievement can be an important innovation to tackle the ever-increasing cooling demands of high-performance 3D chips and systems. Present powerful electronic systems have high cooling demands for integrated semiconductor chips. Conventional solutions operate with various passive (or occasionally active) […]
ICECool – An Intra-Chip Cooling System That Is More Efficient
https://www.electronics-lab.com/icecool-intra-chip-cooling-system-efficient/
In the Moore’s Law race to keep improving computer performance, the IT industry has turned upward, stacking chips like nano-sized 3D skyscrapers. But those stacks have their limits, due to overheating. Researchers from IBM have solved this problem by developing an intra-chip cooling system as a contribution to ICECool program research project by the DARPA (Defense Advanced Research Projects […]
Researchers Developed New Efficient, Thin, and Flexible Cooling Device
https://www.electronics-lab.com/researchers-developed-new-efficient-thin-flexible-cooling-device/
Engineers and scientists from the UCLA Henry Samueli School of Engineering and Applied Science and SRI International, California, have created a thin flexible device that could keep smartphones and laptop computers cool and prevent overheating. The component is based on the electrocaloric effect – a phenomenon where the temperature of material changes when an electric field is applied to it. The […]
Hot rods keep the die cool
https://www.electronics-lab.com/hot-rods-keep-die-cool/
Clemens Valens @ elektormagazine.com shows us a new IC Package that keeps the IC cool. Texas Instruments’ HotRod QFN is a thermally enhanced plastic package with solder lands on all sides as well as power buses for enhanced current carrying capability. Inside the package the die is mounted on a copper lead frame which eliminates the […]