Würth Elektronik Launches Heat Sink Portfolio for Power Electronics and ICs

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https://www.electronics-lab.com/wurth-elektronik-launches-heat-sink-portfolio-for-power-electronics-and-ics/

The new heat sinks target THT-TO packages and flat-surface ICs, with pre-coated thermal interface material variants available from stock.

Imec Invented Unique Cost-effective Cooling For High-Performance Chips

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https://www.electronics-lab.com/imec-invented-unique-cost-effective-cooling-for-high-performance-chips/

Imec, the distinguished Belgian research center has invented a new and cost-effective method of cooling chips. This achievement can be an important innovation to tackle the ever-increasing cooling demands of high-performance 3D chips and systems. Present powerful electronic systems have high cooling demands for integrated semiconductor chips. Conventional solutions operate with various passive (or occasionally active) […]