ICECool – An Intra-Chip Cooling System That Is More Efficient

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https://www.electronics-lab.com/icecool-intra-chip-cooling-system-efficient/

In the Moore’s Law race to keep improving computer performance, the IT industry has turned upward, stacking chips like nano-sized 3D skyscrapers. But those stacks have their limits, due to overheating. Researchers from IBM have solved this problem by developing an intra-chip cooling system as a contribution to ICECool program research project by the DARPA (Defense Advanced Research Projects […]

A 5nm GAAFET Chip By IBM, Samsung & GlobalFoundries

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https://www.electronics-lab.com/5nm-gaafet-chip-ibm-samsung-globalfoundries/

In less than two years since making a 7nm test node chip with 20 billion transistors, scientists have paved the way for 30 billion switches on a fingernail-sized chip. IBM with its Research Alliance partners, GlobalFoundries and Samsung, have unveiled their industry-first process that will enable production of 5nm chips. The new 5nm technology is one of the […]