TOPST D3-G SBC With Telechips TCC8050 And Quad DisplayPort

TOPST D3-G SBC

A Telechips TCT8050 “Dolphin3/3M” 9-core automotive-grade SoC with four Cortex-A72 cores, four Cortex-A53 cores, and one real-time Cortex-R5 core powers the TOPST D3-G single board computer (SBC). D3-G can combine a variety of sensors including motion, ultrasound, infrared, LiDAR, motor drive, vehicle communication transceiver, microphone, and communication module. 

4GB or 8GB LPDDR4 RAM, 32GB eMMC flash, a microSD card for storage, a gigabit Ethernet port, a DisplayPort 1.2 connector that can drive four displays through MST, two MIPI CSI connectors, a PCIe Gen3x 1 slot, a few USB ports, a 40-pin GPIO header capable of functioning with Raspberry Pi HAT+, and three CAN Bus interfaces are among the components accommodated on the board. With microprocessors, memory, and input/output (I/O) terminals, the D3-G is an incredibly compact and low-power computer. 

TOPST D3-G SBC Top and Bottom Side

TOPST D3-G SBC Specifications:

• Processor (SoC):
  • Telechips TCC8050 (Dolphin3/3M) automotive SoC
  • Heterogeneous CPU architecture delivering ~45,180 DMIPS:
    • Quad-core Arm Cortex-A72 up to 1.69 GHz (~31,840 DMIPS)
    • Quad-core Arm Cortex-A53 up to 1.45 GHz (~13,340 DMIPS)
  • Integrated real-time MCU: Arm Cortex-R5 @ 600 MHz
• Graphics:
  • Imagination Technologies PowerVR 9XTP (GT9524) GPU
  • Up to 168 GFLOPS compute performance
  • Supported graphics/compute APIs: OpenGL ES 1.1/2.0/3.2, Vulkan 1.2, OpenCL 2.0/3.0
• Memory: 4 GB or 8 GB 32-bit LPDDR4X running at 2133 MHz
• Storage:
  • On-board 32 GB eMMC flash
  • MicroSD card expansion slot
• Display / Video Output:
  • DisplayPort 1.4 interface (4-lane, 8.1 Gbps per lane)
  • Multi-Stream Transport (MST) support for up to four displays:
    • 1× 4K @ 60 Hz + 3× 1080p @ 60 Hz, or
    • 4× 1080p @ 60 Hz
  • Daisy-chain capability for up to three 1080p @ 60 Hz displays
• Camera Interfaces:
  • 2× 15-pin MIPI-CSI (2-lane) connectors
  • Supports camera modules up to 5 MP resolution
• Networking: 10/100/1000 MbE Gigabit Ethernet via RJ45
• USB Connectivity:
  • 1× USB 3.0 Type-A (host)
  • 1× USB 2.0 Type-A (host)
  • 1× USB 2.0 Type-C (device)
• Vehicle Interfaces: 10-pin header providing 3× CAN bus channels
• Expansion:
  • PCIe 3.0 ×1 slot
  • 40-pin multifunction GPIO header exposing I²C, SPI, UART, I²S, PWM, and GPIO
  • Compatible with most Raspberry Pi HAT expansion boards
• Debug / Development:
  • 10-pin Cortex-Debug JTAG connector
  • 3-pin UART debug header
• Power Supply: 5 V DC input @ 5 A via barrel jack
• Mechanical: Board dimensions: 120 mm × 90 mm

TOPST D3-G SBC Specifications

Telechips offers a Linux SDK with Yocto Project 4.0 Kirkstone, and Ubuntu 22.04 rootfs is supported. The development environment needs a Windows (WSL2) and Linux computer with at least 60 GB of free storage space and 16 GB of RAM. The con is that the SDK is based on Linux 5.10 LTS, which was released in 2020, and support will end in December 2026. Resources for development and connecting the board to different sensors and actuators are available on the documentation website.  

TOPST D3-G SBC Block Diagram

The TOPST D3-G SBC is available for purchase, but only in South Korea, and if we choose “Global,” we get the message “Sales for this region are not yet available.” The 4GB RAM model sells for 161,000 Wons (~$110 US) and the 8GB RAM variant for 189,000 Wons (~$129 US). Additional information is available on the product page. 

Images used courtesy of Topst