Innodisk Teams Up With Qualcomm, Develops COM-HPC Mini Module

https://www.electronics-lab.com/innodisk-teams-up-with-qualcomm-develops-com-hpc-mini-module/

The new EXMP-Q911 COM-HPC Mini module integrates Qualcomm's Dragonwing IQ-9075 processor, delivering 100 TOPS AI performance with wide-temperature operation for industrial edge applications.