Clemens Valens @ elektormagazine.com shows us a new IC Package that keeps the IC cool.
Texas Instruments’ HotRod QFN is a thermally enhanced plastic package with solder lands on all sides as well as power buses for enhanced current carrying capability. Inside the package the die is mounted on a copper lead frame which eliminates the power wire bonds, improving electrical and thermal performance. This technique also improves application efficiency and minimizes package parasitic radiation.
Mike is the founder and editor of Electronics-Lab.com, an electronics engineering community/news and project sharing platform. He studied Electronics and Physics and enjoys everything that has moving electrons and fun. His interests lying on solar cells, microcontrollers and switchmode power supplies. Feel free to reach him for feedback, random tips or just to say hello :-)
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