Qualcomm Dragonwing Development Kit Offers 24 TOPS Edge AI

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https://www.electronics-lab.com/qualcomm-dragonwing-development-kit-offers-24-tops-edge-ai/

Thundercomm’s Qualcomm Dragonwing Development Kit features the Q-7790 SoC, 24 TOPS AI performance, Android/Linux support, and rich I/O for edge AI deployments.

Thundercomm unveils TurboX C6690 SoM at embedded world 2025

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https://www.electronics-lab.com/thundercomm-unveils-turbox-c6690-som-at-embedded-world-2025/

Thundercomm, established in 2016 as a joint venture between Thundersoft and Qualcomm, specializes in advanced technologies such as AI, IoT, 5G, and cloud computing. The company recently introduced its latest system-on-module, the TurboX C6690. The compact module is built on the Qualcomm Dragonwing QCS6690 chip, which is manufactured using advanced 4nm process technology designed to […]